HARRIS CD4051BF

CD4051B, CD4052B, CD4053B
Semiconductor
August 1998
CMOS Analog Multiplexers/Demultiplexers
with Logic Level Conversion
The CD4051B, CD4052B, and CD4053B analog multiplexers
are digitally-controlled analog switches having low ON
impedance and very low OFF leakage current. Control of
analog signals up to 20VP-P can be achieved by digital
signal amplitudes of 4.5V to 20V (if VDD -VSS = 3V, a
VDD -VEE of up to 13V can be controlled; for VDD -VDD
level differences above 13V, a VDD -VDD of at least 4.5V is
required). For example, if VDD = +4.5V, VDD = 0V, and
VDD = -13.5V, analog signals from -13.5V to +4.5V can be
controlled by digital inputs of 0V to 5V. These multiplexer
circuits dissipate extremely low quiescent power over the
full VDD -VDD and VDD -VDD supply-voltage ranges,
independent of the logic state of the control signals. When
a logic “1” is present at the inhibit input terminal, all
channels are off.
File Number 902.2
Features
• Wide Range of Digital and Analog Signal Levels
- Digital . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 20V
- Analog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤20VP-P
• Low ON Resistance, 125Ω (Typ) Over 15VP-P Signal Input
Range for VDD -VEE = 18V
• High OFF Resistance, Channel Leakage of ±100pA (Typ)
at VDD -VEE = 18V
• Logic-Level Conversion for Digital Addressing Signals of
3V to 20V (VDD -VSS = 3V to 20V) to Switch Analog
Signals to 20VP-P (VDD -VEE = 20V)
• Matched Switch Characteristics, rON = 5Ω (Typ) for
VDD -VEE = 15V
• Very Low Quiescent Power Dissipation Under All DigitalControl Input and Supply Conditions, 0.2µW (Typ) at
VDD -VSS = VDD -VEE = 10V
The CD4051B is a single 8-Channel multiplexer having three
binary control inputs, A, B, and C, and an inhibit input. The
three binary signals select 1 of 8 channels to be turned on,
and connect one of the 8 inputs to the output.
• Binary Address Decoding on Chip
The CD4052B is a differential 4-Channel multiplexer having
two binary control inputs, A and B, and an inhibit input. The
two binary input signals select 1 of 4 pairs of channels to be
turned on and connect the analog inputs to the outputs.
• Maximum Input Current of 1µA at 18V Over Full Package
Temperature Range, 100nA at 18V and 25oC
The CD4053B is a triple 2-Channel multiplexer having three
separate digital control inputs, A, B, and C, and an inhibit
input. Each control input selects one of a pair of channels
which are connected in a single-pole, double-throw
configuration.
When these devices are used as demultiplexers, the
“CHANNEL IN/OUT” terminals are the outputs and the
“COMMON OUT/IN” terminals are the inputs.
• 5V, 10V and 15V Parametric Ratings
• 10% Tested for Quiescent Current at 20V
• Break-Before-Make Switching Eliminates Channel
Overlap
Applications
• Analog and Digital Multiplexing and Demultiplexing
• A/D and D/A Conversion
• Signal Gating
Ordering Information
PART NUMBER
TEMP.
RANGE (oC)
PACKAGE
PKG.
NO.
CD4051BF, CD4052BF,
CD4053BF
-55 to 125
16 Ld CERDIP F16.3
CD4051BE, CD4052BE,
CD4053BE
-55 to 125
16 Ld PDIP
E16.3
CD4051BM, CD4052BM,
CD4053BM
-55 to 125
16 Ld SOIC
M16.15
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Copyright © Harris Corporation 1998
CD4051B, CD4052B, CD4053B
Pinouts
CD4051B (PDIP, CERDIP, SOIC)
TOP VIEW
4 1
16 VDD
6 2
15 2
COM OUT/IN 3
14 1
7 4
13 0
CHANNELS
IN/OUT
CD4052B (PDIP, CERDIP)
TOP VIEW
0 1
16 VDD
2 2
15 2
COMMON “Y” OUT/IN 3
14 1
Y CHANNELS
IN/OUT
X CHANNELS
IN/OUT
CHANNELS IN/OUT
CHANNELS
IN/OUT
Y CHANNELS
IN/OUT
3 4
13 COMMON “X” OUT/IN
5 5
12 3
1 5
12 0
INH 6
11 A
INH 6
11 3
VEE 7
10 B
VEE 7
10 A
VSS 8
9 C
VSS 8
9 B
X CHANNELS
IN/OUT
CD4053B (PDIP, CERDIP)
TOP VIEW
IN/OUT
by 1
16 VDD
bx 2
15 OUT/IN bx OR by
cy 3
14 OUT/IN ax OR ay
OUT/IN CX OR CY 4
13 ay
IN/OUT CX 5
12 ax
INH 6
11 A
VEE 7
10 B
VSS 8
9 C
IN/OUT
Functional Block Diagrams
CD4051B
CHANNEL IN/OUT
16 VDD
7
6
5
4
3
2
1
0
4
2
5
1
12
15
14
13
TG
TG
A
†
11
TG
B
†
10
LOGIC
LEVEL
CONVERSION
C
†
9
INH
†
6
BINARY
TO
1 OF 8
DECODER
WITH
INHIBIT
TG
3
TG
TG
TG
TG
8 VSS
2
7 VEE
COMMON
OUT/IN
CD4051B, CD4052B, CD4053B
Functional Block Diagrams
(Continued)
CD4052B
X CHANNELS IN/OUT
3
2
1
0
11
15
14
12
TG
16 VDD
A
†
10
B
†
9
INH
†
6
TG
BINARY
TO
1 OF 4
DECODER
WITH
INHIBIT
LOGIC
LEVEL
CONVERSION
TG
COMMON X
OUT/IN
TG
13
TG
TG
3
COMMON Y
OUT/IN
TG
TG
8 VSS
7
VEE
1
5
2
4
0
1
2
3
Y CHANNELS IN/OUT
CD4053B
LOGIC
LEVEL
CONVERSION
16 VDD
BINARY TO
1 OF 2
DECODERS
WITH
INHIBIT
IN/OUT
cy
cx
by
bx
ay
ax
5
1
12
15
14
13
TG
COMMON
OUT/IN
ax OR ay
14
A
†
11
TG
TG
COMMON
OUT/IN
bx OR by
15
B
C
†
†
10
TG
TG
9
4
TG
INH
†
COMMON
OUT/IN
cx OR cy
6
VDD
8
VSS
7
VEE
† All inputs protected by standard CMOS protection network
3
CD4051B, CD4052B, CD4053B
TRUTH TABLES
INPUT STATES
INHIBIT
C
B
A
“ON” CHANNEL(S)
0
0
0
0
0
0
0
0
1
1
0
0
1
0
2
0
0
1
1
3
0
1
0
0
4
0
1
0
1
5
0
1
1
0
6
0
1
1
1
7
1
X
X
X
None
CD4051B
CD4052B
INHIBIT
B
A
0
0
0
0x, 0y
0
0
1
1x, 1y
0
1
0
2x, 2y
0
1
1
3x, 3y
1
X
X
None
CD4053B
INHIBIT
A OR B OR C
0
0
ax or bx or cx
0
1
ay or by or cy
1
X
None
X = Don’t Care
4
CD4051B, CD4052B, CD4053B
Absolute Maximum Ratings
Thermal Information
Supply Voltage (V+ to V-)
Voltages Referenced to VSS Terminal . . . . . . . . . . . -0.5V to 20V
DC Input Voltage Range . . . . . . . . . . . . . . . . . . -0.5V to VDD +0.5V
DC Input Current, Any One Input. . . . . . . . . . . . . . . . . . . . . . ±10mA
Thermal Resistance (Typical, Note 1)
θJA (oC/W) θJC (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . .
90
N/A
CERDIP Package. . . . . . . . . . . . . . . . .
115
45
SOIC Package . . . . . . . . . . . . . . . . . . .
115
N/A
Maximum Junction Temperature (Ceramic Package) . . . . . . . . .175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .265oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Common Conditions Here: If Whole Table is For the Full Temp. Range, VSUPPLY = ±5V, AV = +1,
RL = 100Ω, Unless Otherwise Specified (Note 3)
Electrical Specifications
LIMITS AT INDICATED TEMPERATURES (oC)
CONDITIONS
25
PARAMETER
VIS (V)
VEE (V)
VSS (V)
VDD (V)
-55
-40
85
125
MIN
TYP
MAX
UNITS
SIGNAL INPUTS (VIS) AND OUTPUTS (VOS)
-
-
-
5
5
5
150
150
-
0.04
5
µA
-
-
-
10
10
10
300
300
-
0.04
10
µA
-
-
-
15
20
20
600
600
-
0.04
20
µA
-
-
-
20
100
100
3000
3000
-
0.08
100
µA
-
0
0
5
800
850
1200
1300
-
470
1050
Ω
-
0
0
10
310
330
520
550
-
180
400
Ω
-
0
0
15
200
210
300
320
-
125
240
Ω
Change in ON
Resistance (Between
Any Two Channels),
∆rON
-
0
0
5
-
-
-
-
-
15
-
Ω
-
0
0
10
-
-
-
-
-
10
-
Ω
-
0
0
15
-
-
-
-
-
5
-
Ω
OFF Channel Leakage
Current: Any Channel
OFF (Max) or ALL
Channels OFF (Common
OUT/IN) (Max)
-
0
0
18
-
±0.01
±100
(Note 2)
µA
Capacitance:
-
-5
5-
5
Quiescent Device
Current, IDD Max
Drain to Source ON
Resistance rON Max
0 ≤ VIS ≤ VDD
Input, CIS
±100 (Note 2)
±1000 (Note 2)
-
-
-
-
-
5
-
pF
CD4051
-
-
-
-
-
30
-
pF
CD4052
-
-
-
-
-
18
-
pF
CD4053
-
-
-
-
-
9
-
pF
-
-
-
-
-
0.2
-
pF
5
-
-
-
-
-
30
60
ns
10
-
-
-
-
-
15
30
ns
15
-
-
-
-
-
10
20
ns
Output, COS
Feedthrough
CIOS
Propagation Delay Time
(Signal Input to Output
VDD
5
RL = 200kΩ,
CL = 50pF,
tr , tf = 20ns
CD4051B, CD4052B, CD4053B
Common Conditions Here: If Whole Table is For the Full Temp. Range, VSUPPLY = ±5V, AV = +1,
RL = 100Ω, Unless Otherwise Specified (Continued) (Note 3)
Electrical Specifications
LIMITS AT INDICATED TEMPERATURES (oC)
CONDITIONS
25
PARAMETER
VIS (V)
VEE (V)
VSS (V)
VDD (V)
-55
-40
85
125
MIN
TYP
MAX
UNITS
5
1.5
1.5
1.5
1.5
-
-
1.5
V
10
3
3
3
3
-
-
3
V
15
4
4
4
4
-
-
4
V
5
3.5
3.5
3.5
3.5
3.5
-
-
V
10
7
7
7
7
7
-
-
V
15
11
11
11
11
11
-
-
V
±0.1
µA
CONTROL (ADDRESS OR INHIBIT), VC
Input Low Voltage, VIL ,
Max
VIL = VDD
through
1kΩ;
VIH = VDD
through
Input High Voltage, VIH , 1kΩ
Min
Input Current, IIN (Max)
VEE = VSS ,
RL = 1kΩ to VSS ,
IIS < 2µA on All
OFF Channels
VIN = 0, 18
18
±0.1
±0.1
±1
±1
-
±10-5
Propagation Delay Time:
Address-to-Signal
tr , tf = 20ns,
OUT (Channels ON or CL = 50pF,
OFF) See Figures 10, RL = 10kΩ
11, 14
0
0
5
-
-
-
-
-
450
720
ns
0
0
10
-
-
-
-
-
160
320
ns
0
0
15
-
-
-
-
-
120
240
ns
-5
0
5
-
-
-
-
-
225
450
ns
0
0
5
-
-
-
-
-
400
720
ns
0
0
10
-
-
-
-
-
160
320
ns
0
0
15
-
-
-
-
-
120
240
ns
-10
0
5
-
-
-
-
-
200
400
ns
0
0
5
-
-
-
-
-
200
450
ns
0
0
10
-
-
-
-
-
90
210
ns
0
0
15
-
-
-
-
-
70
160
ns
-10
0
5
-
-
-
-
-
130
300
ns
-
-
-
-
-
5
7.5
pF
Propagation Delay Time:
Inhibit-to-Signal OUT tr , tf = 20ns,
(Channel Turning ON) CL = 50pF,
See Figure 11
RL = 1kΩ
Propagation Delay Time:
Inhibit-to-Signal OUT
(Channel Turning
OFF) See Figure 15
tr , tf = 20ns,
CL = 50pF,
RL = 10kΩ
Input Capacitance, CIN
(Any Address or Inhibit
Input)
NOTE:
2. Determined by minimum feasible leakage measurement for automatic testing.
Electrical Specifications
TEST CONDITIONS
PARAMETER
VIS (V)
VDD (V)
RL (kΩ)
Cutoff (-3dB) Frequency Channel ON (Sine Wave Input)
5 (Note 3)
10
1
VOS at Common OUT/IN
VEE = VSS ,
V OS
20Log ------------ = – 3dB
V IS
6
VOS at Any Channel
LIMITS
TYP
UNITS
CD4053
30
MHz
CD4052
25
MHz
CD4051
20
MHz
60
MHz
CD4051B, CD4052B, CD4053B
Electrical Specifications
TEST CONDITIONS
LIMITS
PARAMETER
VIS (V)
VDD (V)
RL (kΩ)
TYP
UNITS
Total Harmonic Distortion, THD
2 (Note 3)
5
10
0.3
%
3 (Note 3)
10
0.2
%
5 (Note 3)
15
0.12
%
VEE = VSS, fIS = 1kHz Sine Wave
-40dB Feedthrough Frequency
(All Channels OFF)
5 (Note 3)
10
1
VOS at Common OUT/IN
CD4053
8
MHz
CD4052
10
MHz
CD4051
12
MHz
VOS at Any Channel
8
MHz
Between Any 2 Channels
3
MHz
Between Sections,
CD4052 Only
Measured on Common
6
MHz
Measured on Any Channel
10
MHz
Between Any Two
Sections, CD4053
Only
In Pin 2, Out Pin 14
2.5
MHz
In Pin 15, Out Pin 14
6
MHz
10
(Note 4)
65
mVPEAK
VEE = 0, VSS = 0, tr , tf = 20ns, VCC
= VDD - VSS (Square Wave)
65
mVPEAK
VEE = VSS ,
V OS
20Log ------------ = – 40dB
V IS
-40dB Signal Crosstalk
Frequency
%
5 (Note 3)
10
1
VEE = VSS ,
V OS
20Log ------------ = – 40dB
V IS
Address-or-Inhibit-to-Signal
Crosstalk
-
10
NOTES:
V DD – V EE
----------------------------2
3. Peak-to-Peak voltage symmetrical about
4. Both ends of channel.
Typical Performance Curves
300
VDD - VEE = 10V
VDD - VEE = 5V
rON , CHANNEL ON RESISTANCE (Ω)
rON , CHANNEL ON RESISTANCE (Ω)
600
500
400
TA = 125oC
300
TA = 25oC
200
TA = -55oC
100
0
-4
-3
-2
-1
0
1
2
3
4
VIS , INPUT SIGNAL VOLTAGE (V)
FIGURE 1. CHANNEL ON RESISTANCE vs INPUT SIGNAL
VOLTAGE (ALL TYPES)
7
5
250
TA = 125oC
200
150
TA = 25oC
100
TA = -55oC
50
0
-10
-7.5
-5
-2.5
0
2.5
5
VIS , INPUT SIGNAL VOLTAGE (V)
7.5
FIGURE 2. CHANNEL ON RESISTANCE vs INPUT SIGNAL
VOLTAGE (ALL TYPES)
10
CD4051B, CD4052B, CD4053B
Typical Performance Curves
(Continued)
600
250
rON , CHANNEL ON RESISTANCE (Ω)
rON , CHANNEL ON RESISTANCE (Ω)
TA = 25oC
VDD - VEE = 5V
500
400
300
200
10V
15V
100
0
-10
-7.5
-5
-2.5
0
2.5
5
7.5
VDD - VEE = 15V
200
TA = 125oC
150
TA = 25oC
100
TA = -55oC
50
0
-10
10
-7.5
-5
FIGURE 3. CHANNEL ON RESISTANCE vs INPUT SIGNAL
VOLTAGE (ALL TYPES)
PD , POWER DISSIPATION PACKAGE (µW)
100Ω
-2
-4
-2
0
2
4
VIS , INPUT SIGNAL VOLTAGE (V)
TA = 25oC
ALTERNATING “O”
AND “I” PATTERN
CL = 50pF
f
VDD = 15V
103
VDD = 10V
102
VDD = 5V
CL = 15pF
10
1
10
TEST CIRCUIT
VDD
CD4029
VDD B/D
A B
100Ω
10 9
1
3 CL
13
5
12
2
4 CD4052 14
15
6
11
7
8
Ι
102
103
104
SWITCHING FREQUENCY (kHz)
105
FIGURE 7. DYNAMIC POWER DISSIPATION vs SWITCHING
FREQUENCY (CD4052B)
8
VDD = 5V
10
B/D
CD4029
A B C
VDD
100Ω 11 10 9
13
14
15
12 CD4051
1
5
3
2
48 7 6 C
L
100Ω
Ι
CL = 15pF
1
100Ω
PD , POWER DISSIPATION PACKAGE (µW)
VDD = 10V
10
6
FIGURE 5. ON CHARACTERISTICS FOR 1 OF 8 CHANNELS
(CD4051B)
104
7.5
f
VDD = 15V
102
-4
10
102
103
104
SWITCHING FREQUENCY (kHz)
105
FIGURE 6. DYNAMIC POWER DISSIPATION vs SWITCHING
FREQUENCY (CD4051B)
PD , POWER DISSIPATION PACKAGE (µW)
VOS , OUTPUT SIGNAL VOLTAGE (V)
1kΩ
500Ω
103
-6
5
TEST CIRCUIT
VDD
TA = 25oC
ALTERNATING “O”
AND “I” PATTERN
CL = 50pF
104
RL = 100kΩ, RL = 10kΩ
0
105
2.5
105
VDD = 5V
VSS = 0V
VEE = -5V
TA = 25oC
2
-6
0
FIGURE 4. CHANNEL ON RESISTANCE vs INPUT SIGNAL
VOLTAGE (ALL TYPES)
6
4
-2.5
VIS , INPUT SIGNAL VOLTAGE (V)
VIS , INPUT SIGNAL VOLTAGE (V)
105
TA = 25oC
ALTERNATING “O”
AND “I” PATTERN
CL = 50pF
104
103
VDD = 5V
102
CL = 15pF
VDD = 15V
VDD = 10V
TEST CIRCUIT
VDD f
9
4
CL
100Ω
3
12
5
13
100Ω
CD4053 2
10
1
15
11
14
6
7
8
Ι
10
1
10
102
103
104
SWITCHING FREQUENCY (kHz)
105
FIGURE 8. DYNAMIC POWER DISSIPATION vs SWITCHING
FREQUENCY (CD4053B)
CD4051B, CD4052B, CD4053B
Test Circuits and Waveforms
VDD = 15V
VDD = 7.5V
VDD = 5V
VDD = 5V
5V
7.5V
16
5V
16
16
16
VSS = 0V
VSS = 0V
VSS = 0V
VEE = 0V
7
8
VEE = -7.5V
7
8
VEE = -10V
7
8
7
8
VEE = -5V
VSS = 0V
(D)
(C)
(B)
(A)
NOTE: The ADDRESS (digital-control inputs) and INHIBIT logic levels
are: “0” = VSS and “1” = VDD. The analog signal (through the TG) may
swing from VEE to VDD.
FIGURE 9. TYPICAL BIAS VOLTAGES
tr = 20ns
tr = 20ns
tf = 20ns
90%
50%
90%
50%
10%
tf = 20ns
90%
50%
90%
50%
10%
10%
10%
TURN-ON TIME
90%
50%
90%
10%
10%
10%
TURN-OFF TIME
TURN-OFF TIME
FIGURE 10. WAVEFORMS, CHANNEL BEING TURNED ON
(RL = 1kΩ)
FIGURE 11. WAVEFORMS, CHANNEL BEING TURNED OFF
(RL = 1kΩ)
VDD
VDD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CD4051
IDD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CD4052
VDD
IDD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CD4053
FIGURE 12. OFF CHANNEL LEAKAGE CURRENT - ANY CHANNEL OFF
9
TURN-ON
TIME
tPHZ
IDD
CD4051B, CD4052B, CD4053B
Test Circuits and Waveforms (Continued)
VDD
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
IDD
VDD
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
IDD
VDD
1
2
3
4
5
6
7
8
CD4052
CD4051
16
15
14
13
12
11
10
9
IDD
CD4053
FIGURE 13. OFF CHANNEL LEAKAGE CURRENT - ALL CHANNELS OFF
VDD
1
2
3
4
5
6
7
8
VDD
VEE
VSS
16
15
14
13
12
11
10
9
OUTPUT
VDD
OUTPUT
OUTPUT
1
RL
CL
2
RL
CL
3
VDD
VEE
4
VDD
5
VEE
6
VEE
VSS CLOCK
7
IN
8
VSS
VSS
CD4051
16
15
14
13
12
11
10
9
VDD
VEE
VDD
VSS CLOCK
VSS
IN
VSS
CD4052
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CD4053
RL
CL
VEE
VDD
VSS CLOCK
IN
VSS
FIGURE 14. PROPAGATION DELAY - ADDRESS INPUT TO SIGNAL OUTPUT
VDD
OUTPUT
RL
1
2
3
4
5
6
7
8
50pF
VEE
VDD
VSS
VDD
CLOCK VEE
IN
VSS
16
15
14
13
12
11
10
9
VDD
OUTPUT
50pF
RL
VEE
VDD
VSS
VDD
CLOCK VEE
IN VSS
tPHL AND tPLH VSS
CD4051
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
OUTPUT
RL
50pF
VEE
VDD
VDD
VSS CLOCK VEE
IN VSS
V
tPHL AND tPLH SS
CD4052
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VDD
V
tPHL AND tPLH SS
CD4053
FIGURE 15. PROPAGATION DELAY - INHIBIT INPUT TO SIGNAL OUTPUT
VDD
VIH
1K
VIH
VIL
VDD
VDD
µA
1K
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VIH
VIL
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1K
1K
µA
VIH
1K
VIL
VIH
VIL
MEASURE < 2µA ON ALL
“OFF” CHANNELS (e.g., CHANNEL 6)
1K
µA
VIH
VIL
VIL
MEASURE < 2µA ON ALL
“OFF” CHANNELS (e.g., CHANNEL 2x)
MEASURE < 2µA ON ALL
“OFF” CHANNELS (e.g., CHANNEL by)
FIGURE 16. INPUT VOLTAGE TEST CIRCUITS (NOISE IMMUNITY)
10
16
15
14
13
12
11
10
9
CD4053B
CD4052B
CD4051B
1
2
3
4
5
6
7
8
CD4051B, CD4052B, CD4053B
Test Circuits and Waveforms (Continued)
VDD
VDD
1
2
3
4
5
6
7
8
Ι
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Ι
CD4051
CD4053
VDD
16
15
14
13
12
11
10
9
KEITHLEY
160 DIGITAL
MULTIMETER
TG
“ON”
10kΩ
X-Y
PLOTTER
FIGURE 18. CHANNEL ON RESISTANCE MEASUREMENT
CIRCUIT
VDD
1
2
3
4
5
6
7
8
VDD
Ι
VSS
CD4051
CD4053
VSS
X
H.P.
MOSELEY
7030A
CD4052
VDD
16
15
14
13
12
11
10
9
Y
VSS
FIGURE 17. QUIESCENT DEVICE CURRENT
1
2
3
4
5
6
7
8
1kΩ
RANGE
VSS
16
15
14
13
12
11
10
9
VDD
Ι
VSS
CD4052
NOTE: Measure inputs sequentially,
to both VDD and VSS connect all
unused inputs to either VDD or VSS .
NOTE: Measure inputs sequentially,
to both VDD and VSS connect all
unused inputs to either VDD or VSS .
FIGURE 19. INPUT CURRENT
5VP-P
CHANNEL
ON
5VP-P
OFF
CHANNEL
VDD
RF
VM
RL
1K
RL
RL
RL
FIGURE 20. FEEDTHROUGH (ALL TYPES)
FIGURE 21. CROSSTALK BETWEEN ANY TWO CHANNELS
(ALL TYPES)
CHANNEL IN Y
ON OR OFF
CHANNEL IN X
ON OR OFF
RL
RF
VM
RL
FIGURE 22. CROSSTALK BETWEEN DUALS OR TRIPLETS (CD4052B, CD4053B)
11
RF
VM
CHANNEL
ON
RF
VM
CHANNEL
OFF
6
7
8
5VP-P
COMMON
CHANNEL
OFF
CD4051B, CD4052B, CD4053B
Test Circuits and Waveforms (Continued)
DIFFERENTIAL
SIGNALS
CD4052
CD4052
COMMUNICATIONS
LINK
DIFF.
AMPLIFIER/
LINE DRIVER
DIFF.
MULTIPLEXING
DIFF.
RECEIVER
DEMULTIPLEXING
FIGURE 23. TYPICAL TIME-DIVISION APPLICATION OF THE CD4052B
Special Considerations
In applications where separate power sources are used to
drive VDD and the signal inputs, the VDD current capability
should exceed VDD/RL (RL = effective external load). This
provision avoids permanent current flow or clamp action on
the VDD supply when power is applied or removed from the
CD4051B, CD4052B or CD4053B.
A
B
CD4051B
C
INH
A
B
C
D
E
Q0
A
B
E
1/2
CD4556
A
B
CD4051B
C
INH
Q1
Q2
A
B
CD4051B
C
INH
FIGURE 24. 24-TO-1 MUX ADDRESSING
12
COMMON
OUTPUT
CD4051B, CD4052B, CD4053B
Dual-In-Line Plastic Packages (PDIP)
E16.3 (JEDEC MS-001-BB ISSUE D)
N
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AD
E
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8, 10
eA
C
0.008
0.014
C
D
0.735
0.775
18.66
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
13
MILLIMETERS
0.204
0.355
-
19.68
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
eA
0.300 BSC
eB
-
L
0.115
N
16
2.54 BSC
7.62 BSC
0.430
-
0.150
2.93
10.92
3.81
16
6
7
4
9
Rev. 0 12/93
CD4051B, CD4052B, CD4053B
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
F16.3 MIL-STD-1835 GDIP1-T16 (D-2, CONFIGURATION A)
LEAD FINISH
c1
16 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE
-D-
-A-
BASE
METAL
E
M
-Bbbb S
C A-B S
-C-
S1
0.200
-
5.08
-
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.840
-
21.34
5
E
0.220
0.310
5.59
7.87
5
eA
ccc M C A - B S
e
eA/2
c
aaa M C A - B S D S
D S
NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
14
NOTES
-
b2
b
MAX
0.014
α
A A
MIN
b
A
L
MAX
A
Q
SEATING
PLANE
MILLIMETERS
MIN
M
(b)
D
BASE
PLANE
SYMBOL
b1
SECTION A-A
D S
INCHES
(c)
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
6
S1
0.005
-
0.13
-
7
α
90o
105o
90o
105o
-
aaa
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2, 3
N
16
16
8
Rev. 0 4/94
CD4051B, CD4052B, CD4053B
Small Outline Plastic Packages (SOIC)
M16.15 (JEDEC MS-012-AC ISSUE C)
N
INDEX
AREA
H
0.25(0.010) M
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
B M
E
INCHES
-B-
1
2
SYMBOL
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
α
e
A1
B
0.25(0.010) M
0.10(0.004)
C A M
B S
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
15
MAX
MILLIMETERS
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
C
MIN
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
α
16
0o
16
8o
0o
7
8o
Rev. 0 12/93