LED SPECIFICATION 540MW7C Features Single color High bright output Low power consumption High reliability and long life Descriptions： Dice material：GaN Emitting Color： Super Bright White Device Outline： φ5mm Round Type/ 5mm Lens Type： 1. All dimensions are millimeters 2. Tolerance is +/-0.25mm unless otherwise noted Water Clear Directivity： 0° Relative Luminous Intensity 1.0 Ta=25° C IF=20mA 30° 60° 0.5 0 90° 60° 30° 0° 0.5 90° 1.0 Radiation Angle Page: 1 LED SPECIFICATION Absolute maximum ratings（Ta = 25℃） Parameter Symbol Reverse Voltage VR Forward Current Test Value Condition Unit Min. Max. IR = 30μA 5 -- V IF ---- ---- 30 mA Power Dissipation Pd ---- ---- 108 Pulse Current Ipeak Duty=0.1mS，1kHz ---- 100 mA Operating Temperature Topr ---- -20 +85 ℃ Storage Tstr ---- -25 +100 ℃ Temperature mW Electrical and optical characteristics （Ta = 25℃） Test Condition Value Parameter Symbol Forward Voltage VF IF = 20mA Reverse Current IR VR = 5V Dominate Wavelength λd IF = 20mA WA~ WD Luminous Intensity IV IF = 20mA W,X Viewing Angle 2θ1/2 IF = 20mA Min. Typ. Max. Unit V8~V10 ---- 40 ---- 30 μA 50 Deg. Page: 2 BIN ranking for LEDs BRIGHTNESS BIN Bin Code IV(mcd) Bin Code IV(mcd) Bin Code IV(mcd) Bin Code IV(mcd) A 0-5.0 H 37.2-52.0 Q 390-550 X 4180--5860 B C D E F 5.0-7.0 7.0-9.8 9.8-13.7 13.7-19.0 19.0-26.6 J K L M N 52.0-72.8 72.8-102 102-145 145-200 200-280 R S T U V 550-770 770-1100 1100-1520 1520-2130 2130-3000 Y Z1 Z2 Z3 Z4 5860-8200 8-10cd 10-12cd 12-14cd 14-16cd G 26.6-37.2 P 280-390 W 3000-4180 Z5 16-18cd FOR WHITE COLOR BINS SEE PAGE 3B PLACING OF WHITE COLOR BINS ON CIE TABLE BLUE BLUE GREEN PURE GREEN B1 450-455 YG1 555-558 B2 B3 B4 B5 455-460 460-465 465-470 470-475 YG2 YG3 YG4 YG5 558-561 561-564 564-567 567-570 B6 475-480 YG6 570-573 G1 491-494 YG7 573-576 G2 494-497 Y1 582-585 G3 G4 G5 497-500 500-503 503-506 Y2 Y3 Y4 585-588 588-591 591-594 G6 506-509 Y5 594-597 G7 509-512 YO1 597-600 G8 512-515 YO2 600-603 G9 515-518 YO3 603-606 G10 518-521 YO4 606-609 G11 521-524 G12 524-527 G13 527-530 G14 YELLOW GREEN YELLOW YELLOW ORANGE O1 609-612 O2 612-615 O3 615-618 530-533 R1 618-621 G15 533-536 R2 621-624 G16 536-539 R3 624-627 G17 539-542 R4 627-630 G18 542-545 R5 630-633 G19 545-548 R6 633-636 PURE ORANGE RED FORWARD VOLTAGE (VF) BIN Bin Code VF (V) Bin Code VF (V) Bin Code VF (V) Bin Code VF (V) V1 1.6-1.8 V5 V2 V3 1.8-2.0 2.0-2.2 V6 V7 2.4-2.6 V9 3.2-3.4 V13 4.0-4.2 2.6-2.8 2.8-3.0 V10 V11 3.4-3.6 3.6-3.8 V14 V15 4.2-4.4 4.4-4.6 V4 2.2-2.4 V8 3.0-3.2 V12 3.8-4.0 V16 4.6-4.8 Page: 3A Color ranking for white LEDs Chromaticity Coordinates Ranks (IF=20mA Wa3 Wb2 Wc2 Wc4 Wd2 X Y X Y X Y X Y X Y X Y 0.243 0.200 0.246 0.236 0.264 0.267 0.287 0.295 0.306 0.332 0.330 0.360 0.215 0.230 0.230 0.250 0.248 0.286 0.283 0.305 0.298 0.350 0.321 0.379 0.230 0.250 0.248 0.286 0.275 0.321 0.330 0.360 0.321 0.379 0.366 0.419 0.263 0.220 0.264 0.267 0.283 0.305 0.330 0.339 0.330 0.360 0.361 0.385 Y Wa2 Wb1 Wc1 Wc3 Wd1 Wf X Y X Y X Y X Y X Y X Y 0.263 0.220 0.280 0.248 0.296 0.276 0.283 0.305 0.330 0.318 0.356 0.351 0.246 0.236 0.264 0.267 0.287 0.295 0.275 0.321 0.330 0.360 0.366 0.419 0.264 0.267 0.283 0.305 0.330 0.339 0.298 0.350 0.361 0.385 0.391 0.436 IF=20mA ； Ta=25° C W d2 Wf W c4 W d1 W W c1 c 2 Wa1 Ta=25℃) W c3 W b2 W b1 W a3 W a2 W a1 x Page: 3B 0.280 0.248 0.296 0.276 0.330 0.318 0.306 0.332 0.356 0.351 0.380 0.381 LED SPECIFICATION Typical electrical/optical characteristic curves： FORWARD CURRENT Vs FORWARD VOLTAGE Luminous Intensity Relative Value at IF=20mA 2.5 40 30 20 10 Forward Current(mA) 50 2.4 2.8 3.2 3.6 Forward Voltage(V) 10 40 60 0.5 80 0 30 40 10 20 IF-Forward Current (mA) 50 2.5 20 20 1.0 LUMINOUS INTENSITY Vs. AMBIENT TEMPERATURE 30 0 1.5 0 FORWARD CURRENT DERATING CURVE 40 0 2.0 4.0 Relative Luminous Intensity 0 2.0 100 2.0 1.5 1.0 0.5 0 -40 Ambient Temperature TA (℃) Relative Luminous Intensity Forward Current(mA) 50 LUMINOUS INTENSITY Vs. FORWARD CURRENT -20 1.2 0 20 60 80 40 Ambient Temperature TA (℃) 100 Ta=25℃ 1.0 0.8 0.6 0.4 0.2 0 400 450 500 550 Wavelength 600 650 700 (nm) Page: 4 LED LAMP APPLICATION ySOLDERING METHOD DIP SOLDERING SOLDERING CONDITIONS REMARK Bath temperature: 260±5℃ Immersion time: with 5 sec y Solder no closer than 3mm from the base of the package y Using soldering flux,” RESIN FLUX” is recommended. y During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 260℃ or lower (To prevent heat from being IRON Soldering time: within 5 sec. transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip. s e i r w d a e L l e n a P (Fig.1) 2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package. s e i r w d a e L te hc gn ia lr sa e al c e v a e L (Fig.2) Page : 5 LED LAMP APPLICATION 3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3). d r a o b C P （Fig.3 ） jig 4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. yLED MOUNTING METHOD 1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) case pc board Fig.4 Page : 6 LED LAMP APPLICATION 2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. Tube Stand-off Fig.5 Fig.6 yFORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) m m 2 7 . g i F 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) Page : 7 LED LAMP APPLICATION yLEAD STRENGTH 1) Bend strength Do not bend the lead more than twice. (Fig.9) Fig.9 2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) OK！ 1Kg Fig.10 yHANDLING PRECAUTIONS Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling. yCHEMICAL RESISTANCE 1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT ADAPTABILITY Freon TE ⊙ Chlorothene ╳ Isopropyl Alcohol ⊙ Thinner ╳ Acetone ╳ Trichloroethylene ╳ ⊙--Usable ╳--Do not use. NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical. Page : 8 LED LAMP PASSED TESTS Experiment Item: Item OPERATION LIFE HIGH TEMPERATURE HIGH HUMIDITY STORAGE TEMPERATURE CYCLING THERMAL SHOCK SOLDER RESISTANCE SOLDERABILITY Test Condition Lamp & IR Ta： 25±5℃ IF= 20mA RH：＜=60%RH ① DYNAMIC:100mA 1ms 1/10 duty ② STATIC STATE: IF＝20mA TEST TIME: 168HRS（-24HRS，+24HRS） 500HRS（-24HRS，+24HRS） 1000HRS（-24HRS，+72HRS） Reference Standard MIL-STD-750：1026 MIL-STD-883：1005 JIS C 7021：B-1 Ta： 65℃±5℃ RH： 90〜95%RH TEST TIME：240HRS±2HRS MIL-STD-202：103B JIS C 7021 ：B-1 105℃〜25℃〜-55℃〜25℃ 30min 5min 30min 5min 10CYCLES MIL-STD-202：107D MIL-STD-750：1051 MIL-STD-883：1010 JIS C 7021 ：A-4 105℃±5℃〜-55℃±5℃ 10min 10min 10CYCLES T，sol：260℃±5℃ DWELL TIME：10±lsec T，sol：230℃±5℃ DWELL TIME：5±lsec MIL-STD-202：107D MIL-STD-750：1051 MIL-SYD-883：1011 MIL-STD-202：210A MIL-STD-750-2031 JIS C 7021：A-1 MIL-STD-202：208D MIL-STD-750：2026 MIL-STD-883：2003 JIS C 7021 ：A-2 Drive Method Circuit model A Circuit model B Page : 9 (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.