ETC AU6391

1
Data Book
AU6391
USB2.0 to ATA/ATAPI Bridge
Controller
Technical Reference Manual
Product Specification
Official Release
Revision 1.00W
Public
Feb 2007
Data book status
Objective specification
This data book contains target specifications for
product development.
Preliminary specification
This
data
book
contains
preliminary
supplementary data may be published later.
Product specification
This data book contains final product specifications.
data;
Revision History
Date
Revision
Feb 2007
1.00W
Description
Initial release
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Copyright Notice
Copyright 1997 - 2007
Alcor Micro Corp.
All Rights Reserved.
Trademark Acknowledgements
The company and product names mentioned in this document may be the trademarks
or registered trademarks of their manufacturers.
Disclaimer
Alcor Micro Corp. reserves the right to change this product without prior notice.
Alcor Micro Corp. makes no warranty for the use of its products and bears no
responsibility for any error that appear in this document. Specifications are subject to
change without prior notice.
Contact Information:
Web site: http://www.alcormicro.com/
Taiwan
Alcor Micro Corp.
4F, No 200 Kang Chien Rd., Nei Hu,
Taipei, Taiwan, R.O.C.
Phone: 886-2-8751-1984
Fax: 886-2-2659-7723
China ShenZhen Office
Rm.2407-08, Industrial Bank Building
No.4013, Shennan Road ,ShenZhen,China.
518026
Phone: (0755) 8366-9039
Fax: (0755) 8366-9101
Santa Clara Office
2901 Tasman Drive, Suite 206
Santa Clara, CA 95054
USA
Phone: (408) 845-9300
Fax: (408) 845-9086
Los Angeles Office
9070 Rancho Park Court
Rancho Cucamonga, CA 91730
USA
Phone: (909) 483-9900
Fax: (909) 944-0464
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Table of Contents
1 Introduction……………………………………………………………..
6
1.1 Description……………………………………………………………………………..
6
1.2 Features………………………………………………………………………………….
6
2 Application Block Diagram………………………………………….
7
3 Pin Assignment…………………………………………………………
8
4 System Architecture and Reference Design………………….. 14
4.1 AU6391 Block Diagram…………………………………………………………. 14
5 Electrical Characteristics…………………………………………… 15
5.1 Absolute Maximum Ratings………………………………………………….. 15
5.2 Recommended Operating Conditions……………………………………
15
5.3 General DC Characteristics…………………………………………………… 15
5.4 DC Electrical Characteristics for 5 volts operation………………
16
5.5 USB Transceiver Characteristics…………………………………………… 17
6 Mechanical Information……………………………………………… 20
7 Abbreviations…………………..………………………………………
21
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List of Figures
2.1 Block Diagram…………………………………………………………………………………..
7
3.1 GBL bonding Pin Assignment Diagram……………………………………………..
8
3.2 GEL bonding Pin Assignment Diagram……………………………………………. 11
4.1 AU6391 Block diagram……………………………………………………………………… 14
6.1 Mechanical Information Diagram…………………………………………………….. 20
List of Tables
3.1
GBL bonding Pin Descriptions……………………………………………………...
3.2
GEL bonding Pin Descriptions……………………………………………………… 12
5.1
Absolute Maximum Ratings…………………………………………………………. 15
5.2
Recommended Operating Conditions………………………………………….. 15
5.3
General DC Characteristics………………………………………………………….. 15
5.4
DC Electrical Characteristics of 3.3V I/O Cells………………………
5.5
Recommended Operation Conditions………………………………………….. 17
5.6
Static characteristic:Digital in ………………………………………………….. 17
5.7
Static characteristic:Analog I/O pins(DP/DM)………………………… 18
5.8
Dynamic characteristic:Analog I/O pins(DP/DM)…………………… 19
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16
1.0 Introduction
1.1 Description
The AU6391 is a single chip controller designed for bridgingg USB 2.0 to ATA/ATAPI
bus interface. It is used as the primary controller of building an external USB 2.0
hard disk or CD/DVD drives.
To maximize the data throughput and achieve the best compatibility, AU6391 is
equipped with Alcor’s proprietary automatic speed negotiation (ASN) algorithm. The
ASN algorithm allows AU6391 to select optimized operating mode that device can
best support a reliable data transfer from PIO mode 0~4 and Ultra DMA mode 2/4.
The silicon would work with the default device driver from Windows ME, Windows
2000, Windows XP and Mac OS X, however, vendor device driver provided by Alcor
Micro would enable the built device working under Windows 98, Windows 2000
(SP1/SP2) and Mac OS 9.
1.2 Features
Supports USB 2.0 specification and USB Device Class Definition for Mass
Storage, Bulk-Transport V1.0
Supports ATA/ATAPI-6 specification Revision 1.0
PIO mode 0~4
UDMA mode 2/4
Supports ATA/ATAPI device configured in master or slave mode
Supports 48-bit addressing for large capacity hard drive
Hardware DMA engine integrated inside for performance enhancement
Works with default device driver from Windows ME/2000/XP and Mac OS X.
One spared LED pin for disk access indication
Built-in voltage regulator
48-pin LQFP package
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2.0 Application Block Diagram
The following picture is an application diagram of a typical removable USB2.0
ATA/ATAPI device. With such kinds of devices, users can exchange recorded digital
content between ATA/ATAPI device and PC (Notebook) via USB.
2.1 Block Diagram
PC with USB Host Controller
HD
AU6391
CD-ROM, CD-R/W
DVD-ROM, VCD-R/W
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3.0 Pin Assignment
There are two different form factor packages available to choose from. The following
figure shows signal names for each pin and the table in the page after describes
each pin in details.
Figure 3.1 GBL bonding Pin Assignment Diagram
ATADMARQ
ATADIOWN
ATADIORN
ATAIORDY
ATADMACKN
ATAINTRQ
ATADATA15
ATADATA14
ATADATA13
ATADATA12
ATACS1N
ATACS0N
48
47
46
45
44
43
42
41
40
39
38
37
GNDU
1
36
ATADATA11
VDDU
2
35
ATADATA10
DM
3
34
ATADATA9
DP
4
33
ATADATA8
REXT
5
32
ATADATA7
VDD33
6
31
ATADATA6
VSS33P
7
30
ATADATA5
VSSA
8
29
ATADATA4
XI
9
28
ATADATA3
XO
10
27
ATADATA2
VDDA
11
26
ATADATA1
25
ATADATA0
GND
ALCOR MICRO
AU6391-GBL
48PIN LQFP
12
14
15
16
17
18
19
20
21
22
23
AVDD5V
VDD3V
V18
ATAAD2
ATAAD1
ATAAD0
ATARESETN
EEPDATA
EEPCLK
GPI3
CHIPRESETN
24
GPON7
13
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Table 3.1 GBL bonding Pin Descriptions
Pin #
Pin Name
I/O
Description
1
GNDU
PWR
GND for UTMI Power
2
VDDU
PWR
Power for UTMI core
3
DM
I/O
USB DM
4
DP
I/O
USB DP
5
REXT
I
6
VDD33
PWR
UTMI power 3.3V
7
VSS33P
PWR
UTMI power GND
8
VSSA
PWR
Analog GND
9
XI
I
12 MHz crystal input.
10
XO
O
12 MHz crystal output.
11
VDDA
PWR
12
GND
13
AVDD5V
I
5V power supply input
14
VDD3V
O
3.3V Power Out
15
V18
PWR
16
ATAAD2
O
ATA Address bus 2
17
ATAAD1
O
ATA Address bus 1
18
ATAAD0
O
ATA Address bus 0
19
ATARESETN
O
ATA Reset
20
EEPDATA
B
EEPDATA
21
EEPCLK
B
EEPCLK
22
GPI3
I
GPI for customized software triggle
23
CHIPRESETN
I
Reset (low active to reset the whole chip), must be pull
up with RC.
24
GPON7
O
LED indicator
Connect pull-low resistor for impedance match
Analog 1.8V power
GND for IO pad
1.8 V output for core power
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Pin #
Pin Name
I/O
Description
25
ATADATA0
I/O
ATA Data Bus 0
26
ATADATA1
I/O
ATA Data Bus 1
27
ATADATA2
I/O
ATA Data Bus 2
28
ATADATA3
I/O
ATA Data Bus 3
29
ATADATA4
I/O
ATA Data Bus 4
30
ATADATA5
I/O
ATA Data Bus 5
31
ATADATA6
I/O
ATA Data Bus 6
32
ATADATA7
I/O
ATA Data Bus 7
33
ATADATA8
I/O
ATA Data Bus 8
34
ATADATA9
I/O
ATA Data Bus 9
35
ATADATA10
I/O
ATA Data Bus 10
36
ATADATA11
I/O
ATA Data Bus 11
37
ATACS0N
O
ATA Chip Select0
38
ATACS1N
O
ATA Chip Select1
39
ATADATA12
I/O
ATA Data Bus 12
40
ATADATA13
I/O
ATA Data Bus 13
41
ATADATA14
I/O
ATA Data Bus 14
42
ATADATA15
I/O
ATA Data Bus 15
43
ATAINTRQ
I
ATA Interput request
44
ATADMACKN
O
ATA Control Signal DMACKN
45
ATAIORDY
I
ATA Control Signal IORDY
46
ATADIORN
O
ATA Control Signal DIORN
47
ATADIOWN
O
ATA Control Signal DIOWN
48
ATADMARQ
I
ATA Control Signal DMARQ
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The following figure shows signal names of each pin of the 48-pin package and the
table in the page after describes each pin in details.
Figure 3.1 GEL bonding Pin Assignment Diagram
ATADMARQ
ATADIOWN
ATADIORN
ATAIORDY
ATADMACKN
ATAINTRQ
ATADATA15
ATADATA14
ATADATA13
ATADATA12
ATACS1N
ATACS0N
48
47
46
45
44
43
42
41
40
39
38
37
GNDU
1
36
ATADATA11
VDD
2
35
ATADATA10
VDDU
3
34
ATADATA9
DM
4
33
ATADATA8
DP
5
32
ATADATA7
REXT
6
31
ATADATA6
VDD33
7
30
ATADATA5
VSS33P
8
29
ATADATA4
VSSA
9
28
ATADATA3
XI
10
27
ATADATA2
XO
11
26
ATADATA1
25
ATADATA0
VDDA
ALCOR MICRO
AU6391-GEL
48PIN LQFP
12
14
15
16
17
18
19
20
21
22
23
AGND5V
AVDD5V
VDD3V
V18
VSSHM
ATAAD2
ATAAD1
ATAAD0
ATARESETN
GPI3
CHIPRESETN
24
GPON7
13
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Table 3.1 GEL bonding Pin Descriptions
Pin #
Pin Name
I/O
Description
1
GNDU
GND
Ground
2
VDD
PWR
1.8V
3
VDDU
PWR
Power for UTMI core
4
DM
I/O
USB DM
5
DP
I/O
USB DP
6
REXT
I
7
VDD33
PWR
3.3V
8
VSS33P
PWR
UTMI power GND
9
VSSA
PWR
Analog GND
10
XI
I
12 MHz crystal input.
11
XO
O
12 MHz crystal output.
12
VDDA
PWR
1.8V
13
AGND5V
GND
Ground
14
AVDD5V
I
5V Power Source
15
VDD3V
O
3.3 V Power Out
16
V18
PWR
1.8 V output for core power
17
VSSHM
GND
Ground
18
ATAAD2
O
ATA Address bus [2]
19
ATAAD1
O
ATA Address bus [1]
20
ATAAD0
O
ATA Address bus [0]
21
ATARESETN
O
ATA Reset
22
GPI3
I
General Purpose Input.
23
CHIPRESETN
I
Reset (low active to reset the whole chip), must be pull
up with RC.
24
GPON7
O
General Purpose Output.
25
ATADATA0
I/O
Connect pull-low resistor for impedance match
ATA Data Bus [0]
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Pin #
Pin Name
I/O
Description
26
ATADATA1
I/O
ATA Data Bus [1]
27
ATADATA2
I/O
ATA Data Bus [2]
28
ATADATA3
I/O
ATA Data Bus [3]
29
ATADATA4
I/O
ATA Data Bus [4]
30
ATADATA5
I/O
ATA Data Bus [5]
31
ATADATA6
I/O
ATA Data Bus [6]
32
ATADATA7
I/O
ATA Data Bus [7]
33
ATADATA8
I/O
ATA Data Bus [8]
34
ATADATA9
I/O
ATA Data Bus [9]
35
ATADATA10
I/O
ATA Data Bus [10]
36
ATADATA11
I/O
ATA Data Bus [11]
37
ATACS0N
O
ATA Chip Select0
38
ATACS1N
O
ATA Chip Select1
39
ATADATA12
I/O
ATA Data Bus [12]
40
ATADATA13
I/O
ATA Data Bus [13]
41
ATADATA14
I/O
ATA Data Bus [14]
42
ATADATA15
I/O
ATA Data Bus [15]
43
ATAINTRQ
I
ATA Interput request
44
ATADMACKN
O
ATA Control Signal DMACKN
45
ATAIORDY
I
ATA Control Signal IORDY
46
ATADIORN
O
ATA Control Signal DIORN
47
ATADIOWN
O
ATA Control Signal DIOWN
48
ATADMARQ
I
ATA Control Signal DMARQ
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4.0 System Architecture and
Reference Design
4.1 AU6391 Block Diagram
Figure 4.1 AU6391 Block Diagram
USB
Upstream
Port
USB
XCVR
RAM
SIE
Processor
1.8 V
3.3 V
ATA Control FIFO
ROM
Arbitrator
3.3V and 1.8V
Voltage
Regulator
/Power Switch
5V
12MHz
XTAL
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ATA
5.0 Electrical Characteristics
5.1 Absolute Maximum Ratings
Table 5.1 Absolute Maximum Ratings
SYMBOL
PARAMETER
RATING
UNITS
VDDHM
Power Supply
-0.3 to VDDHM +0.3
V
VIN
Input signal Voltage
-0.3 to 3.6
V
VOUT
Output signal Voltage
-0.3 to VDDHM +0.3
V
TSTG
Storage Temperature
-40 to 150
O
C
5.2 Recommended Operating Conditions
Table 5.2 Recommended Operating Conditions
SYMBOL
PARAMETER
MIN
TYP
MAX
UNITS
AVDD5V
Power Supply
4.75
5.0
5.25
V
VDDHM
Power Supply
3.0
3.3
3.6
V
VDD
V18
Digital Supply
1.62
1.8
1.98
V
VIN
Input signal Voltage
0
3.3
3.6
V
TOPR
Operating Temperature
0
70
O
MAX UNITS
C
5.3 Leakage Current and Capacitance
Table 5.3 General DC Characteristics
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
IIN
Input current
no pull-up or
pull-down
-10
±1
10
µA
IOZ
Tri-state leakage current
-10
±1
10
µA
CIN
Input capacitance
Pad Limit
2.8
ρF
COUT
Output capacitance
Pad Limit
2.8
ρF
CBID
Bi-directional buffer
capacitance
Pad Limit
2.8
ρF
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5.4 DC Electrical Characteristics of 3.3V I/O Cells
Table 5.4 DC Electrical Characteristics of 3.3V I/O Cells
Limits
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
3.0
3.0
UNIT
VDDHM
Power supply
Vil
Input low voltage
Vih
Input high voltage
Vol
Output low voltage
∣Iol∣=2~16mA
Voh
Output high voltage
∣Ioh∣=2~16mA
2.4
Rpu
Input pull-up resistance
PU=high, PD=low
55
75
110
KΩ
Input pull-down resistance PU=low, PD=high
40
75
150
KΩ
-10
±1
10
μA
-10
±1
10
μA
Rpd
3.3V I/O
MAX
3.6
V
0.8
V
LVTTL
Iin
Input leakage current
Ioz
Tri-state output leakage
current
2.0
Vin= VDDHM or 0
V
0.4
V
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V
5.5 USB Transceiver Characteristics
Table 5.5 Electrical characteristics
Symbol
Parameter
VDD33
Min.
Typ.
Max.
Unit
Analog supply voltage
3.0
3.3
3.6
V
VDD
V18
Digital supply voltage
1.62
1.8
1.98
V
ICC
Operating supply current
55
mA
120
µA
ICC(susp)
Conditions
High speed operating
at 480 MHz
In suspend mode,
current with 1.5kΩ
Suspend supply current
pull-up resistor on
pin RPU disconnected
Table 5.6 Static characteristic:Digital pin
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
0.8
V
Input levels
VIL
Low-level input voltage
VIH
High-level input voltage
2.0
V
Output levels
VOL
Low-level output voltage
VOH
High-level output voltage
0.2
VDDH*-0.2
V
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V
Table 5.7 Static characteristic:Analog I/O pins(DP/DM)
Symbol
VHSDIFF
VHSCM
Parameter
Conditions
Min.
USB2.0 Transceiver(HS)
Input Levels(differential receiver)
∣VI(DP)-VI(DM)∣
High speed differential
measured at the
300
input sensitivity
connection as
application circuit
High speed data signaling
common mode voltage
-50
range
VHSSQ
High speed squelch
detection threshold
VHSDSC
High speed disconnection
detection threshold
VHSOI
VHSOL
VHSOH
VCHIRPJ
VCHIRPK
RDRV
VTERM
VDI
VCM
Typ.
Disconnection
detected
Disconnection not
detected
Output Levels
High speed idle level
output
voltage(differential)
High speed low level
output
voltage(differential)
High speed high level
output
voltage(differential)
Chirp-J output voltage
(differential)
Chirp-K output voltage
(differential)
Unit
mV
Squelch detected
No squelch detected
Max.
500
mV
100
mV
150
mV
625
mV
525
mV
-10
10
mV
-10
10
mV
-360
400
mV
700
1100
mV
-900
-500
mV
Resistance
Equivalent resistance
3
used as internal chip
only
Driver output impedance
Overall resistance
40.5
including external
resistor
Termination
Termination voltage for
3.0
pull-up resistor on pin
RPU
USB1.1 Transceiver(FS/LS)
Input Levels(differential receiver)
Differential input
∣VI(DP)-VI(DM)∣
0.2
sensitivity
Differential common
0.8
mode voltage
Input Levels(single-ended receivers)
6
9
Ω
45
49.5
3.6
V
V
2.5
V
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VSE
Single ended receiver
threshold
0.8
2.0
V
Output levels
VOL
Low-level output voltage
0
0.3
V
VOH
High-level output voltage
2.8
3.6
V
Table 5.8 Dynamic characteristic:Analog I/O pins(DP/DM)
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
Driver Characteristics
High-Speed Mode
tHSR
tHSF
High-speed differential
rise time
High-speed differential
fall time
500
ps
500
ps
Full-Speed Mode
tFR
tFF
tFRMA
VCRS
CL=50pF;10 to 90﹪
of∣VOH-VOL∣;
CL=50pF;90 to 10﹪
Fall time
of∣VOH-VOL∣;
Excluding the first
Differential rise/fall time
transition from idle
matching(tFR / tFF)
mode
Excluding the first
Output signal crossover
transition from idle
voltage
mode
Rise time
4
20
ns
4
20
ns
90
110
%
1.3
2.0
V
75
300
ns
75
300
ns
80
125
%
1.3
2.0
V
2.8
3.6
V
Low-Speed Mode
tLR
tLF
tLRMA
VCRS
VOH
CL=200pF-600pF;
10 to 90﹪of
∣VOH-VOL∣;
CL=200pF-600pF;
90 to 10﹪of
Fall time
∣VOH-VOL∣;
Excluding the first
Differential rise/fall time
transition from idle
matching(tLR / tLF)
mode
Excluding the first
Output signal crossover
transition from idle
voltage
mode
Rise time
High-level output voltage
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6.0 Mechanical Information
Figure 6.1 Mechanical Information Diagram
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7.0 Abbreviations
This chapter lists and defines terms and abbreviations used throughout this
specification.
SIE
ATA
UTMI
Serial Interface Engine
Advanced Technology Attachment
USB Transceiver Macrocell Interface
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【MEMO】
About Alcor Micro, Corp
Alcor Micro, Corp. designs, develops and markets highly integrated and advanced
peripheral semiconductor, and software driver solutions for the personal computer
and consumer electronics markets worldwide. We specialize in USB solutions and
focus on emerging technology such as USB and IEEE 1394. The company offers a
range of semiconductors including controllers for USB hub, integrated
keyboard/USB hub and USB Flash memory card reader…etc. Alcor Micro, Corp. is
based in Taipei, Taiwan, with sales offices in Taipei, Japan, Korea and California.
Alcor Micro is distinguished by its ability to provide innovative solutions for
spec-driven products. Innovations like single chip solutions for traditional multiple
chip products and on-board voltage regulators enable the company to provide
cost-efficiency solutions for the computer peripheral device OEM customers
worldwide.
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