AGILENT HCPL-817-00L

Agilent HCPL-817
Phototransistor Optocoupler
High Density Mounting Type
Data Sheet
Description
The HCPL-817 contains a light
emitting diode optically coupled to
a phototransistor. It is packaged in
a 4-pin DIP package and available
in wide-lead spacing option and
lead bend SMD option. Input-output
isolation voltage is 5000 Vrms.
Response time, tr, is typically 4 µs
and minimum CTR is 50% at input
current of 5 mA.
Functional Diagram
PIN NO. AND INTERNAL
CONNECTION DIAGRAM
4
Ordering Information
Specify part number followed by
Option Number (if desired).
HCPL-817-XXX
Option Number
060
W00
300
500
=
=
=
=
00A
00B
00C
00D
00L
=
=
=
=
=
VDE0884 Option
0.4" Lead Spacing Option
Lead Bend SMD Option
Tape and Reel Packaging
Option
Rank Mark A
Rank Mark B
Rank Mark C
Rank Mark D
Rank Mark L
3
Schematic
ANODE
1
IF
IC 4
+
Features
• Current Transfer Ratio
(CTR: min. 50% at IF = 5 mA,
VCE = 5 V)
• High input-output isolation voltage
(Viso = 5000 Vrms)
• Response time (tr: typ., 4 µs at
VCE = 2 V, IC = 2 mA, RL = 100 Ω)
• Compact dual-in-line package
• UL approved
• CSA approved
• VDE approved
• Options available:
– Leads with 0.4" (10.16 mm)
spacing (W00)
– Leads bends for surface
mounting (300)
– Tape and reel for SMD (500)
– VDE 0884 approvals (060)
Applications
• Signal transmission between
circuits of different potentials and
impedances
• I/O interfaces for computers
• Feedback circuit in power supply
COLLECTOR
VF
1
2
CATHODE
1. ANODE
2. CATHODE
3. EMITTER
4. COLLECTOR
–
2
3
EMITTER
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
Package Outline Drawings
4.6 ± 0.5
(0.181)
4
3
TYPE NUMBER
DATE CODE
A 817 V
YWW
OPTION CODE
FOR OPTION 060
ONLY
3.5 ± 0.5
(0.138)
6.5 ± 0.5
(0.256)
PIN ONE DOT
RANK MARK
1
7.62 ± 0.3
(0.3)
3.3 ± 0.5
(0.130)
2.8 ± 0.5
(0.110)
0.5
TYP.
(0.02)
2
0.5 ± 0.1
(0.02)
0.35 +0.15/-0.10
(0.014)
DIMENSIONS IN MILLIMETERS AND (INCHES)
7.62 ~ 9.98
2.54 ± 0.25
(0.1)
Package Outline – Option W00
4.6 ± 0.5
(0.181)
7.62 ± 0.3
(0.3)
3.5 ± 0.5
(0.138)
6.5 ± 0.5
(0.256)
6.9 ± 0.5
(0.272)
2.3 ± 0.5
(0.09)
2.8 ± 0.5
(0.110)
0.5 ± 0.1
(0.02)
0.35 +0.15/-0.10
(0.014)
10.16 ± 0.5
(0.4)
2.54 ± 0.25
(0.1)
DIMENSIONS IN MILLIMETERS AND (INCHES)
Package Outline – Option 300
4.6 ± 0.5
(0.181)
7.62 ± 0.3
(0.3)
3.5 ± 0.5
(0.138)
0.35 ± 0.25
(0.014)
6.5 ± 0.5
(0.256)
1.2 ± 0.1
(0.047)
0.35 ± 0.25
(0.014)
2.54 ± 0.25
(0.1)
DIMENSIONS IN MILLIMETERS AND (INCHES)
2
1.0 ± 0.25
(0.039)
10.16 ± 0.3
(0.4)
Absolute Maximum Ratings (TA = 25˚C)
Storage Temperature, TS
Operating Temperature, T A
Lead Solder Temperature, max.
(1.6 mm below seating plane)
Average Forward Current, IF
Reverse Input Voltage, VR
Input Power Dissipation, PI
Collector Current, IC
Collector-Emitter Voltage, V CEO
Emitter-Collector Voltage, V ECO
Collector Power Dissipation
Total Power Dissipation
Isolation Voltage, Viso (AC for 1 minute, R.H. = 40 ~ 60%)
–55˚C to +125˚C
–30˚C to +100˚C
260˚C for 10 s
50 mA
6V
70 mW
50 mA
35 V
6V
150 mW
200 mW
5000 Vrms
Electrical Specifications (TA = 25˚C)
Parameter
Forward Voltage
Reverse Current
Terminal Capacitance
Collector Dark Current
Collector-Emitter Breakdown Voltage
Emitter-Collector Breakdown Voltage
Collector Current
*Current Transfer Ratio
Collector-Emitter Saturation Voltage
Response Time (Rise)
Response Time (Fall)
Cut-off Frequency
Symbol
VF
IR
Ct
ICEO
BVCEO
BVECO
IC
CTR
VCE(sat)
tr
tf
fc
Min.
–
–
–
–
35
6
2.5
50
–
–
–
–
Typ.
1.2
–
30
–
–
–
–
–
0.1
4
3
80
Max.
1.4
10
250
100
–
–
30
600
0.2
18
18
–
Units
V
µA
pF
nA
V
V
mA
%
V
µs
µs
KHz
Isolation Resistance
Riso
5 x 1010
1 x 1011
–
Ω
Floating Capacitance
Cf
–
0.6
1.0
pF
* CTR =
IC
x 100%
IF
Rank Mark
L
A
B
C
D
3
CTR (%)
50 ~ 100
80 ~ 160
130 ~ 260
200 ~ 400
300 ~ 600
Conditions
IF = 5 mA, VCE = 5 V, TA = 25°C
Test Conditions
IF = 20 mA
VR = 4 V
V = 0, f = 1 KHz
VCE = 20 V
IC = 0.1 mA
IE = 10 µA
IF = 5 mA, VCE = 5 V,
RBE = ∞
IF = 20 mA, IC = 1 mA
VCC = 2 V, IC = 2 mA
RL = 100 Ω
VCC = 5 V, IC = 2 mA
RL = 100 Ω, –3 dB
DC 500 V
40 ~ 60% R.H.
V = 0, f = 1 MHz
20
10
0
25
50
75
100
125
TA – AMBIENT TEMPERATURE – °C
Figure 1. Forward current vs. temperature.
IF – FORWARD CURRENT – mA
500
TA = 75°C
200
TA = 50°C
TA = 0°C
100
TA = 25°C
TA = -25°C
50
20
10
5
2
1
0.5
0
1.5
1.0
2.0
2.5
3.0
150
100
50
50
75
100
50
0
-30
0
25
50
75
100
Figure 7. Relative current transfer ratio vs.
temperature.
IC = 6 mA
IC = 7 mA
2
1
2
0
6
8 10 12 14 16 18 20
50
VCE = 5 V
TA = 25°C
180
160
140
120
100
80
60
40
20
0
4
Figure 3. Collector-emitter saturation voltage
vs. forward current.
5
2
20
10
50
0.12
0.10
0.08
0.06
0.04
0.02
0
25
50
75
100
TA – AMBIENT TEMPERATURE – °C
Figure 8. Collector-emitter saturation
voltage vs. temperature.
PC (MAX.)
30
IF = 20 mA
IF = 10 mA
20
IF = 10 mA
10
IF = 5 mA
1
0
2
3
4
5
6
7
8
9
Figure 6. Collector current vs. collectoremitter voltage.
IF = 20 mA
IC = 1 mA
0
-25
IF = 20 mA
VCE – COLLECTOR-EMITTER VOLTAGE – V
Figure 5. Current transfer ratio vs. forward
current.
0.14
TA = 25°C
IF = 30 mA
40
0
1
0.16
100
IC = 3 mA
3
IF – FORWARD CURRENT – mA
200
150
IF = 5 mA
VCE = 5 V
IC = 1 mA
4
125
Figure 2. Collector power dissipation vs.
temperature.
VCE(SAT.) – COLLECTOR-EMITTER
SATURATION VOLTAGE – V
RELATIVE CURRENT TRANSFER RATIO – %
25
IF – FORWARD CURRENT – mA
TA – AMBIENT TEMPERATURE – °C
4
0
IC = 0.5 mA
TA – AMBIENT TEMPERATURE – °C
VF – FORWARD VOLTAGE – V
Figure 4. Forward current vs. forward voltage.
5
0
0
-30
ICEO – COLLECTOR DARK CURRENT – A
0
-30
TA = 25°C
VCE(SAT.) – COLLECTOR-EMITTER
SATURATION VOLTAGE – V
30
6
200
IC – COLLECTOR CURRENT – mA
40
PC – COLLECTOR POWER DISSIPATION – mW
50
CTR – CURRENT TRANSFER RATIO – %
IF – FORWARD CURRENT – mA
60
10-5
VCE = 20 V
10-6
10-7
10-8
10-9
10-10
10-11
-25
0
25
50
75
100
TA – AMBIENT TEMPERATURE – °C
Figure 9. Collector dark current vs.
temperature.
200
100
VCE = 2 V
IC = 2 mA
TA = 25°C
50
VOLTAGE GAIN AV – dB
RESPONSE TIME – µs
500
tr
20
10
tf
5
td
2
1
ts
0.5
0.2
0.1
VCE = 2 V
IC = 2 mA
TA = 25°C
0
10
RL = 10 kΩ
RL = 1 kΩ
RL = 100 Ω
20
0.05 0.1 0.2
1
0.5
2
5
10
RL – LOAD RESISTANCE – kΩ
Figure 10. Response time vs. load resistance.
Test Circuit for Response Time
0.5 1
2
5 10 20
50 100 200 500
f – FREQUENCY – kHz
Figure 11. Frequency response.
Test Circuit for Frequency Response
VCC
VCC
RL
RD
RD
INPUT
OUTPUT
OUTPUT
~
INPUT
10%
OUTPUT
90%
ts
td
tr
5
tf
RL
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2001 Agilent Technologies, Inc.
October 19, 2001
5988-4116EN