ISSI ® IS41LV16257B APRIL 2005 256K x 16 (4-MBIT) DYNAMIC RAM WITH FAST PAGE MODE FEATURES DESCRIPTION • • • • The ISSI IS41LV16257B is 262,144 x 16-bit highperformance CMOS Dynamic Random Access Memories. Fast Page Mode allows 512 random accesses within a single row with access cycle time as short as 12 ns per 16-bit word. The Byte Write control, of upper and lower byte, makes these devices ideal for use in 16- and 32-bit wide data bus systems. • • • • Fast access and cycle time TTL compatible inputs and outputs Refresh Interval: 512 cycles/8 ms Refresh Mode: RAS-Only, CAS-before-RAS (CBR), and Hidden JEDEC standard pinout Single power supply: 3.3V ± 10% Byte Write and Byte Read operation via two CAS Lead-free available These features make the IS41LV16257B ideally suited for high band-width graphics, digital signal processing, high-performance computing systems, and peripheral applications. The IS41LV16257B is packaged in a 40-pin, 400-mil SOJ and TSOP (Type II). KEY TIMING PARAMETERS Parameter -35 -60 Unit Max. RAS Access Time (tRAC) Max. CAS Access Time (tCAC) Max. Column Address Access Time (tAA) Min. Fast Page Mode Cycle Time (tPC) 35 11 18 14 60 15 30 25 ns ns ns ns Min. Read/Write Cycle Time (tRC) 60 110 ns Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 1 ISSI IS41LV16257B ® FUNCTIONAL BLOCK DIAGRAM OE WE LCAS UCAS CAS CLOCK GENERATOR WE CONTROL LOGICS CAS OE CONTROL LOGIC WE OE DATA I/O BUS COLUMN DECODERS SENSE AMPLIFIERS ROW DECODER REFRESH COUNTER ADDRESS BUFFERS A0-A8 MEMORY ARRAY 262,144 x 16 PIN CONFIGURATIONS 40-Pin TSOP (Type II) 2 VDD 1 40 GND I/O0 2 39 I/O15 I/O1 3 38 I/O14 I/O2 4 37 I/O13 I/O3 5 36 I/O12 VDD 6 35 DATA I/O BUFFERS RAS CLOCK GENERATOR RAS RAS I/O0-I/O15 PIN DESCRIPTIONS 40-Pin SOJ A0-A8 Address Inputs I/O0-I/O15 Data Inputs/Outputs VDD 1 40 GND I/O0 2 39 I/O15 WE Write Enable I/O1 3 38 I/O14 4 37 I/O13 OE Output Enable I/O2 GND I/O3 5 36 I/O12 RAS Row Address Strobe 6 35 GND UCAS Upper Column Address Strobe LCAS Lower Column Address Strobe VDD Power GND Ground NC No Connection I/O4 7 34 I/O11 VDD I/O5 8 33 I/O10 I/O4 7 34 I/O11 I/O6 9 32 I/O9 I/O5 8 33 I/O10 I/O7 10 31 I/O8 I/O6 9 32 I/O9 I/O7 10 31 I/O8 NC 11 30 NC NC 12 29 LCAS WE 13 28 UCAS RAS 14 27 OE NC 15 26 A8 NC 11 30 NC NC 12 29 LCAS WE 13 28 UCAS RAS 14 27 OE NC 15 26 A8 A0 16 25 A7 A0 16 25 A7 A1 17 24 A6 A1 17 24 A6 A2 18 23 A5 A2 18 23 A5 A3 19 22 A4 A3 19 22 A4 VDD 20 21 GND VDD 20 21 GND Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 ISSI IS41LV16257B ® TRUTH TABLE Function Standby Read: Word Read: Lower Byte RAS H L L LCAS H L L UCAS H L H WE X H H OE X L L Address tR/tC X ROW/COL ROW/COL Read: Upper Byte L H L H L ROW/COL Write: Word (Early Write) Write: Lower Byte (Early Write) L L L L L H L L X X ROW/COL ROW/COL Write: Upper Byte (Early Write) L H L L X ROW/COL L L L H L L L L H L H∅L H L X X L∅H L X X X ROW/COL ROW/COL ROW/COL ROW/NA X Read-Write(1,2) Hidden Refresh2) RAS-Only Refresh CBR Refresh(3) L Read L∅H∅L Write L∅H∅L L H∅L I/O High-Z DOUT Lower Byte, DOUT Upper Byte, High-Z Lower Byte, High-Z Upper Byte, DOUT DIN Lower Byte, DIN Upper Byte, High-Z Lower Byte, High-Z Upper Byte, DIN DOUT, DIN DOUT DOUT High-Z High-Z Notes: 1. These WRITE cycles may also be BYTE WRITE cycles (either LCAS or UCAS active). 2. These READ cycles may also be BYTE READ cycles (either LCAS or UCAS active). 3. At least one of the two CAS signals must be active (LCAS or UCAS). Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 3 ISSI IS41LV16257B ® FUNCTIONAL DESCRIPTION The IS41LV16257B is a CMOS DRAM optimized for highspeed bandwidth, low-power applications. During READ or WRITE cycles, each bit is uniquely addressed through the 18 address bits. These are entered nine bits (A0-A8) at a time. The row address is latched by the Row Address Strobe (RAS). The column address is latched by the Column Address Strobe (CAS). RAS is used to latch the first nine bits and CAS is used to latch the latter nine bits. Write Cycle The IS41LV16257B has two CAS controls, LCAS and UCAS. The LCAS and UCAS inputs internally generate a CAS signal functioning in an identical manner to the single CAS input on the other 256K x 16 DRAMs. The key difference is that each CAS controls its corresponding I/O tristate logic (in conjunction with OE and WE and RAS). LCAS controls I/O0 - I/O7 and UCAS controls I/O8 - I/O15. The IS41LV16257B CAS function is determined by the first CAS (LCAS or UCAS) transitioning LOW and the last transitioning back HIGH. The two CAS controls give the IS41LV16257B both BYTE READ and BYTE WRITE cycle capabilities. 1. By clocking each of the 512 row addresses (A0 through A8) with RAS at least once every 8 ms. Any read, write, read-modify-write or RAS-only cycle refreshes the addressed row. 2. Using a CAS-before-RAS refresh cycle. CAS-beforeRAS refresh is activated by the falling edge of RAS, while holding CAS LOW. In CAS-before-RAS refresh cycle, an internal 9-bit counter provides the row addresses and the external address inputs are ignored. CAS-before-RAS is a refresh-only mode and no data access or device selection is allowed. Thus, the output remains in the High-Z state during the cycle. Memory Cycle Power-On A memory cycle is initiated by bringing RAS LOW and it is terminated by returning both RAS and CAS HIGH. To ensure proper device operation and data integrity any memory cycle, once initiated, must not be ended or aborted before the minimum tRAS time has expired. A new cycle must not be initiated until the minimum precharge time tRP, tCP has elapsed. A write cycle is initiated by the falling edge of CAS and WE, whichever occurs last. The input data must be valid at or before the falling edge of CAS or WE, whichever occurs last. Refresh Cycle To retain data, 512 refresh cycles are required in each 8 ms period. There are two ways to refresh the memory: After application of the VDD supply, an initial pause of 200 µs is required followed by a minimum of eight initialization cycles (any combination of cycles containing a RAS signal). During power-on, it is recommended that RAS track with VDD or be held at a valid VIH to avoid current surges. Read Cycle A read cycle is initiated by the falling edge of CAS or OE, whichever occurs last, while holding WE HIGH. The column address must be held for a minimum time specified by tAR. Data Out becomes valid only when tRAC, tAA, tCAC and tOEA are all satisfied. As a result, the access time is dependent on the timing relationships between these parameters. 4 Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 ISSI IS41LV16257B ® ABSOLUTE MAXIMUM RATINGS(1) Symbol Parameters VT VDD IOUT PD TA TSTG Voltage on Any Pin Relative to GND Supply Voltage Output Current Power Dissipation Operation Temperature Storage Temperature 3.3V 3.3V Com. Rating Unit –0.5 t0 +4.6 –0.5 t0 +4.6 50 1 0 to +70 –55 to +125 V V mA W °C °C Note: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. RECOMMENDED OPERATING CONDITIONS (Voltages are referenced to GND) Symbol VDD VIH VIL TA Parameter Supply Voltage Input High Voltage Input Low Voltage Ambient Temperature Voltage Min. Typ. Max. Unit 3.3V 3.3V 3.3 Com. 3.0 2.0 –0.3 0 3.3 — — — 3.6 VDD + 0.3 0.8 70 V V V °C Max. Unit 5 7 7 pF pF pF CAPACITANCE(1,2) Symbol Parameter CIN1 CIN2 CIO Input Capacitance: A0-A8 Input Capacitance: RAS, UCAS, LCAS, WE, OE Data Input/Output Capacitance: I/O0-I/O15 Notes: 1. Tested initially and after any design or process changes that may affect these parameters. 2. Test conditions: TA = 25°C, f = 1 MHz, VDD=3.3V ± 10%. Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 5 ISSI IS41LV16257B ® ELECTRICAL CHARACTERISTICS(1) (Recommended Operation Conditions unless otherwise noted.) Symbol Parameter Test Condition IIL Input Leakage Current IIO Output Leakage Current VOH VOL Output High Voltage Level Output Low Voltage Level Any input 0V < VIN < VDD Other inputs not under test = 0V Output is disabled (Hi-Z) 0V < VOUT < VDD IOH = –2 mA IOL = +2 mA ICC1 ICC2 ICC3 Stand-by Current: TTL Stand-by Current: CMOS Operating Current: Random Read/Write(2,3,4) Average Power Supply Current Operating Current: Fast Page Mode(2,3,4) Average Power Supply Current Refresh Current: RAS-Only(2,3) Average Power Supply Current Refresh Current: CBR(2,3,5) Average Power Supply Current ICC4 ICC5 ICC6 Speed Min. Max. Unit –10 10 µA –10 10 µA 2.4 — — 0.4 V V RAS, LCAS, UCAS ≥ VIH Com. 3.3V RAS, LCAS, UCAS ≥ VDD – 0.2V 3.3V RAS, LCAS, UCAS, -35 Address Cycling, tRC = tRC (min.) -60 — — — — 4 1 230 170 mA mA mA RAS = VIL, LCAS, UCAS, Cycling tPC = tPC (min.) -35 -60 — — 220 160 mA RAS Cycling, LCAS, UCAS ≥ VIH tRC = tRC (min.) -35 -60 — — 230 170 mA RAS, LCAS, UCAS Cycling tRC = tRC (min.) -35 -60 — — 230 170 mA Notes: 1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycles (RAS-Only or CBR) before proper device operation is assured. The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded. 2. Dependent on cycle rates. 3. Specified values are obtained with minimum cycle time and the output open. 4. Column-address is changed once each fast page cycle. 5. Enables on-chip refresh and address counters. 6 Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 ISSI IS41LV16257B ® AC CHARACTERISTICS(1,2,3,4,5,6) (Recommended Operating Conditions unless otherwise noted.) Symbol Parameter tRC tRAC tCAC tAA tRAS tRP tCAS tCP tCSH tRCD tASR tRAH tASC tCAH tAR tRAD tRAL tRPC tRSH tCLZ tCRP tOD tOE tOEHC tOEP tOES tRCS tRRH tRCH tWCH tWCR tWP tWPZ tRWL tCWL tWCS tDHR Random READ or WRITE Cycle Time Access Time from RAS(6, 7) Access Time from CAS(6, 8, 15) Access Time from Column-Address(6) RAS Pulse Width RAS Precharge Time CAS Pulse Width(26) CAS Precharge Time(9, 25) CAS Hold Time (21) RAS to CAS Delay Time(10, 20) Row-Address Setup Time Row-Address Hold Time Column-Address Setup Time(20) Column-Address Hold Time(20) Column-Address Hold Time (referenced to RAS) RAS to Column-Address Delay Time(11) Column-Address to RAS Lead Time RAS to CAS Precharge Time RAS Hold Time(27) CAS to Output in Low-Z(15, 29) CAS to RAS Precharge Time(21) Output Disable Time(19, 28, 29) Output Enable Time(15, 16) OE HIGH Hold Time from CAS HIGH OE HIGH Pulse Width OE LOW to CAS HIGH Setup Time Read Command Setup Time(17, 20) Read Command Hold Time (referenced to RAS)(12) Read Command Hold Time (referenced to CAS)(12, 17, 21) Write Command Hold Time(17, 27) Write Command Hold Time (referenced to RAS)(17) Write Command Pulse Width(17) WE Pulse Widths to Disable Outputs Write Command to RAS Lead Time(17) Write Command to CAS Lead Time(17, 21) Write Command Setup Time(14, 17, 20) Data-in Hold Time (referenced to RAS) -35 Min. Max. -60 Min. Max. Units 70 — — — 35 25 6 6 35 13 0 6 0 6 30 — 35 11 18 10K — 10K — — 24 — — — — — 110 — — — 60 40 10 10 60 20 0 10 0 10 45 — 60 15 30 10K — 10K — — 45 — — — — — ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 12 18 0 10 3 5 3 — 8 8 5 0 0 20 — — — — — 15 11 — — — — — 15 30 0 15 3 5 3 — 8 8 7 0 0 30 — — — — — 15 15 — — — — — ns ns ns ns ns ns ns ns ns ns ns ns ns 0 — 0 — ns 5 30 — — 10 50 — — ns ns 5 10 10 8 0 30 — — — — — — 10 10 15 15 0 46 — — — — — — ns ns ns ns ns ns (Continued) Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 7 ISSI IS41LV16257B ® AC CHARACTERISTICS(1,2,3,4,5,6) (Recommended Operating Conditions unless otherwise noted.) -35 Symbol Parameter tACH tOEH tDS tDH tRWC tRWD tCWD tAWD tPC tRASP tCPA tPRWC tOFF tWHZ tCLCH tCSR tCHR tORD tREF tT 8 Column-Address Setup Time to CAS Precharge during WRITE Cycle OE Hold Time from WE during READ-MODIFY-WRITE cycle(18) Data-In Setup Time(15, 22) Data-In Hold Time(15, 22) READ-MODIFY-WRITE Cycle Time RAS to WE Delay Time during READ-MODIFY-WRITE Cycle(14) CAS to WE Delay Time(14, 20) Column-Address to WE Delay Time(14) Fast Page Mode READ or WRITE Cycle Time(24) RAS Pulse Width Access Time from CAS Precharge(15) READ-WRITE Cycle Time(24) Output Buffer Turn-Off Delay from CAS or RAS(13,15,19, 29) Output Disable Delay from WE Last CAS going LOW to First CAS returning HIGH(23) CAS Setup Time (CBR REFRESH)(30, 20) CAS Hold Time (CBR REFRESH)(30, 21) OE Setup Time prior to RAS during HIDDEN REFRESH Cycle Refresh Period (512 Cycles) Transition Time (Rise or Fall)(2, 3) -60 Min. Max. Min. Max. Units 15 — 15 — ns 8 — 15 — ns 0 6 80 46 — — — — 0 10 140 80 — — — — ns ns ns ns 25 30 14 — — — 36 49 25 — — — ns ns ns 35 — 45 3 100K 20 — 10 60 — 60 3 100K 35 — 15 ns ns ns ns 3 10 10 — 3 10 15 — ns ns 8 8 0 — — — 10 10 0 — — — ns ns ns — 2 8 50 — 2 8 50 ms ns Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 IS41LV16257B ISSI ® Notes: 1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycle (RAS-Only or CBR) before proper device operation is assured. The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded. 2. VIH (MIN) and VIL (MAX) are reference levels for measuring timing of input signals. Transition times, are measured between VIH and VIL (or between VIL and VIH) and assume to be 1 ns for all inputs. 3. In addition to meeting the transition rate specification, all input signals must transit between VIH and VIL (or between VIL and VIH) in a monotonic manner. 4. If CAS and RAS = VIH, data output is High-Z. 5. If CAS = VIL, data output may contain data from the last valid READ cycle. 6. Measured with a load equivalent to one TTL gate and 50 pF. 7. Assumes that tRCD < tRCD (MAX). If tRCD is greater than the maximum recommended value shown in this table, tRAC will increase by the amount that tRCD exceeds the value shown. 8. Assumes that tRCD ≥ tRCD (MAX). 9. If CAS is LOW at the falling edge of RAS, data out will be maintained from the previous cycle. To initiate a new cycle and clear the data output buffer, CAS and RAS must be pulsed for tCP. 10. Operation with the tRCD (MAX) limit ensures that tRAC (MAX) can be met. tRCD (MAX) is specified as a reference point only; if tRCD is greater than the specified tRCD (MAX) limit, access time is controlled exclusively by tCAC. 11. Operation within the tRAD (MAX) limit ensures that tRCD (MAX) can be met. tRAD (MAX) is specified as a reference point only; if tRAD is greater than the specified tRAD (MAX) limit, access time is controlled exclusively by tAA. 12. Either tRCH or tRRH must be satisfied for a READ cycle. 13. tOFF (MAX) defines the time at which the output achieves the open circuit condition; it is not a reference to VOH or VOL. 14. tWCS, tRWD, tAWD and tCWD are restrictive operating parameters in LATE WRITE and READ-MODIFY-WRITE cycle only. If tWCS ≥ tWCS (MIN), the cycle is an EARLY WRITE cycle and the data output will remain open circuit throughout the entire cycle. If tRWD ≥ tRWD (MIN), tAWD ≥ tAWD (MIN) and tCWD ≥ tCWD (MIN), the cycle is a READ-WRITE cycle and the data output will contain data read from the selected cell. If neither of the above conditions is met, the state of I/O (at access time and until CAS and RAS or OE go back to VIH) is indeterminate. OE held HIGH and WE taken LOW after CAS goes LOW result in a LATE WRITE (OE-controlled) cycle. 15. Output parameter (I/O) is referenced to corresponding CAS input, I/O0-I/O7 by LCAS and I/O8-I/O15 by UCAS. 16. During a READ cycle, if OE is LOW then taken HIGH before CAS goes HIGH, I/O goes open. If OE is tied permanently LOW, a LATE WRITE or READ-MODIFY-WRITE is not possible. 17. Write command is defined as WE going low. 18. LATE WRITE and READ-MODIFY-WRITE cycles must have both tOD and tOEH met (OE HIGH during WRITE cycle) in order to ensure that the output buffers will be open during the WRITE cycle. The I/Os will provide the previously written data if CAS remains LOW and OE is taken back to LOW after tOEH is met. 19. The I/Os are in open during READ cycles once tOD or tOFF occur. 20. The first χCAS edge to transition LOW. 21. The last χCAS edge to transition HIGH. 22. These parameters are referenced to CAS leading edge in EARLY WRITE cycles and WE leading edge in LATE WRITE or READMODIFY-WRITE cycles. 23. Last falling χCAS edge to first rising χCAS edge. 24. Last rising χCAS edge to next cycle’s last rising χCAS edge. 25. Last rising χCAS edge to first falling χCAS edge. 26. Each χCAS must meet minimum pulse width. 27. Last χCAS to go LOW. 28. I/Os controlled, regardless UCAS and LCAS. 29. The 3 ns minimum is a parameter guaranteed by design. 30. Enables on-chip refresh and address counters. Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 9 ISSI IS41LV16257B ® FAST-PAGE-MODE READ CYCLE tRC tRAS tRP RAS tCSH tCRP tRSH tCAS tCLCH tRCD tRRH UCAS/LCAS tAR tRAD tASR ADDRESS tRAH tRAL tCAH tASC Row Column Row tRCS tRCH WE tAA tRAC tCAC tCLC I/O tOFF(1) Open Open Valid Data tOE tOD OE tOES Don't Care Note: 1. tOFF is referenced from rising edge of CAS. 10 Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 ISSI IS41LV16257B ® FAST PAGE MODE READ-MODIFY-WRITE CYCLE tRASP tRP RAS tPRWC tCAS tCSH tCAS tCRP tRCD tRSH tCAS tCP tCRP tCP UCAS/LCAS tAR tRAH tRAD tASC tASR ADDRESS tCPWD tRAL tCAH tCPWD Row tCAH tAR Column tASC Column tCWL tRWD tAWD tCWD tRCS tCAH tASC Column tCWL tRWL tCWL tAWD tCWD tWP tAWD tCWD tWP tWP WE tAA tAA tCAC tCAC tOEA OE tCAC tOEA tOEZ tOED tRAC tOEA tOEZ tOED OUT IN tOEZ tOED tDH tDH tDS tCLZ tCLZ I/O0-I/O15 tAA tDS OUT IN tDH tCLZ OUT tDS IN Don't Care Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 11 ISSI IS41LV16257B ® FAST-PAGE-MODE EARLY WRITE CYCLE (OE = DON'T CARE) tRC tRAS tRP RAS tCSH tCRP tRSH tCAS tCLCH tRCD UCAS/LCAS tAR tRAD tASR ADDRESS tRAH tRAL tCAH tACH tASC Row Column Row tCWL tRWL tWCR tWCS tWCH tWP WE tDHR tDS I/O tDH Valid Data Don't Care 12 Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 ISSI IS41LV16257B ® FAST-PAGE-MODE READ WRITE CYCLE (LATE WRITE and READ-MODIFY-WRITE Cycles) tRWC tRAS tRP RAS tCSH tCRP tRSH tCAS tCLCH tRCD UCAS/LCAS tAR tRAD tASR tRAH tRAL tCAH tASC tACH ADDRESS Row Column Row tRWD tCWL tRWL tCWD tRCS tAWD tWP WE tAA tRAC tCAC tCLZ I/O tDS Open Valid DOUT tOE tOD tDH Valid DIN Open tOEH OE Don't Care Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 13 ISSI IS41LV16257B ® FAST PAGE MODE EARLY WRITE CYCLE tRASP tRP RAS tCAS tCRP tRHCP tRSH tCAS tPC tCAS tCSH tRCD tCP tCRP tCP UCAS/LCAS tAR tRAL tRAH tRAD tASC tASR ADDRESS Row tCAH tCAH tAR Column tASC Column Column tCWL tWCS tWCH tCAH tASC tCWL tWCH tWCS tWCS tWP tCWL tWP tWCH tWP WE tWCR OE tDHR tDS I/O0-I/O15 tDH Valid DIN tDS tDH Valid DIN tDS tDH Valid DIN Don't Care 14 Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 ISSI IS41LV16257B ® AC WAVEFORMS READ CYCLE (With WE-Controlled Disable) RAS tCSH tCRP tRCD tCP tCAS UCAS/LCAS tAR tRAD tASR ADDRESS tRAH tCAH tASC Row tASC Column Column tRCS tRCH tRCS WE tAA tRAC tCAC tCLZ Open I/O tWHZ tCLZ Valid Data Open tOE tOD OE Don't Care RAS RAS-ONLY REFRESH CYCLE (OE, WE = DON'T CARE) tRC tRAS tRP RAS tCRP tRPC UCAS/LCAS tASR ADDRESS tRAH Row I/O Row Open Don't Care Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 15 ISSI IS41LV16257B ® CBR REFRESH CYCLE (Addresses; WE, OE = DON'T CARE) tRP tRAS tRP tRAS RAS tCHR tRPC tCP tCHR tRPC tCSR tCSR UCAS/LCAS Open I/O HIDDEN REFRESH CYCLE(1) (WE = HIGH; OE = LOW) tRAS tRP tRAS RAS tCRP tRCD tASR tRAD tRAH tASC tRSH tCHR UCAS/LCAS tAR ADDRESS Row tRAL tCAH Column tAA tRAC tOFF(2) tCAC tCLZ I/O Open Valid Data tOE Open tOD tORD OE Don't Care Notes: 1. A Hidden Refresh may also be performed after a Write Cycle. In this case, WE = LOW and OE = HIGH. 2. tOFF is referenced from rising edge of RAS or CAS, whichever occurs last. 16 Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 ISSI IS41LV16257B ® ORDERING INFORMATION: Commercial Range: 0oC to +70oC Speed (ns) 35 60 Order Part No. Package IS41LV16257B-35K IS41LV16257B-35KL IS41LV16257B-35T IS41LV16257B-35TL IS41LV16257B-60K IS41LV16257B-60KL IS41LV16257B-60T IS41LV16257B-60TL 400-mil SOJ 400-mil SOJ, Lead-free 400-mil TSOP (Type II) 400-mil TSOP (Type II), Lead-free 400-mil SOJ 400-mil SOJ, Lead-free 400-mil TSOP (Type II) 400-mil TSOP (Type II), Lead-free Integrated Silicon Solution, Inc. — 1-800-379-4774 Rev. B 04/22/05 17 ISSI PACKAGING INFORMATION ® 400-mil Plastic SOJ Package Code: K N Notes: 1. Controlling dimension: millimeters. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Reference document: JEDEC MS-027. N/2+1 E1 1 E N/2 SEATING PLANE D b A C A2 e Symbol No. Leads A A1 A2 B b C D E E1 E2 e B Millimeters Inches Min Max Min Max (N) 28 3.25 3.75 0.128 0.148 0.64 — 0.025 — 2.08 — 0.082 — 0.38 0.51 0.015 0.020 0.66 0.81 0.026 0.032 0.18 0.33 0.007 0.013 18.29 18.54 0.720 0.730 11.05 11.30 0.435 0.445 10.03 10.29 0.395 0.405 9.40 BSC 0.370 BSC 1.27 BSC 0.050 BSC A1 E2 Millimeters Min Max Inches Min Max Millimeters Min Max 32 3.25 3.75 0.64 — 2.08 — 0.38 0.51 0.66 0.81 0.18 0.33 20.82 21.08 11.05 11.30 10.03 10.29 9.40 BSC 1.27 BSC 0.128 0.148 0.025 — 0.082 — 0.015 0.020 0.026 0.032 0.007 0.013 0.820 0.830 0.435 0.445 0.395 0.405 0.370 BSC 0.050 BSC 3.25 3.75 0.64 — 2.08 — 0.38 0.51 0.66 0.81 0.18 0.33 23.37 23.62 11.05 11.30 10.03 10.29 9.40 BSC 1.27 BSC Inches Min Max 36 0.128 0.148 0.025 — 0.082 — 0.015 0.020 0.026 0.032 0.007 0.013 0.920 0.930 0.435 0.445 0.395 0.405 0.370 BSC 0.050 BSC Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 10/29/03 ISSI PACKAGING INFORMATION Millimeters Inches Symbol Min Max Min Max No. Leads (N) 40 A 3.25 3.75 0.128 0.148 A1 0.64 — 0.025 — A2 2.08 — 0.082 — B 0.38 0.51 0.015 0.020 b 0.66 0.81 0.026 0.032 C 0.18 0.33 0.007 0.013 D 25.91 26.16 1.020 1.030 E 11.05 11.30 0.435 0.445 E1 10.03 10.29 0.395 0.405 E2 9.40 BSC 0.370 BSC e 1.27 BSC 0.050 BSC Millimeters Min Max Inches Min Max Millimeters Min Max 42 3.25 3.75 0.64 — 2.08 — 0.38 0.51 0.66 0.81 0.18 0.33 27.18 27.43 11.05 11.30 10.03 10.29 9.40 BSC 1.27 BSC 0.128 0.148 0.025 — 0.082 — 0.015 0.020 0.026 0.032 0.007 0.013 1.070 1.080 0.435 0.445 0.395 0.405 0.370 BSC 0.050 BSC 3.25 3.75 0.64 — 2.08 — 0.38 0.51 0.66 0.81 0.18 0.33 28.45 28.70 11.05 11.30 10.03 10.29 9.40 BSC 1.27 BSC ® Inches Min Max 44 0.128 0.148 0.025 — 0.082 — 0.015 0.020 0.026 0.032 0.007 0.013 1.120 1.130 0.435 0.445 0.395 0.405 0.370 BSC 0.050 BSC Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. 2 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 10/29/03 ISSI PACKAGING INFORMATION Plastic TSOP Package Code: T (Type II) N N/2+1 E1 E 1 Notes: 1. Controlling dimension: millimeters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D1 and E do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within 0.004 inches at the seating plane. N/2 D SEATING PLANE A e Plastic TSOP (T - Type II) (MS 25) Millimeters Inches Symbol Min Max Min Max Ref. Std. N 24/26 A 1.20 0.0472 A1 0.05 0.15 0.002 0.0059 b 0.30 0.51 0.012 0.0201 c 0.12 0.21 0.005 0.0083 D 17.01 17.27 0.670 0.6899 E1 7.49 7.75 0.295 0.3051 e 1.27 BSC 0.050 BSC E 9.02 9.42 0.462 0.4701 L 0.40 0.60 0.016 0.0236 α 0° 5° 0° 5° Integrated Silicon Solution, Inc. PK13197T40 Rev. C 08/013/99 ® b L A1 Plastic TSOP (T - Type II) (MS 24) Millimeters Inches Symbol Min Max Min Max Ref. Std. N 40/44 A 1.20 0.0472 A1 0.05 0.15 0.002 0.0059 b 0.30 0.45 0.012 0.0157 c 0.12 0.21 0.005 0.0083 D 18.31 18.51 0.721 0.7287 E1 10.06 10.26 0.396 0.4040 e 0.80 BSC 0.031 BSC E 11.56 11.96 0.455 0.4709 L 0.40 0.60 0.016 0.0236 α 0° 8° 0° 8° α c Plastic TSOP (T - Type II) (MS 24) Millimeters Inches Symbol Min Max Min Max Ref. Std. N 44/50 A 1.20 0.0472 A1 0.05 0.15 0.002 0.0059 b 0.30 0.45 0.012 0.0157 c 0.12 0.21 0.005 0.0083 D 20.85 21.05 0.821 0.8287 E1 10.06 10.26 0.396 0.4040 e 0.80 BSC 0.031 BSC E 11.56 11.96 0.455 0.4709 L 0.40 0.60 0.016 0.0236 α 0° 8° 0° 8°