3.5x2.8 mm SMD CHIP LED LAMP Part Number: AA3529SYS/L PRELIMINARY SPEC Super Bright Yellow Features Description zSINGLE COLOR. The source color devices are made with AlInGaP Light zSUITABLE FOR ALL SMT ASSEMBLY AND SOLDER Emitting Diode. PROCESS. zAVAILABLE ON TAPE AND REEL. zIDEAL FOR BACKLIGHTING. zWHITE SMD PACKAGE, SILICONE RESIN. zLOW THERMAL RESISTANCE. zPACKAGE: 1500PCS / REEL. zMOISTURE SENSITIVITY LEVEL : LEVEL 2a. zRoHS COMPLIANT. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAH5250 REV NO: V.4 DATE: JAN/14/2008 PAGE: 1 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002971 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might leads to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Outside impact may scratch the silicone lens or damage the internal circuitry. 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. SPEC NO: DSAH5250 REV NO: V.4 DATE: JAN/14/2008 PAGE: 2 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002971 Selection Guide Dice Part No. AA3529SYS/L Iv (mcd) [2] @ 150mA Lens Type Super Bright Yellow (AlInGaP) WATER CLEAR Φv (mlm) [2] @ 150mA Viewing Angle [1] Min. Typ. Min. Typ. 2θ1/2 1600 3000 3000 6000 120° Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. 2. Luminous intensity / luminous flux: +/-15%. Electrical / Optical Characteristics at TA=25°C Symbol Parameter Device Typ. λpeak Peak Wavelength Super Bright Yellow λD [1] Dominant Wavelength Δλ1/2 Max. Units Test Conditions 590 nm IF=150mA Super Bright Yellow 590 nm IF=150mA Spectral Line Half-width Super Bright Yellow 20 nm IF=150mA C Capacitance Super Bright Yellow 20 pF VF=0V;f=1MHz VF [2] Forward Voltage Super Bright Yellow 2.8 3.2 V IF=150mA IR Reverse Current Super Bright Yellow 10 uA VR=5V Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. Absolute Maximum Ratings at TA=25°C Parameter Super Bright Yellow Units Power dissipation 480 mW DC Forward Current 150 mA Peak Forward Current [1] 200 mA 5 V Reverse Voltage Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAH5250 REV NO: V.4 DATE: JAN/14/2008 PAGE: 3 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002971 Super Bright Yellow AA3529SYS/L SPEC NO: DSAH5250 REV NO: V.4 DATE: JAN/14/2008 PAGE: 4 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002971 AA3529SYS/L Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Tape Specifications (Units : mm) SPEC NO: DSAH5250 REV NO: V.4 DATE: JAN/14/2008 PAGE: 5 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002971 PACKING & LABEL SPECIFICATIONS AA3529SYS/L SPEC NO: DSAH5250 REV NO: V.4 DATE: JAN/14/2008 PAGE: 6 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002971