NICHIA NESB008AT

No. STSE-CC6002A
<Cat.No.060113>
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED
MODEL : NESB008AT
NICHIA CORPORATION
-0-
Nichia STSE-CC6002A
<Cat.No.060113>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Reverse Voltage
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
IF
IFP
VR
PD
Topr
Tstg
Tsld
Absolute Maximum Rating
30
80
5
105
-30 ~ + 85
-40 ~ +100
Reflow Soldering : 260°C
Hand Soldering : 350°C
(Ta=25°C)
Unit
mA
mA
V
mW
°C
°C
for 10sec.
for 3sec.
IFP Conditions : Pulse Width <
= 10msec. and Duty <
= 1/10
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Reverse Current
IR
Luminous Intensity
Iv
x
Chromaticity Coordinate
y
-
Condition
IF=20[mA]
VR= 5[V]
IF=20[mA]
IF=20[mA]
IF=20[mA]
Typ.
(3.2)
(180)
0.133
0.075
(Ta=25°C)
Max.
Unit
3.5
V
50
µA
mcd
-
Min.
213
150
104
(Ta=25°C)
Max.
Unit
300
mcd
213
mcd
150
mcd
Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Luminous Intensity
Rank U
Rank T
Rank S
Symbol
Iv
Iv
Iv
Condition
IF=20[mA]
IF=20[mA]
IF=20[mA]
Luminous Intensity Measurement allowance is ± 10%.
Color Rank
x
y
0.11
0.04
(IF=20mA,Ta=25°C)
Rank W
0.11
0.15
0.15
0.10
0.10
0.04
Color Coordinates Measurement allowance is ± 0.01.
One delivery will include up to one color rank and three luminous intensity ranks of the products.
The quantity-ratio of the ranks is decided by Nichia.
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
-1-
Nichia STSE-CC6002A
<Cat.No.060113>
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ;
Package
Encapsulating Resin
Electrodes
:
:
:
Heat-Resistant Polymer
Silicone Resin (with Diffused)
Ag Plating Copper Alloy
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
-U
- Year
( 5 for 2005, 6 for 2006 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Intensity
-2-
B for Nov. )
Nichia STSE-CC6002A
<Cat.No.060113>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Steady State Operating Life
Condition 1
Steady State Operating Life
Condition 2
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
JEITA ED-4701
400 403
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Note
2 times
Number of
Damaged
0/50
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
1 time
over 95%
20 cycles
0/50
100 cycles
0/50
10 cycles
0/50
1000 hrs.
0/50
Ta=60°C, RH=90%
1000 hrs.
0/50
Ta=-40°C
1000 hrs.
0/50
Ta=25°C, IF=20mA
1000 hrs.
0/50
Ta=25°C, IF=30mA
500 hrs.
0/50
Ta=85°C, IF=5mA
1000 hrs.
0/50
60°C, RH=90%, IF=15mA
500 hrs.
0/50
Ta=-30°C, IF=20mA
1000 hrs.
0/50
48min.
0/50
1 time
0/50
1 time
0/50
Substrate Bending
JEITA ED-4702
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3direction, 4cycles
3mm, 5 ± 1 sec.
Adhesion Strength
JEITA ED-4702
5N,
10 ± 1 sec.
0/50
(2) CRITERIA FOR JUDGING DAMAGE
Item
Symbol
Forward Voltage
VF
Reverse Current
IR
Luminous Intensity
IV
*) U.S.L. : Upper Standard Level
Test Conditions
Criteria for Judgement
Min.
Max.
IF=20mA
U.S.L.*)
VR=5V
U.S.L.*)
IF=20mA
L.S.L.**) 0.7
**) L.S.L. : Lower Standard Level
-3-
1.1
2.0
Nichia STSE-CC6002A
<Cat.No.060113>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag with a zipper.
A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less.
The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag
and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrodes and leadframes are silver plated copper alloy. The silver surface may be
affected by environments which contain corrosive substances. Please avoid conditions which may
cause the LED to corrode, tarnish or discolor. This corrosion or discoloration might lower solderability
or might affect on optical characteristics.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
-4-
Nichia STSE-CC6002A
<Cat.No.060113>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180 ~ 200°C
120 ~ 150°C
120 sec. Max.
120 sec. Max.
240°C Max.
260°C Max.
Hand Soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
10 sec. Max.
10 sec. Max.
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N2 reflow is recommended.)
After reflow soldering rapid cooling should be avoided.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
1~ 5°C / sec.
240°C Max.
10sec. Max.
1~ 5°C / sec.
Pre-heating
180 ~ 200°C 60sec.Max.
Above 220°C
260°C Max.
10sec. Max.
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
1.0
1.4
0.9
1.4
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
(5) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
-5-
Nichia STSE-CC6002A
<Cat.No.060113>
(6) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the leak current remarkably
increases, the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
(7) Others
· Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating
when using the LEDs with matrix drive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-6-
Nichia STSE-CC6002A
<Cat.No.060113>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
550
0.7
560
0.6
570
500
580
y
0.5
590
0.4
600
610
0.3
620
630
490
0.2
480
0.1
470
460
W
0
0
0.1
0.2
0.3
0.4
x
½ Color Coordinates Measurement allowance is ± 0.01.
-7-
0.5
0.6
0.7
0.8
5
2.0
1.5
1.0
0.5
0
2.8 3.2 3.6 4.0 4.4
Forward Voltage VF (V)
Ta=25°C
2.5
0
20
40
60
80 100
Forward Current IFP (mA)
Ambient Temperature vs.
Forward Voltage
Ambient Temperature vs.
Relative Luminosity
3.8
2.0
-8-
3.6
IFP=20mA
IFP=5mA
3.4
3.2
3.0
2.8
2.6
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
IFP=20mA
1.0
0.5
0.2
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Allowable Forward Current IFP (mA)
Relative Luminosity (a.u.)
10
Relative Luminosity (a.u.)
Forward Current IFP (mA)
20
1
2.4
Forward Voltage VF (V)
Ta=25°C
200
Ta=25°C
100
80
50
30
20
10
1
5 10 20
50 100
Duty Ratio (%)
Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
3.0
100
50
Duty Ratio vs.
Allowable Forward Current
Forward Current vs.
Relative Luminosity
Forward Voltage vs.
Forward Current
40
30
20
10
8.5
0
0
20
40
60
80 100
Ambient Temperature Ta (°C)
NICHIA CORPORATION
NESB008A
Title
CHARACTERISTICS
No.
051227546991
Nichia STSE-CC6002A
<Cat.No.060113>
Model
Forward Current vs.
Chromaticity Coordinate (λD)
Relative Emission Intensity (a.u.)
Ta=25°C
0.09
5mA(471.4nm)
0.08
20mA(470.6nm)
50mA(470.1nm)
0.07
80mA(469.9nm)
0.06
0.12
0.13
0.14
0.15
-9-
Dominant Wavelength λ D (nm)
x
Forward Current vs.
Dominant Wavelength
0.16
476
Ta=25°C
474
472
470
468
466
464
1
5 10
30 50 100
Forward Current IFP (mA)
Ta=25°C
IF=20mA
1.0
0.8
0.6
0.4
0.2
0
350 400 450 500 550 600 650
Wavelength λ (nm)
Ambient Temperature vs.
Dominant Wavelength
Dominant Wavelengthλ D (nm)
y
1mA(472.3nm)
1.2
Directivity
474
0°
1.0
476
IFP=20mA
Relative Luminosity (a.u.)
0.10
Spectrum
472
470
468
466
464
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Ta=25°C
IFP=20mA
10° 20°
30°
40°
50°
60°
0.5
70°
80°
0
90°
60°
30°
Radiation Angle
NICHIA CORPORATION
0.5
90°
1.0
NESB008A
Title
CHARACTERISTICS
No.
051104547001
Nichia STSE-CC6002A
<Cat.No.060113>
Model
0°
2.8
2.5
(2)
K
0.8
0.5
ITEM
MATERIALS
PACKAGE
ENCAPSULATING RESIN
ELECTRODES
Heat-Resistant Polymer
Silicone Resin (with Diffused)
Ag Plating Copper Alloy
Cathode
0.3
Anode
(NOTE) The LED may have flash/flange which exceeds
the tolerance of this print.
Model
NICHIA CORPORATION
Title
No.
NESB008A
OUTLINE DIMENSIONS
051104547011
Unit
mm
15/1
Scale
Allow
±0.1
Nichia STSE-CC6002A
<Cat.No.060113>
0.39
(0.05)
-10-
0.65
A
1.2
0.75
(0.65)
Cathode mark
C 0.15
1.2
0.75
2.4
4±0.1
φ 1.5+0.1
-0
1.75±0.1
Taping part
2±0.05
0.2±0.05
Reel part
φ 180+0
-3
11.4±1
9±0.3
4±0.1
φ 0.5±0.1
1.35±0.1
0.95±0.1
φ 60+1
-0
φ2
1 ±0.8
3.05±0.1
8+0.3
- 0.1
(2.75)
3.5±0.05
Cathode mark
±0.2
φ 13
Label
XXXX LED
TYPE NxSx008xT
LOT XXXXXX-U„
QTY
pcs
Reel End of tape
No LEDs
LEDs mounting part
No LEDs
-11Top cover
tape
Pull direction
Embossed carrier tape
Reel Lead Min.40mm (No LEDs)
Reel Lead Min.160mm
(No LEDs is more than 40)
Reel Lead Min.400mm
Model
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
NICHIA CORPORATION
Title
No.
NxSx008xT
TAPING DIMENSIONS
051104424163
Unit
mm
Scale
Allow
Nichia STSE-CC6002A
<Cat.No.060113>
3,500pcs/Reel
Nichia STSE-CC6002A
<Cat.No.060113>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Label
NICHIA
Seal
XXXX LED
TYPE
LOT
QTY
NxSx008xT
xxxxxx-U„
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture proof foil bag
Moisture
absorbent material
The box is partitioned with the
cardboard.
Label
NICHIA
Nichia
XXXX LED
LED
TYPE
RANK
QTY
NxSx008xT
U„
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag
Cardboard box
Cardboard box S
Cardboard box M
Cardboard box L
Reel/bag
1reel
Quantity/bag (pcs)
3,500 MAX.
Dimensions (mm)
291¯237¯120¯8t
259¯247¯243¯5t
444¯262¯259¯8t
NICHIA CORPORATION
-12-
Reel/box
7reel MAX.
15reel MAX.
30reel MAX.
Quantity/box (pcs)
24,500 MAX.
52,500 MAX.
105,000 MAX.
Model
NxSx008xT
Title
PACKING
No.
051104541702