NICHIA NSCB505CT

No. STSE-CC3066A
<Cat.No.031031>
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED
MODEL : NSCB505CT
NICHIA CORPORATION
-0-
Nichia STSE-CC3066A
<Cat.No.031031>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
IF
IFP
IR
PD
Topr
Tstg
Tsld
Absolute Maximum Rating
30
100
85
120
-40 ~ + 85
-40 ~ +100
Reflow Soldering : 260°C
Hand Soldering : 350°C
(Ta=25°C)
Unit
mA
mA
mA
mW
°C
°C
for 10sec.
for 3sec.
IFP Conditions : Pulse Width <
= 1/10
= 10msec. and Duty <
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Rank U
Iv
Luminous Intensity Rank T
Iv
Rank S
Iv
Condition
IF=20[mA]
IF=20[mA]
IF=20[mA]
IF=20[mA]
Min.
213
150
104
Typ.
3.6
252
178
126
(Ta=25°C)
Max.
Unit
4.0
V
300
mcd
213
mcd
150
mcd
! Luminous Intensity Measurement allowance is ± 10%.
Color Rank
x
y
0.11
0.04
(IF=20mA,Ta=25°C)
Rank W
0.11
0.15
0.15
0.10
0.10
0.04
! Color Coordinates Measurement allowance is ± 0.01.
! One delivery will include up to one color rank and three luminous intensity ranks of the products.
The quantity-ratio of the ranks is decided by Nichia.
2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ;
Package
:
Encapsulating Resin :
Electrodes
:
-1-
Heat-Resistant Polymer
Epoxy Resin (with Diffused)
Ag Plating Copper Alloy
Nichia STSE-CC3066A
<Cat.No.031031>
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
"#$$$$ - !%
" - Year
( 2 for 2002, 3 for 2003 )
# - Month ( 1 for Jan., 9 for Sep., A for Oct.,
$$$$ - Nichia's Product Number
! - Ranking by Color Coordinates
% - Ranking by Luminous Intensity
-2-
B for Nov. )
Nichia STSE-CC3066A
<Cat.No.031031>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Standard
Test Method
JEITA ED-4701
300 301
Number of
Damaged
0/22
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Note
2 times
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
-40°C ~ 100°C
1min. (10sec.) 1min.
(Pre treatment 30°C,70%,168hrs.)
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
1 time
over 95%
100 cycles
0/100
100 cycles
0/100
10 cycles
0/100
1000 hrs.
0/100
Ta=60°C, RH=90%
1000 hrs.
0/100
Ta=-40°C
1000 hrs.
0/100
Steady State Operating Life
Ta=25°C, IF=30mA
500 hrs.
0/100
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Permanence of Marking
Ta=85°C, IF=7.5mA
500 hrs.
0/100
60°C, RH=90%, IF=20mA
500 hrs.
0/100
Ta=-40°C, IF=20mA
1000 hrs.
0/100
1 time
0/22
4 times
0/10
3 times
3 times
0/10
0/22
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Vibration
Drop
Electrostatic Discharge
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
JEITA ED-4701
500 501
JEITA ED-4701
400 403
JEITA ED-4701
300 304
Solvent : Isopropyl Alcohol
Solvent Temperature : 20 ~ 25°C
Dipping Time : 5 min.
200m/s2, 100 ~ 2000Hz (Sweep 4min.)
48min., 3directions
75cm
R=1.5kΩ, C=100pF
Test Voltage=2kV
Negative/Positive
(2) CRITERIA FOR JUDGING THE DAMAGE
Criteria for Judgement
Item
Symbol Test Conditions
Min.
Max.
Forward Voltage
VF
IF=20mA
U.S.L.*)$ 1.1
Luminous Intensity
IV
IF=20mA
L.S.L.**)$ 0.7
*) U.S.L. : Upper Standard Level
**) L.S.L. : Lower Standard Level
-3-
0/22
Nichia STSE-CC3066A
<Cat.No.031031>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag with a zipper.
A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less.
The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag
and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrode sections are comprised of a silver plated copper alloy. The silver surface may be
affected by environments which contain corrosive gases and so on. Please avoid conditions which
may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty
during soldering operations. It is recommended that the User use the LEDs as soon as possible.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
-4-
Nichia STSE-CC3066A
<Cat.No.031031>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180 ~ 200°C
120 ~ 150°C
120 sec. Max.
120 sec. Max.
240°C Max.
260°C Max.
Hand Soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
10 sec. Max.
10 sec. Max.
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N2 reflow is recommended.)
! After reflow soldering rapid cooling should be avoided.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
1~ 5°C / sec.
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
240°C Max.
10sec. Max.
1~ 5°C / sec.
Pre-heating
180 ~ 200°C 60sec.Max.
Above 220°C
260°C Max.
10sec. Max.
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
0.8
2.9
(0.25)
2.0
(1.5)
2.9
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used. It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
(5) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
-5-
Nichia STSE-CC3066A
<Cat.No.031031>
(6) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded.
It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,
or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
(7) Others
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-6-
Nichia STSE-CC3066A
<Cat.No.031031>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
550
0.7
560
0.6
570
500
580
y
0.5
590
0.4
600
610
0.3
620
630
490
0.2
480
0.1
W
470
460
0
0
0.1
0.2
0.3
0.4
x
! Color Coordinates Measurement allowance is ± 0.01.
-7-
0.5
0.6
0.7
0.8
3.5
100
Relative Luminosity (a.u.)
Forward Current IFP (mA)
200
Ta=25°C
50
20
10
5
1
2.5
! Ambient Temperature vs.
Forward Voltage
1.5
1.0
0.5
0
20 40 60 80 100 120
Forward Current IFP (mA)
2.0
IFP=60mA
IFP=20mA
IFP=5mA
4.6
4.2
3.8
3.4
3.0
2.6
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Relative Luminosity (a.u.)
Forward Voltage VF (V)
-8-
5.0
2.0
! Ambient Temperature vs.
Relative Luminosity
5.8
5.4
2.5
0
3.0 3.5 4.0 4.5 5.0
Forward Voltage VF (V)
Ta=25°C
3.0
IFP=20mA
1.0
0.5
0.2
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
! Duty Ratio vs.
Allowable Forward Current
Allowable Forward Current IFP (mA)
! Forward Current vs.
Relative Luminosity
200
Ta=25°C
100
50
30
20
10
1
5 10 20
50 100
Duty Ratio (%)
! Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
! Forward Voltage vs.
Forward Current
40
30
20
10
0
0
20
40
60
80 100
Ambient Temperature Ta (°C)
Title
TYP.CHARACTERISTICS
No.
031021317871
<Cat.No.031031>
NICHIA CORPORATION
NSCB505C
Nichia STSE-CC3066A
Model
1mA(473nm)
0.09
y
5mA(472nm)
20mA(470nm)
50mA(468nm)
100mA(467nm)
0.07
0.05
0.03
0.10 0.12 0.14 0.16 0.18 0.20
-9-
Dominant Wavelength λ D (nm)
x
! Forward Current vs.
Dominant Wavelength
474
Ta=25°C
473
472
471
470
469
468
467
466
1
5 10 20
50 100
Forward Current IFP (mA)
1.2
Ta=25°C
IF=20mA
1.0
0.8
0.6
0.4
0.2
0
350 400 450 500 550 600 650
Wavelength λ (nm)
! Ambient Temperature vs.
Dominant Wavelength
! Directivity (NSCB505C)
474
Y
0°
1.0
476
Relative Luminosity (a.u.)
Ta=25°C
0.11
Relative Emission Intensity (a.u.)
0.13
! Spectrum
Dominant Wavelength λ D (nm)
! Forward Current vs.
Chromaticity Coordinate (λD)
IFP=20mA
472
470
468
466
464
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
X
10° 20°
X
30°
Ta=25°C
IF=20mA
X-X
Y-Y
Y
40°
50°
60°
0.5
70°
80°
0
90°
60°
30°
Radiation Angle
0°
NSCB505C
Title
TYP.CHARACTERISTICS
No.
031021317881
<Cat.No.031031>
NICHIA CORPORATION
90°
1.0
Nichia STSE-CC3066A
Model
0.5
4.2
Internal circuit
3
(0.7)
A
ITEM
MATERIALS
PACKAGE
ENCAPSULATING RESIN
ELECTRODES
Heat-Resistant Polymer
Epoxy Resin (with Diffused)
Ag Plating Copper Alloy
! NSCB505C has a protection device built in as a protection
circuit against static electricity.
(1)
4.5
Protection device
K
(0.5)
0.63
3
(2.2)
-10-
2.5
LED
(4)
1
Cathode mark
1.25
Cathode
1.55
(1.2)
4.3
1.55
Anode
Model
NICHIA CORPORATION
Title
No.
NSCB505C
OUTLINE DIMENSIONS
030826314371
Unit
mm
10/1
Scale
Allow
±0.2
Nichia STSE-CC3066A
<Cat.No.031031>
1.8
2.65
Taping part
φ 1.5+0.1
-0
8±0.1
2±0.1
4±0.1
1.75±0.1
Reel part
17.5±1
13.5±0.5
φ 330±0.2
0.3±0.05
φ 1.5+0.2
-0
3.25±0.1
±
φ 13
3.35±0.1
φ 80±1
φ2
1 ±0.8
4.75±0.1
12+0.2
- 0.1
5.5±0.05
Cathode mark
0.2
Label
XXXX LED
TYPE NSCx505xT
LOT XXXXXX-!!
QTY
pcs
Reel end of tape
No LEDs
LEDs mounting part
No LEDs
-11-
Pull direction
Top cover
tape
Embossed carrier tape
Reel Lead Min.40mm (No LEDs)
Reel Lead Min.320mm(No LEDs is more than 40)
Reel Lead Min.400mm
Model
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
NICHIA CORPORATION
Title
No.
NSCx505xT
TAPING DIMENSIONS
031021202553
Unit
mm
Scale
Allow
Nichia STSE-CC3066A
<Cat.No.031031>
2,500pcs/Reel
Nichia STSE-CC3066A
<Cat.No.031031>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Moisture proof foil bag
Label
NICHIA
Seal
XXXX LED
TYPE
LOT
QTY
NSCx505xT
xxxxxx-!"
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture
absorbent material
Empty space in the box is filled
with cushion material.
Label
NICHIA
Nichia
LED
XXXX LED
TYPE
RANK
QTY
NSCx505xT
!"
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag
Reel/bag
1reel
Cardboard box
Cardboard box S
Dimensions (mm)
380!380!135!4t
Cardboard box L
400!400!560!4t
Quantity/bag (pcs)
2,500 MAX.
Reel/box
4reel MAX.
Cardboard box S!3
12reel MAX.
Model
NICHIA CORPORATION
-12-
Quantity/box (pcs)
10,000 MAX.
30,000 MAX.
NSCx505xT
Title
PACKING
No.
031021202563