Nichia STS-DA1-0293 <Cat.No.080620> SPECIFICATIONS FOR NICHIA CHIP TYPE RED MODEL : NSSR064T NICHIA CORPORATION -0- LED Nichia STS-DA1-0293 <Cat.No.080620> 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature IFP Conditions : Symbol IF IFP IR PD Topr Tstg Tj Tsld Pulse Width ≤ 10msec. (2) Thermal Characteristics Item Symbol Rja Heat resistance Rjs Absolute Maximum Rating 40 160 85 100 -40 ~ +100 -40 ~ +100 110 Reflow Soldering : 260°C Hand Soldering : 350°C and (Ta=25°C) Unit mA mA mA mW °C °C °C for 10sec. for 3sec. Duty ≤ 1/10 (Ta=25°C) Unit °C/W °C/W Typ. 300 120 Rja = Heat resistance from Dice to Ambient temperature (Ta) Rjs = Heat resistance from Dice to Solder temperature of Cathode Side (Ts) Using Nichia standard circuit board FR4, t=1.6mm, Copper foil, t=35µm (3) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Intensity Iv x Chromaticity Coordinate y - Condition IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA] Typ. (2.1) (640) 0.700 0.299 (Ta=25°C) Max. Unit 2.5 V mcd - Please refer to CIE 1931 chromaticity diagram. (4) Ranking Item Luminous Intensity Rank T Rank S Rank R Symbol Iv Iv Iv Condition IF=20[mA] IF=20[mA] IF=20[mA] Luminous Intensity Measurement allowance is ± 10%. -1- Min. 720 500 360 (Ta=25°C) Max. Unit 1000 mcd 720 mcd 500 mcd Nichia STS-DA1-0293 <Cat.No.080620> Color Rank x y 0.67 0.27 (IF=20mA,Ta=25°C) Rank R 0.67 0.73 0.73 0.33 0.33 0.27 Color Coordinates Measurement allowance is ± 0.01. Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia. 2. INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to “CHARACTERISTICS” on the following pages. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to “OUTLINE DIMENSIONS” on the following page. Package : Heat-Resistant Polymer Material as follows ; Encapsulating Resin : Silicone Resin (with Diffused) Electrodes : Ag Plating Copper Alloy 4.PACKAGING · The LEDs are packed in cardboard boxes after taping. Please refer to “TAPING DIMENSIONS” and “PACKING” on the following pages. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; -U - Year ( 7 for 2007, 8 for 2008 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number U - Ranking by Color Coordinates - Ranking by Luminous Intensity -2- B for Nov. ) Nichia STS-DA1-0293 <Cat.No.080620> 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Standard Test Method JEITA ED-4701 300 301 Number of Damaged 0/22 Test Conditions Tsld=260°C, 10sec. (Pre treatment 30°C,70%,168hrs.) Note 2 times Tsld=215 ± 5°C, 3sec. (using flux, Lead Solder) -40°C ~ 100°C 1min. (10sec.) 1min. (Pre treatment 30°C,70%,168hrs.) -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle Ta=100°C 1 time over 95% 100 cycles 0/100 100 cycles 0/100 10 cycles 0/100 1000 hrs. 0/100 Ta=60°C, 1000 hrs. 0/100 Ta=-40°C 1000 hrs. 0/100 Steady State Operating Life Ta=25°C, IF=40mA 1000 hrs. 0/100 Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking Ta=85°C, IF=30mA 1000 hrs. 0/100 60°C, RH=90%, IF=20mA 1000 hrs. 0/100 Ta=-40°C, IF=20mA 1000 hrs. 0/100 1 time 0/22 48min. 0/10 3 times 0/10 3 times Negative/Positive 0/22 Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Vibration JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 JEITA ED-4701 500 501 JEITA ED-4701 400 403 Drop Electrostatic Discharge JEITA ED-4701 300 304 RH=90% Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25°C Dipping Time : 5 min. 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles 75cm R=1.5kΩ, C=100pF Test Voltage=2kV (2) CRITERIA FOR JUDGING DAMAGE Criteria for Judgement Item Forward Voltage Luminous Intensity Condition 1 Luminous Intensity Condition 2 Symbol Test Conditions Min. VF IF=20mA - IV IF=20mA L.S.L.**) 0.7 - IV IF=20mA L.S.L.**) 0.5 - *) U.S.L. : Upper Standard Level Max. U.S.L.*) **) L.S.L. : Lower Standard Level These test items are judged by the criteria of Luminous Intensity Condition 2. -3- 1.1 0/22 Nichia STS-DA1-0293 <Cat.No.080620> 7.CAUTIONS (1) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. · The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 ± 5°C · This product has silver plated metal parts that are inside and/or outside the package body. The silver plating becomes tarnished when being exposed to an environment which contains corrosive gases. Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics. Please do not expose the LEDs to corrosive atmosphere during storage. · After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above should be taken into consideration when designing. · Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. -4- Nichia STS-DA1-0293 <Cat.No.080620> (3) Recommended circuit · In designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED. It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the absolute maximum rating. (B) (A) ... ... · This product should be operated in forward bias. A driving circuit must be designed so that the product is not subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. (4) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · The operating current should be decided after considering the ambient maximum temperature of LEDs. -5- Nichia STS-DA1-0293 <Cat.No.080620> (5) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. · Recommended soldering conditions Reflow Soldering Hand Soldering Lead Solder Lead-free Solder Pre-heat 120 ~ 150°C 180 ~ 200°C Temperature 350°C Max. Pre-heat time 120 sec. Max. 120 sec. Max. Soldering time 3 sec. Max. Peak 240°C Max. 260°C Max. Soldering time 10 sec. Max. 10 sec. Max. Condition refer to refer to (one time only) temperature Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. <1 : Lead Solder> <2 : Lead-free Solder> 2.5 ~ 5°C / sec. 2.5 ~ 5°C / sec. Pre-heating 120 ~ 150°C 60sec.Max. Above 200°C 1 ~ 5°C / sec. 240°C Max. 10sec. Max. 1 ~ 5°C / sec. Pre-heating 180 ~ 200°C 60sec.Max. 260°C Max. 10sec. Max. Above 220°C 120sec.Max. 120sec.Max. [Recommended soldering pad design] Use the following conditions shown in the figure. 9.5 4 4 4 1.5 2.6 1.5 (Unit : mm) : Solder resist · Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. · The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. -6- Nichia STS-DA1-0293 <Cat.No.080620> (6) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (7) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. (8) Others · NSSR064 complies with RoHS Directive. · The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -7- Nichia STS-DA1-0293 <Cat.No.080620> ICI Chromaticity Diagram 0.9 520 530 0.8 540 510 550 0.7 560 0.6 570 500 0.5 y 580 590 0.4 600 610 0.3 R 490 620 630 0.2 480 0.1 470 460 0 0 0.1 0.2 0.3 0.4 x Color Coordinates Measurement allowance is ± 0.01. -8- 0.5 0.6 0.7 0.8 10 5 1.7 2.2 2.7 3.2 3.7 Forward Voltage VF (V) Ta=25°C 4 3 2 1 0 0 50 100 150 200 250 Forward Current IFP (mA) Ambient Temperature vs. Forward Voltage Ambient Temperature vs. Relative Luminosity 3.7 2.0 -9- 3.2 IFP=60mA IFP=20mA IFP=5mA 2.7 2.2 1.7 1.2 -60 -30 0 30 60 90 120 Ambient Temperature Ta (°C) IFP=20mA 1.0 0.5 0.2 -60 -30 0 30 60 90 120 Ambient Temperature Ta (°C) Allowable Forward Current IFP (mA) 20 9 8 7 6 5 300 200 160 Ta=25°C 100 40 20 10 1 5 10 20 50 100 Duty Ratio (%) Ambient Temperature vs. Allowable Forward Current Allowable Forward Current IF (mA) Relative Luminosity (a.u.) 50 1 1.2 Forward Voltage VF (V) Ta=25°C Relative Luminosity (a.u.) Forward Current IFP (mA) 200 160 100 Duty Ratio vs. Allowable Forward Current Forward Current vs. Relative Luminosity Forward Voltage vs. Forward Current 50 40 30 20 Ts=Solder Temperature (Cathode Side) 12 10 0 Ta=Ambient Temperature 0 20 40 60 80 100 120 Temperature T (°C) NICHIA CORPORATION NSSR064 Title CHARACTERISTICS No. 080616819581 Nichia STS-DA1-0293 <Cat.No.080620> Model Spectrum IFP=20mA 0.32 y 0.31 0.30 -40°C(619nm) 0°C(623nm) 25°C(625nm) 50°C(628nm) 100°C(631nm) 0.29 0.28 0.68 0.69 0.70 0.71 0.72 0.73 x IFP=20mA 629 625 621 617 613 -60 -30 0 30 60 90 120 Ambient Temperature Ta (°C) Dominant Wavelength λ D (nm) Dominant Wavelength λ D (nm) -10- 633 Ta=25°C IF=20mA 1.0 0.8 0.6 0.4 0.2 0 450 500 550 600 650 700 750 Wavelength λ (nm) Forward Current vs. Dominant Wavelength Ambient Temperature vs. Dominant Wavelength 637 1.2 Directivity Ta=25°C 629 627 625 623 621 619 0° 1.0 631 Relative Luminosity (a.u.) 0.33 Relative Emission Intensity (a.u.) Ambient Temperature vs. Chromaticity Coordinate (λD) 1 5 10 20 50 100 200 Forward Current IFP (mA) 10° 20° 30° Ta=25°C IFP=20mA 40° 50° 60° 0.5 70° 80° 0 90° 60° 30° Radiation Angle NICHIA CORPORATION 0.5 90° 1.0 NSSR064 Title CHARACTERISTICS No. 080616819591 Nichia STS-DA1-0293 <Cat.No.080620> Model 0° 0.8 ± 0.3 (2.4) Internal Circuit Anode A (0.8) 2 ± 0.3 3.5 ± 0.3 Cathode mark (C 0.6) (0.4) -11- (1.9) 2.8 0.8 ± 0.3 K 3.2 (2.4) Protection device Cathode ITEM MATERIALS PACKAGE ENCAPSULATING RESIN ELECTRODES Heat-Resistant Polymer Silicone Resin (Diffused) Ag Plating Copper Alloy Note) NxSx064 has a protection device built in as a protection circuit against static electricity. Rev.1 (1.05) 2.2 Rev.2 Approve Check ST Rev.3 Date Jun. 16, 2008 Rev.4 Model NxSx064 NICHIA CORPORATION Title No. Draw Unit mm 15/1 Scale Allow OUTLINE DIMENSIONS ± 0.2 STSZ-H816172 Nichia STS-DA1-0293 <Cat.No.080620> (0.45) Section 4±0.1 Reel End of tape φ φ2 1 ±0.8 ±0.2 φ 13 2.15±0.1 1+0.25 -0 11.4±1 9±0.3 φ 180+0 -3 φ 60+1 -0 (2.75) 3.5±0.05 Cathode mark 3.65±0.1 2±0.05 Reel part 0.25±0.05 8+0.3 - 0.1 4±0.1 φ 1.5+0.1 -0 1.75±0.1 Taping part Label XXXX LED TYPE NxSx064xT LOT xxxxxx-U QTY pcs RoHS 2.85±0.1 No LEDs LEDs mounting part No LEDs -12- Pull direction Top cover tape Embossed carrier tape Reel Lead Min.160mm (No LEDs) Reel Lead Min.100mm (No LEDs) Reel Lead Min.400mm Model Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. NICHIA CORPORATION Title No. NxSx064xT TAPING DIMENSIONS 080510816181 Nichia STS-DA1-0293 <Cat.No.080620> 2,000pcs/Reel Unit mm Scale Allow Nichia STS-DA1-0293 <Cat.No.080620> The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label NICHIA Seal XXXX LED TYPE LOT QTY NxSx064xT xxxxxx-U PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture proof foil bag Moisture absorbent material The box is partitioned with the cardboard. Label NICHIA Nichia XXXX LED LED TYPE RANK QTY NxSx064xT U PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 2,000 MAX. Dimensions (mm) 291¯237¯120¯8t 259¯247¯243¯5t 444¯262¯259¯8t NICHIA CORPORATION -13- Reel/box 7reel MAX. 15reel MAX. 30reel MAX. Quantity/box (pcs) 14,000 MAX. 30,000 MAX. 60,000 MAX. Model NxSx064xT Title PACKING No. 070802651612