Nichia STS-DA1-0227
<Cat.No.080613>
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUISH-GREEN LED
MODEL : NJSE036AT
NICHIA CORPORATION
-0-
Nichia STS-DA1-0227
<Cat.No.080613>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Soldering Temperature
Symbol
IF
IFP
IR
PD
Topr
Tstg
Tj
Tsld
Absolute Maximum Rating
650
900
85
2.8
-30 ~ + 85
-40 ~ +100
150
Reflow Soldering : 260°C
Hand Soldering : 350°C
(Ts=25°C)
Unit
mA
mA
mA
W
°C
°C
°C
for 10sec.
for 3sec.
IFP Conditions : Pulse Width ≤ 10msec. and Duty ≤ 1/10
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Luminous Flux
φv
x
Chromaticity Coordinate½
y
-
Condition
IF=350[mA]
IF=350[mA]
IF=350[mA]
IF=350[mA]
Typ.
(3.9)
(30.0)
0.085
0.490
(Ts=25°C)
Max.
Unit
4.3
V
lm
-
½ Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Luminous Flux
Rank P12
Rank P11
Rank P10
Rank P9
Rank P8
Symbol
Condition
φv
IF=350[mA]
Min.
36.0
30.3
25.5
21.4
18.0
(Ts=25°C)
Max.
Unit
42.8
36.0
lm
30.3
25.5
21.4
0.04
0.39
(IF=350mA,Ts=25°C)
Rank C
0.04
0.12
0.12
0.49
0.49
0.39
0.06
0.55
Rank E
0.06
0.14
0.65
0.65
½ Luminous Flux Measurement allowance is ± 7%.
Color Ranks
x
y
x
y
0.05
0.30
Rank B
0.05
0.13
0.40
0.40
0.05
0.48
Rank D
0.05
0.13
0.58
0.58
0.13
0.30
x
y
0.13
0.48
x
y
½ Color Coordinates Measurement allowance is ± 0.012.
½ Basically, a shipment shall consist of the LEDs of a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
-1-
0.14
0.55
Nichia STS-DA1-0227
<Cat.No.080613>
Correspondence table of Color Coordinates – Luminous Flux ranks
Ranking by Luminous Flux
Ranking by Color Coordinates
P8
P9
P10
P11
P12
B, C
D, E
½ Shaded ranks are available.
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to “CHARACTERISTICS” on the following pages.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to “OUTLINE DIMENSIONS” on the following page.
Material as follows ; Package
: Ceramics
Encapsulating Resin
: Silicone Resin (with Diffused)
Electrodes
: Au Plating
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to “TAPING DIMENSIONS” and “PACKING” on the following pages.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
{
¯¯¯¯ - U
{ - Year
( 7 for 2007, 8 for 2008 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
¯¯¯¯ - Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Flux
-2-
B for Nov. )
Nichia STS-DA1-0227
<Cat.No.080613>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Steady State Operating Life
Number of
Damaged
0/22
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Note
2 times
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
-40°C ~ 100°C
1min. (10sec.) 1min.
(Pre treatment 30°C,70%,168hrs.)
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
1 time
over 95%
100 cycles
0/22
100 cycles
0/50
10 cycles
0/50
1000 hrs.
0/50
Ta=60°C, RH=90%
1000 hrs.
0/50
Ta=-40°C
1000 hrs.
0/50
Ta=25°C, IF=650mA
1000 hrs.
0/50
1000 hrs.
0/50
500 hrs.
0/50
1000 hrs.
0/50
1 time
0/22
48min.
0/10
3 times
0/22
0/50
Tested with Nichia standard circuit board.½
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Permanence of Marking
Ta=85°C, IF=300mA
Tested with Nichia standard circuit board.½
60°C, RH=90%, IF=400mA
Tested with Nichia standard circuit board.½
Ta=-30°C, IF=350mA
Tested with Nichia standard circuit board.½
JEITA ED-4701
500 501
Vibration
JEITA ED-4701
400 403
Electrostatic Discharges
JEITA ED-4701
300 304
Solvent : Isopropyl Alcohol
Solvent Temperature : 20 ~ 25°C
Dipping Time : 5 min.
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3directions, 4cycles
R=1.5kΩ, C=100pF
Test Voltage=2kV
Negative/Positive
½ Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 45°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Item
Symbol Test Conditions
Min.
Max.
Forward Voltage
VF
IF=350mA
Initial Level ¯ 1.1
Luminous Flux
IF=350mA
Initial Level ¯ 0.7
φv
½ The test is performed after the board is cooled down to the room temperature.
-3-
Nichia STS-DA1-0227
<Cat.No.080613>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within
a year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in the moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel).
It is also recommended to return the LEDs to the original
moisture proof bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following condition.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrodes are gold plated. The gold surface may be affected by environments which
contain corrosive substances. Please avoid conditions which may cause the LED to corrode,
tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations.
It is recommended that the User use the LEDs as soon as possible.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
-4-
Nichia STS-DA1-0227
<Cat.No.080613>
(3) Recommended circuit
· In designing a circuit, the current through each LED must not exceed the absolute maximum rating
specified for each LED. It is recommended to use Circuit B which regulates the current flowing
through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the
current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the
worst case, some LED may be subjected to stresses in excess of the absolute maximum rating.
(B)
(A)
...
...
· This product should be operated in forward bias. A driving circuit must be designed so that the product
is not subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is
continuously applied to the product, such operation can cause migration resulting in LED damage.
(4) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,
or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
-5-
Nichia STS-DA1-0227
<Cat.No.080613>
(5) LED position and orientation
· Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs.
Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist
and warpage of the board.
【Non-preferable】
【Preferable】
Cathode mark
Cathode mark
When mechanical stress from the board affects the soldered LED, place the LED in the preferable
location and orientation as shown above.
· Depending on the position and direction of LED, the mechanical stress on the LED package can be
changed. Refer to the following figure.
E
D
C
Perforated line
A
B
Slit
Stress : A > B = C > D > E
· When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment.
Hand brake without these tools and equipment may not be used.
· The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and
subsequently may result in solder joint crack. Users may need to evaluate their specific application to
determine any impact due to the use of aluminum substrate.
-6-
Nichia STS-DA1-0227
<Cat.No.080613>
(6) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Pre-heat
120 ~ 150°C
180 ~ 200°C
Temperature
350°C Max.
Pre-heat time
120 sec. Max.
120 sec. Max.
Soldering time
3 sec. Max.
Peak
240°C Max.
260°C Max.
Soldering time
10 sec. Max.
10 sec. Max.
Condition
refer to
refer to
(one time only)
temperature
Temperature - profile 1.
Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
Use the conditions shown to the under figure.
[Temperature-profile (Surface of circuit board)]
<2 : Lead-free Solder>
<1 : Lead Solder>
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
1 ~ 5°C / sec.
240°C Max.
10sec. Max.
1 ~ 5°C / sec.
Pre-heating
180 ~ 200°C 60sec.Max.
260°C Max.
10sec. Max.
Above 220°C
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
4.1
3.5
0.6
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package.
The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
-7-
Nichia STS-DA1-0227
<Cat.No.080613>
(7) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
(8) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· Please determine the operating current with consideration of the ambient temperature local to the LED
and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS
in this specifications. Please also take measures to remove heat from the area near the LED to improve
the operational characteristics of the LED.
· The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation
between Tj and Ts.
Tj=Ta + Rja W
1
Tj=Ts + Rjs W
2
Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C,
Ts = Solder Temperature (Cathode Side) : °C,
Rja = Heat resistance from Dice to Ambient temperature : °C /W,
Rjs = Heat resistance from Dice to Ts measuring point ≒ 30°C /W,
W = Inputting Power (IF VF) : W
(9) Others
· NJSE036A complies with RoHS Directive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-8-
Nichia STS-DA1-0227
<Cat.No.080613>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
550
0.7
560
E
0.6
570
500
D
580
0.5
y
C
590
0.4
600
610
B
0.3
620
630
490
0.2
480
0.1
470
460
0
0
0.1
0.2
0.3
0.4
x
Color Coordinates Measurement allowance is ± 0.012.
-9-
0.5
0.6
0.7
0.8
100
50
1.5
1.0
0.5
0
200 400 600 800 1000
Forward Current IFP (mA)
Ambient Temperature vs.
Forward Voltage
Ambient Temperature vs.
Relative Luminous Flux
5.5
2.0
5.0
IFP=350mA
4.5
4.0
3.5
3.0
2.5
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Relative Luminous Flux (a.u.)
-10-
Forward Voltage VF (V)
Ta=25°C
2.0
0
10
2.5 3.0 3.5 4.0 4.5 5.0 5.5
Forward Voltage VF (V)
Allowable Forward Current IFP (mA)
Ta=25°C
350
1000
900
2.5
IFP=350mA
1.0
0.5
0.2
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
650
Ta=25°C
200
Pulse Width <
= 10msec.
½
100
1
5 10 20
50 100
Duty Ratio (%)
Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
Relative Luminous Flux (a.u.)
Forward Current IFP (mA)
1000
900
Duty Ratio vs.
Allowable Forward Current
Forward Current vs.
Relative Luminous Flux
Forward Voltage vs.
Forward Current
800
650
600
452
400
352
200
0
0
Rja=35°C/W
Rja=45°C/W
20
40
60
80 100
Ambient Temperature Ta (°C)
NICHIA CORPORATION
NJSE036A
Title
CHARACTERISTICS
No.
080603818281
Nichia STS-DA1-0227
<Cat.No.080613>
Model
Forward Current vs.
Chromaticity Coordinate (λD)
20mA(508nm)
y
0.60
100mA(504nm)
0.55
0.50
350mA(500nm)
0.45
650mA(498nm)
900mA(496nm)
0.40
0
0.05 0.10 0.15 0.20 0.30 0.35
512
508
Ta=25°C
504
500
496
492
488
10
100
1000
Forward Current IFP (mA)
Ta=25°C
IFP=350mA
1.0
0.8
0.6
0.4
0.2
0
350
450
550
Wavelength λ (nm)
650
Ambient Temperature vs.
Dominant Wavelength
Dominant Wavelength λ D (nm)
-11-
Dominant Wavelength λ D (nm)
x
Forward Current vs.
Dominant Wavelength
1.2
Directivity
508
0°
1.0
512
Relative Illuminance (a.u.)
Ta=25°C
0.65
Relative Emission Intensity (a.u.)
0.70
Spectrum
IFP=350mA
504
500
496
492
488
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
10° 20°
30°
40°
50°
60°
0.5
70°
Ta=25°C
IFP=350mA
0
90°
60°
30°
Radiation Angle
NICHIA CORPORATION
0°
0.5
90°
1.0
NJSE036A
Title
CHARACTERISTICS
No.
080603818291
Nichia STS-DA1-0227
<Cat.No.080613>
Model
80°
3.5
3.2
φ 2.9
0.8
Cathode mark
1
3.2
3.5
0.8
Anode
Cathode
A
K
-12-
Protection device
ITEM
MATERIALS
PACKAGE
ENCAPSULATING RESIN
ELECTRODES
Ceramics
Silicone Resin (with Diffused)
Au Plating
Model
NICHIA CORPORATION
Title
No.
NJSE036A
OUTLINE DIMENSIONS
080603818391
Nichia STS-DA1-0227
<Cat.No.080613>
½ NJSE036A has a protection device built in as a protection
circuit against static electricity.
Unit
mm
8/1
Scale
Allow
±0.2
Taping part
φ 180+0
-3
5.5±0.05
Cathode mark
0.2±0.05
φ2
1 ±0.8
φ 60+1
-0
2±0.05 4±0.1
15.4±1
13+1
-0
3.85±0.1
8±0.1
12+0.3
- 0.1
φ 1.5+0.1
-0
1.75±0.1
Reel part
±0.2
φ 13
1±0.1
φ 1.5+0.2
-0
Label
XXXX LED
3.85±0.1
TYPE NJSx036xT
LOT xxxxxx-U
QTY
pcs RoHS
Reel End of tape
LEDs mounting part
No LEDs
No LEDs
-13Pull direction
Top cover
tape
Embossed carrier tape
Reel Lead Min.160mm (No LEDs)
Reel Lead Min.100mm (No LEDs)
Reel Lead Min.400mm
2,000pcs/Reel
Model
NICHIA CORPORATION
Title
No.
NJSx036xT
TAPING DIMENSIONS
080603818421
Nichia STS-DA1-0227
<Cat.No.080613>
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
Unit
mm
Scale
Allow
Nichia STS-DA1-0227
<Cat.No.080613>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Label
NICHIA
Seal
XXXX LED
TYPE
LOT
QTY
NJSx036xT
xxxxxx-U
RoHS
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture proof foil bag
Moisture
absorbent material
The box is partitioned with the
cardboard.
Label
NICHIA
Nichia
LED
XXXX LED
TYPE
RANK
QTY
NJSx036xT
U
RoHS
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag
Cardboard box
Cardboard box S
Cardboard box M
Cardboard box L
Reel/bag
1reel
Quantity/bag (pcs)
2,000 MAX.
Dimensions (mm)
291¯237¯120¯8t
259¯247¯243¯5t
444¯262¯259¯8t
NICHIA CORPORATION
-14-
Reel/box
5reel MAX.
10reel MAX.
20reel MAX.
Quantity/box (pcs)
10,000 MAX.
20,000 MAX.
40,000 MAX.
Model
NJSx036xT
Title
PACKING
No.
070921700171