DS14C535 +5V Supply EIA/TIA-232 3 x 5 Driver/Receiver General Description Features The DS14C535 is three driver, five receiver device which conforms to EIA/TIA-232-E and CCITT (ITU-T) V.28 standard specifications. This device employs an internal DC-DC converter to generate the necessary output levels from a +5V power supply. A SHUTDOWN (SD) mode reduces the supply current to 10 µA maximum. In the SD mode, one receiver is active, allowing ring indicator (RI) to be monitored. PC Board space consumption is minimized by the availability of Shrink Small Outline Packaging (SSOP). The DS14C535 provides a one-chip solution for the common 9-pin serial RS-232 interface between data terminal and data circuit-terminating equipment. This device allows an easy migration path to the 3.3V DS14C335. The packages are the same. The N/C pins on the DS14C535 are not physically connected to the chip. Board layout for the DS14C335 will accommodate both devices. This device’s low power requirement and small footprint makes it an ideal choice for Laptop and Notebook applications. n Pin compatible with DS14C335 n Conforms to EIA/TIA-232-E and CCITT (ITU-T) V.28 specifications n Failsafe receiver outputs high when inputs open n Operates with single +5V power supply n Low power requirement — ICC 12 mA maximum n SHUTDOWN mode — ICX 10 µA maximum n One Receiver (R5) active during SHUTDOWN n Operates up to 128 kbps — Lap-Link ® Compatible n 4V/µs minimum Slew Rate guaranteed n ESD rating of 3 kV on all pins (H, B, M) n Available in 28-lead SSOP EIAJ Type II package n Only four 0.1 µF capacitors required for the DC-DC converter Connection Diagram Functional Diagram DS14C535 DS011910-1 Order Number DS14C535MSA See NS Package Number MSA28 DS011910-2 Lap-Link ® is a registered trademark of Traveling Software Inc. © 1999 National Semiconductor Corporation DS011910 www.national.com DS14C535 +5V Supply EIA/TIA-232 3 x 5 Driver/Receiver May 1998 Absolute Maximum Ratings (Note 1) SSOP MSA Package 1286 mW Derate MSA Package 10.3 mW/˚C above +25˚C ESD Rating (HBM, 1.5 kΩ, 100 pF) ≥ 3.0 kV If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) −0.3V to +6V (VCC − 0.3V) to +14V V+ Pin +0.3V to −14V V− Pin −0.3V to +5.5V Input Voltage (DIN, SD) Driver Output Voltage (V+ +0.3V) to (V− − 0.3V) ± 25V Receiver Input Voltage Receiver Output Voltage − 0.3V to (VCC +0.3V) Junction Temperature +150˚C Storage Temperature Range −65˚C to +150˚C Lead Temperature (Soldering 4 sec.) +260˚C Continuous Short Circuit Duration (DOUT) Maximum Package Power Dissipation @ +25˚C Recommended Operating Conditions Min 4.5 Supply Voltage (VCC) Operating Free Air Temperature (TA) DS14C535 0 DC-DC Converter Capacitors (C1–C4) Max 5.5 Units V +70 ˚C Recommended range of values is 0.1 µF to 0.68 µF, ± 20%. For more detail refer to application information section of this data sheet. Electrical Characteristics (Notes 2, 3) Over recommended operating conditions, SD = 0.8V, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Units DEVICE CHARACTERISTICS V+ Positive Power Supply V− Negative Power Supply ICC Supply Current No Load C1–C4 = 0.1 µF DIN = 0.8V DIN = 2.0V +8.5 No Load RL = 3 kΩ, SD = VCC ICX SHUTDOWN Supply Current VIH High Level Enable Voltage VIL Low Level Enable Voltage IIH High Level Enable Current 2.0V ≤ VIN ≤ 5.5V IIL Low Level Enable Current GND ≤ VIN ≤ 0.8V V −7.0 1.0 SD V 12 mA 10 µA 2.0 V GND 0.8 V +2.0 µA −2.0 µA DRIVER CHARACTERISTICS VIH High Level Input Voltage VIL Low Level Input Voltage IIH High Level Input Current 2.0V ≤ VIN ≤ 5.5V IIL Low Level Input Current VOH High Level Output Voltage GND ≤ VIN ≤ 0.8V RL = 3 kΩ VOL Low Level Output Voltage IOS+ Output High Short DIN 2.0 V GND 0.8 V +1.0 µA −1.0 +5.0 µA 8 V −6.7 −5.0 V VO = 0V, VIN = 0.8V (Note 7) −40 −20 −8 mA VO = 0V, VIN = 2.0V (Note 7) 6 15 40 mA 300 1200 Circuit Current IOS− Output Low Short Circuit Current RO Output Resistance −2V ≤ VO ≤ +2V, VCC = GND = 0V Ω RECEIVER CHARACTERISTICS (Note 4) Input High Threshold Voltage R1–R5, SD = 0.8V (Active Mode) 1.4 2.4 2.0 2.8 VTL Input Low Threshold Voltage R5, 2.0V ≤ SD ≤ 5.5V (Shutdown Mode) R1–R5, SD = 0.8V (Active Mode) VHY Hysteresis (Note 4) RIN Input Resistance IIN Input Current VTH R5, 2.0V ≤ SD ≤ 5.5V (Shutdown Mode) 1.1 0.8 1.1 0.15 VIN = ± 3V to ± 15V VIN = +15V VIN = +3V VIN = −3V VIN = −15V www.national.com 0.8 2 3.0 2.14 V V V 1.0 5.4 V V 7.0 kΩ 5.0 mA 0.43 1.0 mA −1.0 −0.43 mA −5.0 −2.14 mA Electrical Characteristics (Notes 2, 3) (Continued) Over recommended operating conditions, SD = 0.8V, unless otherwise specified. Symbol Parameter Conditions Min VIN = −3V, IOH = −2.0 mA VIN = −3V, IOH = −20 µA VIN = +3V, IOL = +2.0 mA 3.8 Typ Max Units RECEIVER CHARACTERISTICS (Note 4) VOH VOL High Level Output Voltage Low Level Output Voltage V 4.0 V 0.23 0.4 V Switching Characteristics (Note 4) Over recommended operating conditions, SD = 0.8V, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Units 0.1 0.6 1.0 µs 0.1 0.6 1.0 µs 0 0.2 µs 13 30 V/µs 10 30 V/µs DRIVER CHARACTERISTICS tPLH Propagation Delay LOW to HIGH tPHL Propagation Delay HIGH to LOW tSK Skew |tPLH–tPHL| SR1 Output Slew Rate RL = 3 kΩ CL = 50 pF (Figures 1, 2) RL = 3 kΩ to 7 kΩ, CL = 50 pF (Figure 2) RL = 3 kΩ, CL = 2500 pF (Figure 2) SR2 Output Slew Rate tPLS Propagation Delay LOW to SD tPSL 4 4 0.48 Propagation Delay SD to LOW (Figures 5, 6) RL = 3 kΩ 1.88 ms tPHS Propagation Delay HIGH to SD CL = 50 pF 0.62 ms tPSH Propagation Delay SD to HIGH 1.03 ms ms RECEIVER CHARACTERISTICS tPLH Propagation Delay LOW to HIGH CL = 50 pF 0.1 0.4 1.0 µs tPHL Propagation Delay HIGH to LOW (Figures 3, 4) 0.1 0.6 1.0 µs tSK Skew |tPLH–tPHL| 0.1 0.5 µs tPLS Propagation Delay LOW to SD tPSL 0.13 µs Propagation Delay SD to LOW (Figures 7, 8) RL = 1 kΩ 1.0 µs tPHS Propagation Delay HIGH to SD CL = 50 pF 0.19 µs tPSH Propagation Delay SD to HIGH R1–R4 Only 0.58 µs Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation. Note 2: Typical values are given for VCC = 5V and TA = +25˚C. Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified. For voltage logic levels, the more positive value is designated as maximum. For example, if −5V is a maximum, the typical value (−6.7V) is more negative. Note 4: Receiver characteristics are guaranteed for SD = 0.8V. When SD = 2.0V, receiver five (R5) is active and meets receiver parameters in SHUTDOWN (SD) mode, unless otherwise specified. Note 5: Generator characteristics for driver input: f = 64 kHz (128 kbits/sec), tr = tf < 10 ns, VIH = 3V, VIL = 0V, duty cycle = 50%. Note 6: Generator characteristics for receiver input: f = 64 kHz (128 kbits/sec), tr = tf < 10 ns, VIH = 3V, VIL = −3V, duty cycle = 50%. Note 7: Only one driver output shorted at a time. Parameter Measurement Information DS011910-3 FIGURE 1. Driver Propagation Delay and Slew Rate Test Circuit 3 www.national.com Parameter Measurement Information (Continued) DS011910-4 FIGURE 2. Driver Propagation Delay and Slew Rate Timing DS011910-5 FIGURE 3. Receiver Propagation Delay Test Circuit DS011910-6 FIGURE 4. Receiver Propagation Delay Timing DS011910-7 FIGURE 5. Driver SHUTDOWN (SD) Delay Test Circuit DS011910-8 FIGURE 6. Driver SHUTDOWN (SD) Delay Timing www.national.com 4 Parameter Measurement Information (Continued) DS011910-9 FIGURE 7. Receiver SHUTDOWN (SD) Delay Test Circuit DS011910-10 FIGURE 8. Receiver SHUTDOWN (SD) Delay Timing Pin Descriptions VCC (Pin 3). Power supply pin for the device, +5V ( ± 0.5V). V+ (Pin 1). Positive supply for EIA/TIA-232-E drivers. Recommended external capacitor — 0.1 µF (16V). This supply is not intended to be loaded externally. V− (Pin 25). Negative supply for EIA/TIA-232-E drivers. Recommended external capacitor — 0.1 µF (16V). This supply is not intended to be loaded externally. C1+, C1− (Pins 2, 4). External capacitor connection pins. C2+, C2− (Pins 28, 26). External capacitor connection pins. SHUTDOWN (SD) (Pin 23). A High on the SHUTDOWN pin will lower the total ICC current to less than 10 µA, providing a low power state. In this mode receiver R5 remains active. The SD pin should be driven or tied low (GND) to disable the shutdown mode. DIN 1–3 (Pins 7, 8, 9). Driver input pins. ROUT 1–5 (Pins 10, 11, 12, 13, 14). Receiver output pins. GND (Pins 5, 27). Ground Pins. Both pins must be connected to external ground. These pins are not connected together on the chip. Application Information In a typical Data Terminal Equipment (DTE) to Data Circuit-Terminating Equipment (DCE) 9-pin de-facto interface implementation, 2 data lines and 6 control lines are required. The data lines are TXD and RXD and the control lines are RTS, DTR, DSR, DCD, CTS and RI. The DS14C535 is a 3 x 5 Driver/Receiver and offers a single chip solution for the DTE interface as shown in Figure 9 . Ring Indicator (RI) is used to inform the DTE that an incoming call is coming from a remote DCE. When the DS14C535 is in SHUTDOWN (SD) mode, receiver five (R5) remains active and monitors RI circuit. This active receiver (R5) alerts the DTE to switch the DS14C535 from SHUTDOWN to active mode. To achieve minimum power consumption, the DS14C535 can be in SHUTDOWN mode and only activated when communications are needed. DOUT 1–3 (Pins 22, 21, 20). Driver output pins conform to EIA/TlA-232 -E levels. RIN 1–5 (Pins 19, 18, 17, 16, 15). Receiver input pins accept EIA/TIA-232-E input voltages ( ± 25V). Receivers guarantees hysteresis of TBD mV. Unused receiver input pins may be left open. Internal input resistor (5 kΩ) pulls input LOW, providing a failsafe HIGH output. 5 www.national.com Application Information (Continued) DS011910-11 FIGURE 9. Typical DTE Application www.national.com 6 Application Information (Continued) Manufacturer Capacitors: Capacitors can be ceramic or tantalum. Standard surface mount in the range of 0.1 µF to 0.68 µF are readily available from several manufacturers. A minimum 20V rating is recommended. Contact manufacturers for specific detail on surface mounting and dielectrics. A partial list of manufacturers include: 7 Phone Number KEMET 803-963-6300 AVX 803-448-9411 MURATA-ERIE 800-831-9172 www.national.com DS14C535 +5V Supply EIA/TIA-232 3 x 5 Driver/Receiver Physical Dimensions inches (millimeters) unless otherwise noted Order Number DS14C535MSA NS Package Number MSA28 LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: [email protected] www.national.com National Semiconductor Europe Fax: +49 (0) 1 80-530 85 86 Email: [email protected] Deutsch Tel: +49 (0) 1 80-530 85 85 English Tel: +49 (0) 1 80-532 78 32 Français Tel: +49 (0) 1 80-532 93 58 Italiano Tel: +49 (0) 1 80-534 16 80 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: [email protected] National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.