DS26LV32AT 3V Enhanced CMOS Quad Differential Line Receiver General Description Features The DS26LV32A is a high speed quad differential CMOS receiver that meets the requirements of both TIA/EIA-422-B and ITU-T V.11. The CMOS DS26LV32AT features typical low static ICC of 9 mA which makes it ideal for battery powered and power conscious applications. The TRI-STATE ® enables, EN and EN*, allow the device to be active High or active Low. The enables are common to all four receivers. n n n n The receiver output (RO) is guaranteed to be High when the inputs are left open. The receiver can detect signals as low as ± 200 mV over the common mode range of ± 10V. The receiver outputs (RO) are compatible with TTL and LVCMOS levels. n n n n n n n n n n Connection Diagram Low Power CMOS design (30 mW typical) Interoperable with existing 5V RS-422 networks Industrial and Military Temperature Range Conforms to TIA/EIA-422-B (RS-422) and ITU-T V.11 Recommendation 3.3V Operation ± 7V Common Mode Range @ VID = 3V ± 10V Common Mode Range @ VID = 0.2V Receiver OPEN input failsafe feature Guaranteed AC Parameter: Maximum Receiver Skew: 4 ns Maximum Transition Time: 10 ns Pin compatible with DS26C32AT 32 MHz Toggle Frequency > 6.5k ESD Tolerance (HBM) Available in SOIC and Cerpack Packaging Standard Microcircuit Drawing (SMD) 5962-98585 Truth Table Inputs Output EN Enables EN* RI+–RI− RO L H X Z All Other VID ≥ +0.2V H Combinations of VID ≤ −0.2V L Enable Inputs Open† H Dual-In-Line Package † Open, not terminated L = Logic Low H = Logic High X = Irrelevant Z = TRI-STATE DS012908-1 Top View Order Number DS26LV32ATM or DS26LV32AW See NS Package Number M16A or W16A TRI-STATE ® is a registered trademark of National Semiconductor Corporation. © 1999 National Semiconductor Corporation DS012908 www.national.com DS26LV32AT 3V Enhanced CMOS Quad Differential Line Receiver April 1999 Absolute Maximum Ratings (Note 1) Storage Temperature Range Lead Temperature Range Soldering (4 Sec.) ESD Ratings (HBM, 1.5 kΩ, 100 pF) Receiver Inputs and Enables Other Pins If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) −0.5V to +7V Enable Input Voltage (EN, EN*) −0.5V to VCC +0.5V ± 14V Receiver Input Voltage (VID: RI+, RI−) Receiver Input Voltage ± 14V (VCM: RI+, RI−) Receiver Output Voltage (RO) −0.5V to VCC +0.5V ± 25 mA Maximum Receiver Output Current (RO) Maximum Package Power Dissipation @ +25˚C M Package 1190 mW W Package 1087 mW Derate M Package 9.8 mW/˚C above +25˚C Derate W Package 7.3 mW/˚C above +25˚C −65˚C to +150˚C +260˚C ≥ 6.5 kV ≥ 2 kV Recommended Operating Conditions Supply Voltage (VCC) Min Typ Max Units 3.0 3.3 3.6 V Operating Free Air Temperature Range (TA) DS26LV32AT −40 +25 +85 ˚C DS26LV32AW −55 +25 +125 ˚C Electrical Characteristics (Notes 2, 3) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. Symbol VTH Parameter Differential Input Threshold Conditions VOUT = VOH or VOL VCM = −0.5V to +5.5V, TA = -55˚C to +125˚C (Note 9) VHY Hysteresis VIH Minimum High Level RI+, RI− Min Typ Max Units −200 ± 17.5 +200 mV +200 mV -200 VCM = 1.5V 35 mV 2.0 Input Voltage VIL Pin VCM = −7V to +7V, TA = -40˚C to +85˚C V EN, EN* Maximum Low Level 0.8 V Input Voltage RIN IIN Input Resistance VIN = −7V, +7V, TA = -40˚C to +85˚C (Other Input = GND) 5.0 VIN = −0.5V, +5.5V, TA = -55˚C to +125˚C (Other Input = GND) (Note 9) 5.0 Input Current VIN = +10V (Other Input = 0V, VIN = +3V Power On, or VIN = 0.5V VCC = 0V) RI+, RI− 0 1.1 0 0.27 mA −0.02 mA VIN = −3V 0 −0.43 0 −1.26 VIN = 5.5V TA = -55˚C to +125˚C (Note 9) 2 kΩ kΩ VIN = −10V VIN = −0.5V www.national.com TA = -40˚C to +85˚C 8.5 1.8 mA mA −2.2 mA 0 -1.8 mA 0 1.8 mA Electrical Characteristics (Notes 2, 3) (Continued) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. Symbol Parameter IEN Input Current VOH High Level Output Voltage Conditions VIN = 0V to VCC Pin Min Typ EN, EN* IOH = −6 mA, VID = +1V 2.4 Max Units ±1 µA 3 V VCC −0.1 V IOH = −6 mA, VID = OPEN VOH High Level Output Voltage IOH = −100 µA, VID = +1V IOH = − 100 µA, VID = OPEN VOL Low Level Output Voltage IOL = +6 mA, VID = −1V IOZ Output TRI-STATE Leakage VOUT = VCC or GND Current EN = VIL, EN* = VIH ISC Output Short Circuit Current VO = 0V, VID ≥ |200 mV| (Note 4) ICC Power Supply Current No Load, All RI+, R1− = OPEN, EN, EN* = VCC or GND TA = -40˚C to +85˚C RO 0.13 −10 VCC 0.5 V ± 50 µA −35 −70 mA 9 15 mA 20 mA TA = -55˚C to +125˚C Switching Characteristics - Industrial (Notes 3, 7, 10, 11) Over Supply Voltage and -40˚C to +85˚C Operating Temperature range, unless otherwise specified. Symbol tPHL Parameter Propagation Delay High to Low tPLH Conditions CL = 15 pF, VCM = 1.5V (Figures 1, 2 ) Propagation Delay Min Typ Max Units 6 17.5 35 ns 6 17.8 35 ns Low to High tr Rise Time (20% to 80%) 4.1 10 ns tf Fall Time (80% to 20%) 3.3 10 ns tPHZ Disable Time 40 ns tPLZ Disable Time 40 ns tPZH Enable Time 40 ns tPZL Enable Time 40 ns tSK1 Skew, |tPHL − tPLH| (Note 5) 4 ns tSK2 Skew, Pin to Pin (Note 6) 0.6 4 ns tSK3 Skew, Part to Part (Note 7) 7 17 fMAX Maximum Operating Frequency (Note 8) CL = 50 pF, VCM = 1.5V (Figures 3, 4 ) CL = 15 pF, VCM = 1.5V CL = 15 pF, VCM = 1.5V 3 0.3 32 ns MHz www.national.com Switching Characteristics - Military (Notes 10, 11) Over Supply Voltage and -55˚C to +125˚C Operating Temperature range, unless otherwise specified. Symbol tPHL Parameter Propagation Delay High to Low tPLH Conditions CL = 50 pF, VCM = 1.5V (Figures 1, 2 ) Propagation Delay Min Max Units 6 45 ns 6 45 ns 50 ns Low to High tPHZ Disable Time tPLZ Disable Time 50 ns tPZH Enable Time 50 ns tPZL Enable Time 50 ns tSK1 Skew, |tPHL − tPLH| (Note 5) 6 ns tSK2 Skew, Pin to Pin (Note 6) 6 ns CL = 50 pF, VCM = 1.5V (Figures 3, 4 ) CL = 50 pF, VCM = 1.5V Note 1: “Absolute Maximum ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation. Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VID. Note 3: All typicals are given for: VCC = +3.3V, TA = +25˚C. Note 4: Short one output at a time to ground. Do not exceed package. Note 5: tSK1 is the |tPHL – tPLH| of a channel. Note 6: tSK2 is the maximum skew between any two channels within a device, either edge. Note 7: tSK3 is the difference in propagation delay times between any channels of any devices. This specification (maximum limit) applies to devices within VCC ± 0.1V of one another,and a Delta TA = ± 5˚C (between devices) within the operating temperature range. This parameter is guaranteed by design and characterization. Note 8: All channels switching, Output Duty Cycle criteria is 40%/60% measured at 50%. Input = 1V to 2V, 50% Duty Cycle, tr/tf ≤ 5 ns. This parameter is guaranteed by design and characterization. Note 9: This parameter does not meet the TIA/EIA-422-B specification. Parameter Measurement Information DS012908-2 FIGURE 1. Receiver Propagation Delay and Transition Time Test Circuit (Notes 10, 11) www.national.com 4 Parameter Measurement Information (Continued) DS012908-3 Note 10: Generator waveform for all tests unless otherwise specified: f = 1 MHz, Duty Cycle = 50%, ZO = 50Ω, tr ≤ 10 ns, tf ≤ 10 ns. Note 11: CL includes probe and jig capacitance. Note 12: For military grade product, tr ≤ 6ns and tf ≤ 6ns. Note 13: For military grade product the measure point is 1/2 VCC for tPLH, tPHL, tPZL, and tPZH FIGURE 2. Receiver Propagation Delay and Transition Time Waveform (Notes 10, 11, 12, 13) DS012908-4 FIGURE 3. Receiver TRI-STATE Test Circuit DS012908-5 FIGURE 4. Receiver TRI-STATE Output Enable and Disable Waveforms (Notes 10, 11, 12, 13) 5 www.national.com Power Decoupling Recommendations: Typical Application Information Bypass caps must be used on power pins. High frequency ceramic (surface mount is recommended) 0.1 µF in parallel with 0.01 µF at the power supply pin. A 10 µF or greater solid tantalum or electrolytic should be connected at the power entry point on the printed circuit board. General application guidelines and hints for differential drivers and receivers may be found in the following application notes: AN-214, AN-457, AN-805, AN-847, AN-903, AN-912, AN-916 DS012908-6 RT is optional although highly recommended to reduce reflection DS012908-7 FIGURE 5. Typical Receiver Connections DS012908-8 FIGURE 6. Typical Receiver Output Waveforms DS012908-9 FIGURE 7. Typical Receiver Input Circuit www.national.com 6 Typical Application Information (Continued) DS012908-10 FIGURE 8. Typical ICC vs Frequency DS012908-11 FIGURE 9. Receiver IIN vs VIN (Power On or Power Off) DS012908-12 FIGURE 10. IOL vs VOL 7 www.national.com Typical Application Information (Continued) DS012908-13 FIGURE 11. IOH vs VOH www.national.com 8 Physical Dimensions inches (millimeters) unless otherwise noted Order Number DS26LV32ATM NS Package Number M16A 9 www.national.com DS26LV32AT 3V Enhanced CMOS Quad Differential Line Receiver Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Order Number DS26LV32AW NS Package Number W16A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 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