SN74HC02-Q1 QUADRUPLE 2-INPUT POSITIVE-NOR GATE SCLS530A − AUGUST 2003 − REVISED 2008 D Qualified for Automotive Applications D ESD Protection Exceeds 1500 V Per D D D D Typical tpd = 8 ns D ±4-mA Output Drive at 5 V D Low Input Current of 1 µA Max MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Wide Operating Voltage Range of 2 V to 6 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 20-µA Max ICC D OR PW PACKAGE (TOP VIEW) 1Y 1A 1B 2Y 2A 2B GND description/ordering information The ’HC02 device contains four independent 2-input NOR gates. They perform the Boolean function Y = A + B or Y = A • B in positive logic. 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4Y 4B 4A 3Y 3B 3A ORDERING INFORMATION{ −40°C 40°C to 125°C ORDERABLE PART NUMBER PACKAGE‡ TA TOP-SIDE MARKING SOIC − D Tape and reel SN74HC02QDRQ1 HC02QQ1 TSSOP − PW Tape and reel SN74HC02QPWRQ1 HC02QQ1 † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. FUNCTION TABLE (each gate) INPUTS A B OUTPUT Y H X L X H L L L H logic diagram (positive logic) A B Y Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2008, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74HC02-Q1 QUADRUPLE 2-INPUT POSITIVE-NOR GATE SCLS530A − AUGUST 2003 − REVISED 2008 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) VCC Supply voltage VCC = 2 V VIH VCC = 4.5 V High-level High level input voltage VCC = 6 V MIN NOM MAX 2 5 6 3.15 0.5 1.35 VCC = 6 V VI Input voltage VO Output voltage Input transition rise/fall time TA Operating free-air temperature V 1.8 0 0 VCC = 2 V ∆t/∆v V 4.2 VCC = 4.5 V Low-level Low level input voltage V 1.5 VCC = 2 V VIL UNIT VCC V VCC V 1000 VCC = 4.5 V 500 VCC = 6 V ns 400 −40 125 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74HC02-Q1 QUADRUPLE 2-INPUT POSITIVE-NOR GATE SCLS530A − AUGUST 2003 − REVISED 2008 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = −20 20 µA VOH VI = VIH or VIL IOH = −4 mA IOH = −5.2 mA IOL = 20 µA VOL VI = VIH or VIL IOL = 4 mA IOL = 5.2 mA II VI = VCC or 0 ICC VI = VCC or 0, IO = 0 TA = 25°C MIN TYP MIN 2V 1.9 1.998 1.9 4.5 V 4.4 4.499 4.4 6V 5.9 5.999 5.9 4.5 V 3.98 4.3 3.7 6V 5.48 5.8 MAX UNIT V 5.2 2V 0.002 0.1 0.1 4.5 V 0.001 0.1 0.1 6V 0.001 0.1 0.1 4.5 V 0.17 0.26 0.4 6V 0.15 0.26 0.4 6V ±0.1 ±100 ±1000 nA 2 40 µA 3 10 10 pF 6V Ci MAX 2 V to 6 V V switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) VCC A or B Y tt Y TA = 25°C MIN MIN MAX TYP MAX 2V 45 90 135 4.5 V 9 18 27 6V 8 15 23 2V 38 75 110 4.5 V 8 15 22 6V 6 13 19 UNIT ns ns operating characteristics, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per gate POST OFFICE BOX 655303 No load • DALLAS, TEXAS 75265 TYP 22 UNIT pF 3 SN74HC02-Q1 QUADRUPLE 2-INPUT POSITIVE-NOR GATE SCLS530A − AUGUST 2003 − REVISED 2008 PARAMETER MEASUREMENT INFORMATION From Output Under Test VCC Test Point Input 50% 50% 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT 50% 10% tPHL 90% 90% tr Input 50% 10% 90% 90% tr tPHL VCC 50% 10% 0 V Out-of-Phase Output 90% tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES VOH 50% 10% VOL tf tPLH 50% 10% tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp SN74HC02QDRG4Q1 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC02QDRQ1 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC02QPWRG4Q1 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC02QPWRQ1 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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OTHER QUALIFIED VERSIONS OF SN74HC02-Q1 : Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2011 • Catalog: SN74HC02 • Enhanced Product: SN74HC02-EP • Military: SN54HC02 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Enhanced Product - Supports Defense, Aerospace and Medical Applications • Military - QML certified for Military and Defense Applications Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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