SN74HC151-Q1 www.ti.com............................................................................................................................................................. SCLS701B – JUNE 2006 – REVISED APRIL 2008 8-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER FEATURES 1 • • • • • • D PACKAGE (TOP VIEW) Qualified for Automotive Applications Wide Operating Voltage Range of 2 V to 6 V Outputs Can Drive up to 10 LSTTL Loads ±6-mA Output Drive at 5 V Low Input Current of 1 µA Max 8-Line to 1-Line Multiplexers Can Perform as: – Boolean-Function Generators – Parallel-to-Serial Converters – Data Source Selectors D3 D2 D1 D0 Y W G GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC D4 D5 D6 D7 A B C DESCRIPTION/ORDERING INFORMATION This data selector/multiplexer provides full binary decoding to select one of eight data sources. The strobe (G) input must be at a low logic level to enable the inputs. A high level at the strobe terminal forces the W output high and the Y output low. ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 125°C (1) (2) SOIC – D ORDERABLE PART NUMBER Reel of 2500 SN74HC151QDRQ1 TOP-SIDE MARKING HC151Q For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. FUNCTION TABLE OUTPUTS (1) INPUTS SELECT (1) C B A STROBE G Y W X X X H L H L L L L D0 D0 L L H L D1 D1 L H L L D2 D2 L H H L D3 D3 H L L L D4 D4 H L H L D5 D5 H H L L D6 D6 H H H L D7 D7 D0, D1 . . . D7 = the level of the respective D input 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2008, Texas Instruments Incorporated SN74HC151-Q1 SCLS701B – JUNE 2006 – REVISED APRIL 2008............................................................................................................................................................. www.ti.com LOGIC DIAGRAM (POSITIVE LOGIC) G A B C D0 D1 D2 D3 D4 D5 D6 D7 2 7 11 10 9 4 TG 3 2 1 TG 5 TG TG 15 6 TG 14 Y W TG 13 TG 12 TG Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): SN74HC151-Q1 SN74HC151-Q1 www.ti.com............................................................................................................................................................. SCLS701B – JUNE 2006 – REVISED APRIL 2008 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX –0.5 7 UNIT VCC Supply voltage range IIK Input clamp current VI < 0 or VI > VCC (2) ±20 mA IOK Output clamp current VO < 0 or VO > VCC (2) ±20 mA IO Continuous output current VO = 0 to VCC ±35 mA ±70 mA 73 °C/W Continuous current through VCC or GND θJA Package thermal impedance Tstg Storage temperature range (3) –65 Human-body model ESD rating Charged-device model Machine model (1) (2) (3) V 150 °C 2 kV 1 kV 200 V Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) VCC Supply voltage VCC = 2 V VIH High-level input voltage VCC = 4.5 V VCC = 6 V MIN NOM MAX 2 5 6 UNIT V 1.5 3.15 V 4.2 VCC = 2 V 0.5 VIL Low-level input voltage VCC = 4.5 V 1.35 VI Input voltage 0 VCC V VO Output voltage 0 VCC V Δt/Δv Input transition rise/fall time VCC = 6 V 1.8 VCC = 2 V TA (1) 1000 VCC = 4.5 V 500 VCC = 6 V 400 Operating free-air temperature V –40 125 ns °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): SN74HC151-Q1 3 SN74HC151-Q1 SCLS701B – JUNE 2006 – REVISED APRIL 2008............................................................................................................................................................. www.ti.com Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –20 µA VOH VI = VIH or VIL IOH = –6 mA IOH = –7.8 mA VOL ICC VI = VCC or 0, TYP 2V 1.9 1.998 1.9 4.5 V 4.4 4.499 4.4 6V 5.9 5.999 5.9 4.5 V 3.98 4.3 3.7 6V 5.48 5.8 MAX UNIT V 5.2 0.002 0.1 0.1 IOL = 20 µA 4.5 V 0.001 0.1 0.1 6V 0.001 0.1 0.1 IOL = 6 mA 4.5 V 0.17 0.26 0.4 6V 0.15 0.26 0.4 6V ±0.1 ±100 ±1000 nA 8 160 µA 3 10 10 pF IOL = 7.8 mA VI = VCC or 0 MAX MIN MIN 2V VI = VIH or VIL II TA = 25°C VCC IO = 0 6V Ci 2 V to 6 V V Switching Characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd TA = 25°C FROM (INPUT) TO (OUTPUT) VCC 2V 94 250 360 A, B, or C Y or W 4.5 V 30 50 73 6V 25 43 62 2V 74 195 283 4.5 V 23 39 57 6V 20 33 48 2V 49 127 185 4.5 V 15 25 37 6V 13 22 32 2V 22 75 110 4.5 V 9 15 22 6V 8 13 19 Any D G tt Y or W Y or W Y or W MIN TYP MAX MIN MAX UNIT ns ns Operating Characteristics TA = 25°C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance No load Submit Documentation Feedback TYP 70 UNIT pF Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): SN74HC151-Q1 SN74HC151-Q1 www.ti.com............................................................................................................................................................. SCLS701B – JUNE 2006 – REVISED APRIL 2008 PARAMETER MEASUREMENT INFORMATION From Output Under Test VCC Test Point Input 50% 50% 0V CL (see Note A) tPLH In-Phase Output LOAD CIRCUIT tPHL 50% 10% 90% 90% tr Input 50% 10% 90% 90% tPHL VCC 50% 10% 0 V tr Out-of-Phase Output tPLH 90% 50% 10% tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES VOH 50% 10% VOL tf 50% 10% 90% tf VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time, with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): SN74HC151-Q1 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HC151QDRG4Q1 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC151QDRQ1 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74HC151-Q1 : SN74HC151 • Catalog: • Military: SN54HC151 NOTE: Qualified Version Definitions: - TI's standard catalog product • Catalog • Military - QML certified for Military and Defense Applications Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated