BGF127 Low Capacitance ESD protection array • 8-channel ESD protection according to: IEC61000-4-2 (ESD): ± 25 kV (contact) • Max. working voltage: 5.3 V • Very low capacitance < 1.0 pF typ. • Very low reverse current < 1 nA typ. • Wafer level package with SnAgCu solder balls BGF127 A1 A2 A3 B1 B3 C1 C2 C3 B2 Type BGF127 Package WLP-9-1 Configuration 8 channels, uni-directional Marking 27 Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol ESD contact discharge1) VESD Operating temperature range Storage temperature Value Unit ± 25 kV T op -30...85 °C T stg -55...150 1V ESD according to IEC61000-4-2 1 2009-08-20 BGF127 Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Characteristics Reverse working voltage VRWM - - 5.3 Breakdown voltage V(BR) 6 - - IR - <1 10 V I(BR) = 1 mA Reverse current nA VR = 5.3 V Clamping voltage V VCL IPP = 1 A, tp = 8/20 µs1) - 9.9 - IPP = 6 A, tp = 8/20 µs1) - 17 - IPP = 1 A, tp = 8/20 µs1) - 1.8 - IPP = 6 A, tp = 8/20 µs1) - 5.6 - Forward clamping voltage VFC Line capacitance2) pF CT VR = 3 V, f = 1 MHz - 0.9 1.5 Capacitance variation between the 8 channels - 0.01 - - 1 - Dynamic resistance ( tp=30ns ) RD Ω 1I pp according to IEC61000-4-5 2Total capacitance line to ground 2 2009-08-20 BGF127 Reverse current IR = ƒ (TA) Breakdown voltage V BR = ƒ(T A) IR = 1mA VR = Parameter 10 -7 10 V A 9 V BR IR 10 -8 8.5 8 7.5 10 -9 7 6.5 10 -10 0 25 50 75 100 °C 6 -50 150 -25 0 25 50 75 100 °C TA 150 TA Line capacitance CT = ƒ (VR) Change of Line capacitance f = 1MHz CT(VR) / CT(0V) = f (VR) f = 1 MHz 10 1.5 pF CT(VR)/CT (0V) % 1.2 1.1 CT 1 0.9 0.8 6 4 2 0 0.7 -2 0.6 0.5 -4 0.4 -6 0.3 0.2 -8 0.1 0 0 1 2 3 4 V -10 0 6 VR 1 2 3 4 V 6 VR 3 2009-08-20 BGF127 Typical cross talk Package outline WLP-9-1 Footprint 4 2009-08-20 BGF127 Tape and reel specification for WLP-9-1 5 2009-08-20 BGF127 Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2009-08-20