LM108/LM208/LM308 Operational Amplifiers General Description The LM108 series are precision operational amplifiers having specifications a factor of ten better than FET amplifiers over a b55§ C to a 125§ C temperature range. The devices operate with supply voltages from g 2V to g 20V and have sufficient supply rejection to use unregulated supplies. Although the circuit is interchangeable with and uses the same compensation as the LM101A, an alternate compensation scheme can be used to make it particularly insensitive to power supply noise and to make supply bypass capacitors unnecessary. The low current error of the LM108 series makes possible many designs that are not practical with conventional amplifiers. In fact, it operates from 10 MX source resistances, introducing less error than devices like the 709 with 10 kX sources. Integrators with drifts less than 500 mV/sec and analog time delays in excess of one hour can be made using capacitors no larger than 1 mF. The LM108 is guaranteed from b55§ C to a 125§ C, the LM208 from b25§ C to a 85§ C, and the LM308 from 0§ C to a 70§ C. Features Y Y Y Y Maximum input bias current of 3.0 nA over temperature Offset current less than 400 pA over temperature Supply current of only 300 mA, even in saturation Guaranteed drift characteristics Compensation Circuits Standard Compensation Circuit Cf t Alternate* Frequency Compensation R1 CO R1 a R2 CO e 30 pF TL/H/7758 – 1 **Bandwidth and slew rate are proportional to 1/Cf TL/H/7758 – 2 *Improves rejection of power supply noise by a factor of ten. **Bandwidth and slew rate are proportional to 1/Cs Feedforward Compensation TL/H/7758 – 3 C1995 National Semiconductor Corporation TL/H/7758 RRD-B30M115/Printed in U. S. A. LM108/LM208/LM308 Operational Amplifiers December 1994 Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. (Note 5) LM108/LM208 g 20V Supply Voltage Power Dissipation (Note 1) 500 mW g 10 mA Differential Input Current (Note 2) g 15V Input Voltage (Note 3) Output Short-Circuit Duration Continuous b 55§ C to a 125§ C Operating Temperature Range (LM108) b 25§ C to a 85§ C (LM208) b 65§ C to a 150§ C Storage Temperature Range Lead Temperature (Soldering, 10 sec) DIP 260§ C H Package Lead Temp (Soldering 10 seconds) 300§ C Soldering Information Dual-In-Line Package Soldering (10 seconds) 260§ C Small Outline Package Vapor Phase (60 seconds) 215§ C Infrared (15 seconds) 220§ C See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ for other methods of soldering surface mount devices. ESD Tolerance (Note 6) 2000V LM308 g 18V 500 mW g 10 mA g 15V Continuous 0§ C to a 70§ C b 65§ C to a 150§ C 260§ C 300§ C Electrical Characteristics (Note 4) Parameter LM108/LM208 Condition Min Typ LM308 Max Min Units Typ Max Input Offset Voltage TA e 25§ C 0.7 2.0 2.0 7.5 mV Input Offset Current TA e 25§ C 0.05 0.2 0.2 1 nA Input Bias Current TA e 25§ C 0.8 2.0 1.5 7 Input Resistance TA e 25§ C Supply Current TA e 25§ C Large Signal Voltage Gain TA e 25§ C, VS e g 15V VOUT e g 10V, RL t 10 kX 30 70 0.3 50 10 0.6 300 Input Offset Voltage 40 0.3 25 3.0 Input Offset Current 15 6.0 0.4 Average Temperature Coefficient of Input Offset Current 0.5 2.5 0.15 0.4 Input Bias Current 2.0 3.0 Supply Current TA e a 125§ C Large Signal Voltage Gain VS e g 15V, VOUT e g 10V RL t 10 kX Output Voltage Swing VS e g 15V, RL e 10 kX 25 g 13 2 mA V/mV 10 mV 30 mV/§ C 1.5 nA 10 pA/§ C 10 nA mA 15 g 14 0.8 300 3.0 Average Temperature Coefficient of Input Offset Voltage nA MX g 13 V/mV g 14 V Electrical Characteristics (Note 4) (Continued) Parameter LM108/LM208 Condition Min Input Voltage Range VS e g 15V Typ g 13.5 LM308 Max Min Typ g 14 Units Max V Common Mode Rejection Ratio 85 100 80 100 dB Supply Voltage Rejection Ratio 80 96 80 96 dB Note 1: The maximum junction temperature of the LM108 is 150§ C, for the LM208, 100§ C and for the LM308, 85§ C. For operating at elevated temperatures, devices in the H08 package must be derated based on a thermal resistance of 160§ C/W, junction to ambient, or 20§ C/W, junction to case. The thermal resistance of the dual-in-line package is 100§ C/W, junction to ambient. Note 2: The inputs are shunted with back-to-back diodes for overvoltage protection. Therefore, excessive current will flow if a differential input voltage in excess of 1V is applied between the inputs unless some limiting resistance is used. Note 3: For supply voltages less than g 15V, the absolute maximum input voltage is equal to the supply voltage. Note 4: These specifications apply for g 5V s VS s g 20V and b 55§ C s TA s a 125§ C, unless otherwise specified. With the LM208, however, all temperature specifications are limited to b 25§ C s TA s 85§ C, and for the LM308 they are limited to 0§ C s TA s 70§ C. Note 5: Refer to RETS108X for LM108 military specifications and RETs 108AX for LM108A military specifications. Note 6: Human body model, 1.5 kX in series with 100 pF. Schematic Diagram TL/H/7758 – 8 3 Typical Performance Characteristics LM108/LM208 Input Currents Offset Error Drift Error Input Noise Voltage Power Supply Rejection Closed Loop Output Impedance Voltage Gain Output Swing Supply Current Open Loop Frequency Response Large Signal Frequency Response Voltage Follower Pulse Response TL/H/7758 – 6 4 Typical Performance Characteristics LM308 Input Currents Offset Error Drift Error Input Noise Voltage Power Supply Rejection Closed Loop Output Impedance Voltage Gain Output Swing Supply Current Open Loop Frequency Response Large Signal Frequency Response Voltage Follower Pulse Response TL/H/7758 – 7 5 Typical Applications Sample and Hold ² Teflon polyethylene or polycarbonate dielectric capacitor Worst case drift less than 2.5 mV/sec TL/H/7758 – 4 High Speed Amplifier with Low Drift and Low Input Current TL/H/7758 – 5 6 Typical Applications (Continued) Fast ² Summing Amplifier ² Power Bandwidth: 250 KHz *In addition to increasing speed, the LM101A raises high and low frequency gain, increases output drive capability and eliminates thermal feedback. Small Signal Bandwidth: 3.5 MHz Slew Rate: 10V/mS ³ C5 e 6 c 10b8 Rf TL/H/7758 – 12 Connection Diagrams Dual-In-Line Package Metal Can Package TL/H/7758 – 15 TL/H/7758 – 13 Top View *Package is connected to Pin 4 (Vb) Order Number LM108J-8/883, LM308M or LM308N See NS Package Number J08A, M08A or N08E **Unused pin (no internal connection) to allow for input anti-leakage guard ring on printed circuit board layout. Order Number LM108H, LM108H/883, LM308AH or LM308H See NS Package Number H08C TL/H/7758 – 17 Order Number LM108W/883 See NS Package Number W10A TL/H/7758 – 16 Top View Order Number LM108J/883 See NS Package Number J14A ² Also available per JM38510/10104 7 Physical Dimensions inches (millimeters) Ceramic Dual-In-Line Package (J) Order Number LM108J/883 NS Package Number J08A Ceramic Dual-In-Line Package (J) Order Number LM108/883 NS Package Number J14A 8 Physical Dimensions inches (millimeters) (Continued) Metal Can Package (H) Order Number LM108H, LM108H/883 or LM308H NS Package Number H08C S.O. Package (M) Order Number LM308M NS Package Number M08A 9 LM108/LM208/LM308 Operational Amplifiers Physical Dimensions inches (millimeters) (Continued) Molded Dual-In-Line Package (N) Order Number LM308N NS Package Number N08E Ceramic Flatpack Package (W) Order Number LM108AW/883 or LM108W/883 NS Package Number W10A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 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