HOLTIC HI-8201PDIF

HI-8200, HI-8201, HI-8202
Quad 10 Ohm +/-12V outside-the-rails
Analog Switch with
Open Circuit when Power Off
December 2012
GENERAL DESCRIPTION
The HI-8200 is a quad analog CMOS switch fabricated with Silicon-on-Insulator (SOI) technology for latch-up free operation
and maximum switch isolation. High voltage gate drive is entirely created on-chip enabling +/-12V switching range from a
single 3.3V or 5V supply. These switches are ideally suited for
applications demanding low switch leakage when the power
pins are 0V.
At 25°C and with VDD from 3.0V to 5.5V, the switch resistance
(RON) is typically 8W. RON is independent of VDD. In a switching range of -5V to +5V, the maximum deviation of RON from
flat is less than 5%.
These switches conduct equally well in either direction. Power
down and Off state leakages are less than 10nA maximum.
Charge injection is less than 10pC. Switching times are typically 180ns to the On state and 60ns to the Off state. The onboard charge pump allows an On/Off cycle time of 5KHz for all
four switches simultaneously before the switching range becomes restricted.
FEATURES
·CMOS analog switches with up to +/-12V switching range
from a single 3.3V or 5V supply
· Low RON: 10W max at 25°C
· Robust CMOS Silicon-on-Insulator (SOI) technology
· Switch nodes are open-circuit when chip is powered down
· SOI switch isolation with 1nA typical Off leakage
· ESD protection > 4KV HBM
· Fast switching time with break-before-make
· Low power
· Extended Temperature Range (-55°C to +125°C)
PIN CONFIGURATIONS (Top Views)
IN1 1
20 IN2
S1A 2
19 S2A
-3
18 -
S1B 4
17 S2B
V- 5
15 VLOGIC
S4B 7
14 S3B
-8
13 -
S4A 9
12 S3A
IN4 10
11 IN3
14 IN2
13 S2A
HI-8200PSx
20-Pin TSSOP package
16 S1A
Industry-standard plastic package options include 20-pin
TSSOP, 16-pin DIP and 16-pin QFN. Ceramic packaging is
available on request. All three products are offered in both industrial (-40°C to +85°C) and extended (-55°C to +125°C) temperature range options.
16 V+
GND 6
15 IN1
The HI-8200 provides four each normally open switches when
the switch control inputs are low. The HI-8201 provides four
each normally closed switches when the switch control inputs
are low. The HI-8202 provides a combination of two normally
closed and two normally open switches.
S1B 1
12 S2B
V- 2
11 V+
GND 3
APPLICATIONS
10 VLOGIC
S4B 4
IN3 7
S3B
S3A 8
· Avionics
IN4 6
S4A 5
9
· Data bus isolation
· Sample-and-Hold circuits
· Test Equipment
HI-8200PCx
16-pin 5mm x 5mm Chip-scale package
(see page 6 for additional package configurations)
· Communications Systems
PRODUCT OPTIONS
PART TYPE IN1
HI-8200
0
1
HI-8201
0
1
HI-8202
0
1
(DS8200 Rev. B)
HOLT INTEGRATED CIRCUITS
www.holtic.com
Switch 1
Open
Closed
Closed
Open
Open
Closed
IN2
0
1
0
1
0
1
Switch 2
Open
Closed
Closed
Open
Closed
Open
IN3
0
1
0
1
0
1
Switch 3
Open
Closed
Closed
Open
Closed
Open
IN4
0
1
0
1
0
1
Switch 4
Open
Closed
Closed
Open
Open
Closed
12/12
HI-8200, HI-8201, HI-8202
PIN DESCRIPTIONS
SIGNAL
FUNCTION
IN1
S1A
S1B
VGND
S4B
S4A
IN4
IN3
S3A
S3B
VLOGIC
V+
S2B
S2A
IN2
Logic Input
Switch Node
Switch Node
CAP Supply
Switch Node
Switch Node
Logic Input
Logic Input
Switch Node
Switch Node
Supply
CAP +
Switch Node
Switch Node
Logic input
DESCRIPTION
HI-8200 and HI-8202 are normally Open when input Low
Switch 1 Node
Switch 1 Node
Bulk storage capacitor. Add 0.1uF ceramic capacitor to GND. (20V or higher).
Reference Ground
Switch 4 Node
Switch 4 Node
HI-8200 and HI-8202 are normally Open when input Low
HI-8201 and HI-8202 are normally Closed when input Low
Switch 3 Node
Switch 3 Node
3.3V or 5.0V Logic supply
Bulk storage capacitor. Add 0.1uF ceramic capacitor to GND. (20V or higher).
Switch 2 Node
Switch 2 Node
HI-8201 and HI-8202 are normally Closed when input Low
NOTE: V+ and V- pins are only to be used for connection of bulk storage capacitors and MUST NOT be
loaded.
35W
30W
25W
T = -55C
T = +125C
20W
T = +25C
15W
10W
5W
-18V
-12V
-6V
0V
VSWITCH
6V
12V
18V
Typical RON as a function of VSWITCH and
Temperature (10mA switch current, VSUPPLY = +3.3V)
HOLT INTEGRATED CIRCUITS
2
HI-8200, HI-8201, HI-8202
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND = 0V)
Supply Voltage, VLOGIC .........................................................................7.0V Continuous Power Dissipation (TA=70°C):
SO Package (derate 6.7mW/°C above 70°C)...................696mW
Switch Current (either direction, DC): .................................................20mA
Plastic DIP (derate 10.53 mw/°C above 70°C) .................842mW
Peak Switch Current (1 ms pulse, 10% duty cycle max.)..................100mA
Thin QFN (derate 21.3mW/°C above 70°C) ...................1702mW
Digital Input Voltage (IN1-4):.....................................-0.3V to VLOGIC + 0.3V
Operating Temperature Range: (Industrial)..........................-40°C to +85°C Storage Temperature Range:
(Hi-Temp) ........................-55°C to +125°C Soldering Temperature:
Maximum Junction Temperature ........................................................175°C
......................................-65°C to +150°C
(Ceramic)......................60 sec. at +300°C
(Plastic - leads).............10 sec. at +280°C
(Plastic - body) .....................+260°C Max.
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only.
Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
VLOGIC = 3.3V or 5.0V, GND = 0V. Operating temperature range (unless otherwise noted).
PARAMETER
SYMBOL
CONDITIONS
FIGURE
MIN
TYP
MAX
UNIT
RON
12V > Vs > -12V
1
6
8
10
W
|ISWLEAK|
12V > Vs > -12V
2
1
10
nA
SWITCH PARAMETERS
Switch Resistance, 25°C, 10mA
Leakage - (open circuit and
power down)
LOGIC INPUTS
Input High Voltage
VIH
Input Low Voltage
VIL
Input Current
IIH
75%
V
25%
V
0.5
µA
µA
µA
5.5
V
inputs static
VLogic = 3.3V
Vlogic = 5.0V
1.0
2.5
mA
mA
any load
5
Khz
180
250
ns
80
150
80K Ohm pulldown
VLogic = 3.3V
Vlogic = 5.0V
45
65
IIL
SUPPLY
VLogic Operating Range
VDD
VLogic Operating Current
IDD
3.0
DYNAMIC PARAMETERS
Max Vin On/Off cycling
fcycle
Turn On Time
TON
Turn Off time
3
TOFF
3
Break-Before-Make Time
TD
4
Charge Injection
Q
VS=0V, RS=0W, 25°C
Off Isolation
RR
Crosstalk
ns
80
ns
5
-20
pC
f = 1 MHz, 25°C
6
65
dB
CR
f = 1 MHz, 25°C
7
90
dB
Capacitance
COFF
CON
Switch Off, 25°C
Switch On, 25°C
8
9
15
60
pF
pF
Charge Pump Power On
Tvon
V+ and V- = +/-14.5V
VLogic = 5.0V
10
HOLT INTEGRATED CIRCUITS
3
40
10
ms
HI-8200, HI-8201, HI-8202
TEST CIRCUITS
IDS
V1
SA
VS
+
-
RON = V1/IDS
+
-
VS
Figure 1 - On Resistance
+3.3V
0.1µF
0.1µF (20V)
V+
SA
VD
+
-
Figure 2 - Off Leakage
VIN (HI-8201)
VLOGIC
ID(OFF)
SB
A
IS(OFF)
SA
A
SB
50%
50%
50%
50%
VIN (HI-8200)
SB
VOUT
IN
VS
GND
+
-
V-
35pF
90%
300W
50%
VOUT
0.1µF (20V)
t ON
t OFF
Figure 3. Switching Times
0.1µF
+3.3V
0.1µF (20V)
3.3V
VLOGIC
VIN
V+
50%
50%
0V
VS1
VS2
S1A
S1B
S2A
S2B
IN
VOUT1
VOUT2
35pF
GND
V-
35pF
90%
50%
VOUT1
300W
300W
90%
VOUT2
50%
0.1µF (20V)
tD
Figure 4. Break-Before-Make Time Delay (HI-8202)
HOLT INTEGRATED CIRCUITS
4
tD
HI-8200, HI-8201, HI-8202
+3.3V
VLOGIC
RS
0.1µF (20V)
V+
SA
SB
VOUT
VIN
IN
VS
GND
+
-
CL
10nF
V-
DVOUT
VOUT
0.1µF (20V)
QINJ = CL x DVOUT
Figure 5. Charge Injection
0.1µF
0.1µF
+3.3V
+3.3V
0.1µF (20V)
0.1µF (20V)
V+
VLOGIC
VLOGIC
SA1
V+
SA
SB
SB1
50W
IN1
VOUT
VS
IN
IN2
GND
50W
V-
VS
SB2
VOUT
0.1µF (20V)
50W
SA2
GND
NC
V-
0.1µF (20V)
Figure 6 - Off Isolation
Figure 7 - Channel-to-Channel Crosstalk
0.1µF
+3.3V
VLOGIC
0.1µF (20V)
V+
SA
Capacitance
Meter
f=1MHz
0.1µF
VLOGIC
SB
SA
Capacitance
Meter
f=1MHz
IN
GND
+3.3V
V-
0.1µF (20V)
V+
SB
IN
GND
V-
0.1µF (20V)
0.1µF (20V)
Figure 8 - Off Capacitance
Figure 9 - On Capacitance
HOLT INTEGRATED CIRCUITS
5
VS
HI-8200, HI-8201, HI-8202
15V
+3.3V
0.1µF (20V)
10V
VLOGIC
V+
5V
T=0
0V
-5V
GND
+3.3V +-
V-
-10V
-15V
0.1µF (20V)
T=0
2ms
Figure 10. Charge Pump Power On
Additional package configurations
IN1 1
16 IN2
S1A 2
15 S2A
S1B 3
14 S2B
V- 4
13 V+
GND 5
12 VLOGIC
S4B 6
11 S3B
S4A 7
10 S3A
IN4 8
9 IN3
HI-8200PDx
16-Pin DIP package
HOLT INTEGRATED CIRCUITS
6
4ms
6ms
Time
8ms
10ms
HI-8200, HI-8201, HI-8202
ORDERING INFORMATION
HI - 820x xx x x
PART
NUMBER
Blank
F
PART
NUMBER
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder
Pb-free, RoHS compliant
TEMPERATURE
RANGE
FLOW
BURN
IN
I
-40°C TO +85°C
I
NO
T
-55°C TO +125°C
T
NO
M
-55°C TO +125°C
M
YES
PART
NUMBER
PACKAGE
DESCRIPTION
PC
16 PIN PLASTIC 5 x 5 mm CHIP SCALE (16PCS1) (No M-flow, Pb-free only)
PS
20 PIN PLASTIC TSSOP (20HS)
PD
16 PIN PLASTIC DIP (16P)
PART
NUMBER
FUNCTION
8200
QUAD SWITCH, NORMALLY OPEN
8201
QUAD SWITCH, NORMALLY CLOSED
8202
QUAD SWITCH, TWO NORMALLY OPEN, TWO NORMALLY CLOSED
HOLT INTEGRATED CIRCUITS
7
HI-8200, HI-8201, HI-8202
REVISION HISTORY
P/N
Rev
DS8200 New
A
B
Date
10/18/12
10/22/12
12/18/12
Description of Change
Initial Release
Remove 1MOhm resistor to GND from test circuits. Correct typo in Pin Descriptions
Clarify that V+/V- pins must not be loaded. Used only for connection of bulk storage caps.
HOLT INTEGRATED CIRCUITS
8
HI-8200 PACKAGE DIMENSIONS
inches (millimeters)
20-PIN PLASTIC TSSOP
Package Type: 20HS
.2555 ± .0035
(6.500 ± .100)
.252 ± .006
(6.400 ± .150)
.006 ± .002
(.145 ± .055)
.173 ± .004
(4.400 ± .100)
Pin 1
See Detail A
.0095 ± .0025
(.245 ± .055)
.036 ± .005
(.925 ± .125)
.026
BSC
(.650)
0° to 8°
.018 - .029
(.450 - .750)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.004 ± .002
(.100 ± .050)
Detail A
millimeters
16-PIN PLASTIC CHIP-SCALE PACKAGE
Package Type: 16PCS1
Electrically isolated metal
heat sink on bottom of
package
3.38 ± 0.05
(0.133 ± 0.002)
3.38 ± 0.05
(0.133 ± 0.002)
Top View
5.00 ± 0.05
(0.197 ± 0.002)
Connect to any ground or
power plane for optimum
thermal dissipation
Bottom
View
5.00 ± 0.05
(0.197 ± 0.002)
.50 ± 0.05
(0.020 ± 0.002)
0.20
(0.008)
min.
0.75 ± 0.05
(0.03 ± 0.002)
0.203
(0.008)
0.025 ± 0.025
(0.001 ± 0.001)
0.80
(0.031) BSC
REF.
0.30 ± 0.05
(0.012 ± 0.002)
HOLT INTEGRATED CIRCUITS
9
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HI-8200 PACKAGE DIMENSIONS
16-PIN PLASTIC DIP
Package Type:
16P
0.745 (18.923)
0.810 (20.574)
0.240 (6.096)
0.260 (6.604)
0.290 (7.366)
0.310 (7.874)
0.015 (0.381)
0.035 (0.889)
0.125 (3.175)
0.150 (3.810)
0.120 (3.048)
0.150 (3.810)
0.015 (0.381)
0.023 (0.584)
0.100 (2.54) BSC.
0.045 (1.143)
0.065 (1.651)
HOLT INTEGRATED CIRCUITS
10
0.008 (0.203)
0.015 (0.381)
0.300 (7.620)
0.370 (9.398)
inches (millimeters)