ISAHAYA VLA541-01R

HYBRID IC
TENTATIVE
VLA541-01R
Hybrid IC for driving IGBT modules
DESCRIPTION
Dimensions : mm
OUTLINE DRAWING
VLA541 is a hybrid integrated circuit designed for driving
n-channel IGBT modules in any gate-amplifier application.
This device operates as an isolation amplifier for these modules
44 MAX
and provides the required electrical isolation between
the input and output with an opto-coupler.
26MAX
Recommended IGBT modules:
VCES = 600V series up to 200A class
FEATURES
•Electrical isolation between input and output with opto-coupler
2.54
(Viso = 2500Vrms for 1minute)
5.5MAX
•Two supply driver topology
+
5.5 MAX
+0.15
0.5 -0.1
5.5 MAX
3.0 MAX
8 MAX
14
1
•Built-in short circuit protection circuit(With a pin for fault out)
•CMOS compatible input interface
APPLICATIONS
To drive IGBT modules for inverter or AC servo systems application
BLOCK DIAGRAM
LATCH
VI +
DETECT
CIRCUIT
14
4
VCC
2
Ctrip
1
CONTROL PIN
FOR ttrip
TIMER &
RESET CIRCUIT
INTERFACE
OPTO-COUPLER
240 ohm
VI -
GATE SHUTDOWN CIRCUIT
0.2
0.25 - 0.1
4.5+/-1.5
VCES = 1200V series up to 150A class
5
VO
8
FAULT OUTPUT
13
6
VEE
3,7,9,10 pin : Non connection
HYBRID IC
VLA541-01R
TENTATIVE
Hybrid IC for driving IGBT modules
MAXIMUM RATINGS (unless otherwise noted, Ta=25°C)
Symbol
VCC
Parameter
Conditions
Supply voltage
DC
VI
Input signal voltage
Applied between; 13pin and 14pin
50% duty cycle, pulse width 1ms
VO
Output voltage
When the output voltage is “H”
VEE
IOHP
IOLP
Viso
TC
Output peak current
Pulse width 2us
Isolation voltage
Sine wave voltage 60Hz, for 1minute
Case temperature
-
Ratings
Unit
18
V
-15
V
-1 ~ +7
V
VCC
V
-3
A
3
A
2500
Vrms
85
°C
Topr
Operating temperature
No condensation allowable
-20 ~ +60
°C
Tstg
Storage temperature
No condensation allowable
-25 ~ +100 (*1)
°C
IFO
Fault output current
Applied 8pin
20
mA
VR1
Input voltage at 1pin
Applied 1pin
50
V
(*1) Differs from H/C condition
ELECTRICAL CHARACTERISTICS (unless otherwise noted, Ta=25°C, VCC = 15V, VEE = -10V, RG = 10 ohm)
Symbol
Parameter
Conditions
Min
14
-7
Limits
Typ
15
-10
Max
17
-12
Unit
V
V
VCC
VEE
Supply voltage
Recommended range
VIN
Pull-up voltage on primary side
Recommended range
4.75
5
5.25
IIH
“H” input signal current
Recommended range
10
13
16
mA
Switching frequency
Recommended range
-
-
20
kHz
RG
Gate resistance
Recommended range
3
-
-
ohm
IIH
“H” input signal current
VIN = 5V
-
13
-
mA
V
f
V
VOH
“H” output voltage
-
13
14
-
VOL
“L” output voltage
-
-8
-9
-
V
tPLH
“L-H” propagation time
-
-
1
µs
µs
IIH=13mA
“L-H” rise time
IIH=13mA
-
-
1
“H-L” propagation time
IIH=13mA
-
-
1.3
µs
“H-L” fall time
IIH=13mA
-
-
1
µs
Timer
Between start and cancel
(under input signal “OFF”)
1
-
2
ms
IFO
Fault output current
Applied 8pin, R = 4.7k ohm
-
5
-
mA
ttrip1
Pin1: 15V and more, Pin2:open
Pin1: 15V and more, Pin2-4:10pF
(connective capacitance)
-
2.6
-
µs
ttrip2
Controlled time detect short circuit 1
Controlled time detect short circuit 2
(*2)
-
3
-
µs
VSC
SC detect voltage
Collector voltage of IGBT module
15
-
-
V
tr
tPHL
tf
ttimer
(*2) Length of wiring of capacitor controlled time detect short-circuit is within 5cm from pin2 and pin4 coming and going.
DEFINITION OF CHARACTERISTICS
(1) SWITCHING OPERATION
(2) SHORT CIRCUIT PROTECTION
Input signal VI 0V
Input signal VI
tr
tf
Output VO
90%
0V
-5V
50%
Output VO
ttrip1,2
ttimer
10%
10V
8pin output
tPLH
tPHL
2
0V
10V
HYBRID IC
VLA541-01R
TENTATIVE
Hybrid IC for driving IGBT modules
OPERATION OF PROTECTION CIRCUIT
(1)
APPLICATION CIRCUIT EXAMPLE
In case the gate voltage is “H” and the collector voltage is
high, this hybrid IC will recognize the circuit as short
4.7k
circuit and immediately reduce the gate voltage.
Besides, put out an error signal (”L”) which inform that
8
D1
protection circuit is operating at the same time from pin8.
(2)
1
The protection circuit reset and resort to ordinary condition
30v
Ctrip
( “OFF” period needs 10us or more )
(3)
DZ1
2
VIN (5V)
if input signal is “OFF” when the premised 1~2msec passed.
Rg
When the output rises, the controlled time detect short
5
14
VLA541
circuit (Typ 2.6us) is set up so that on-time of IGBT can be
secured properly.
4
VCC
47uF
13
It is possible to adjust that time by connecting the capacitor
HC04 etc.
(Ctrip) between pin2 and 4.
47uF
VEE
6
VCC = 15V
VEE = 10V
Ctrip = 0 ~ 39pF (Rough guide ,
OPERATION FLOW ON DETECTING SHORTCIRCUIT
50V,ceramic)
D1: Fast recovery diode (trr ≤ 0.2us)
RP1H (SanKen) etc.
PRECAUTION
START
(1)
Voltage compensate capacitors are expected to be located
(1)
D1 requires approximately the same voltage of power modules.
(2)
If reverse recovery time of D1 is long, pin1 is applied high voltage.
as close as possible from the hybrid IC.
DETECTION OF
SHORT CIRCUIT
In that case, counterplan for protection which insert a zener
diode between pin 1 and 6 is necessary like above diagram.
(3)
In case pin 2 is operating, the Ctrip is expected to be wired
as close as possible from pin 2 and pin 4.
(Less than 5cm coming and going)
GATE SHUTDOWN
TIMER START
OUTPUT ALARM
1 ~ 2ms
APPLICATION EXAMPLE OF SINGLE
POWER SUPPLY
END OF TIMER
4.7k
No
Yes
INPUT SIGNAL IS
OFF
8
D1
1
DZ1
2
VIN (5V)
No
30v
Ctrip
Rg
Yes
14
5
VLA541
CLEAR ALARM
13
ENABLE OUTPUT
4
47uF
R
VCC
47uF
DZ2
(*) Output voltage with protection circuit operating is about -lVEEl+2V
6
VCC = 24V
R : 2.7k ~3.3kohm
3
DZ2 : 8.2V , 1/2W
HYBRID IC
VLA541-01R
TENTATIVE
Hybrid IC for driving IGBT modules
FOR SAFETY USING
Great detail and careful attention are given to the production activity of Hics, such as the development, the quality of production, and
in it’s reliability. However the reliability of Hics depends not only on their own factors but also in their condition of usage. When
handling Hics, please note the following cautions.
CAUTIONS
Packing
The materials used in packing Hics can only withstand normal external conditions.
When exposed to outside shocks, rain and certain environmental contaminators, the packing materials
will deteriorates. Please take care in handling.
Carrying
Storage
1)
Don’t stack boxes too high. Avoid placing heavy materials on boxes.
2)
Boxes must be positioned correctly during transportation to avoid breakage.
3)
Don't throw or drop boxes.
4)
Keep boxes dry. Avoid rain or snow.
5)
Minimal vibration and shock during transportation is desirable.
When storing Hics, please observe the following notices or possible deterioration of their electrical
characteristics, risk of solder ability, and external damage may occur.
1)
Devices must be stored where fluctuation of temperature and humidity is minimal, and must not
be exposed to direct sunlight. Store at the normal temperature of 5 to 30 degrees Celsius with
humidity at 40 to 60%.
2)
Extended storage
Avoid locations where corrosive gasses are generated or where much dust accumulates.
3)
Storage cases must be static proof.
4)
Avoid putting weight on boxes.
When extended storage is necessary, Hics must be kept non-processed. When using Hics which
have been stored for more than one year or under severe conditions, be sure to check that the exterior
is free from flaw and other damages.
Maximum ratings
To prevent any electrical damages, use Hics within the maximum ratings. The temperature, current,
voltage, etc. must not exceed these conditions.
Polarity
To protect Hics from destruction and deterioration due to wrong insertion, make sure of polarity in
inserting leads into the board holes, conforming to the external view for the terminal arrangement.
4
HYBRID IC
VLA541-01R
TENTATIVE
Hybrid IC for driving IGBT modules
Marketing division, Marketing planning department
6-41 Tsukuba, Isahaya, Nagasaki, 854-0065 Japan
Keep safety first in your circuit designs!
·ISAHAYA Electronics Corporation puts the maximum effort into making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or
property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures
such as (1) placement of substitutive, auxiliary, (2) use of non-farmable material or (3) prevention against any malfunction or
mishap.
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originating in the use of any product data, diagrams, charts or circuit application examples contained in these materials.
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5
Apr. 2010