HYBRID IC PRELIMINARY VLA539-01R DRIVER FOR IGBT MODULES DESCRIPTION VLA539 is a hybrid integrated circuit designed for driving n-channel IGBT modules in any gate-amplifier application. OUTLINE DRAWING Dimensions : mm Electrical isolation voltage between input and output is 4000Vrms 88.0 MAX (for 1minute).This device include the isolated type DC-DC converter for a Gate drive. Therefore design of the gate power supply is not required. 42MAX The system of built-in short circuit protection provide a margin to time by function to maintain reverse bias for a predetermined time after the detection of short circuit. Recommended IGBT modules: 0.7MAX 3.5+/-1 VCES = 600V series up to 600A class VCES = 1200V series up to 3600A class 2.54 VCES = 1700V series up to 3600A class FEATURES 8.0MAX 17.0MAX 1 •Built-in the isolated type DC-DC converter for gate drive 11.5MAX 6.0MAX 0.75 +/-0.1 8.0 MAX 30 •SIP outline allows more space on mother board •Built-in short circuit protection (With a pin for fault output) •Variable fall time on activity of short circuit protection •Electrical isolation voltage between input and output is 4000Vrms (for 1minute) •CMOS compatible input. APPLICATIONS To drive IGBT modules for general industrial use apparatus. BLOCK DIAGRAM 19 Vcc VD Gi DC-AC CONVERTER 1 2 3 REGULATOR LATCH DETECT CIRCUIT 29 30 ttrip CONTROL DETECT PIN 4 20 TIMER &RESET CIRCUIT VI+ 6 INTERFACE GND 25 26 Vcc 23 Vo 24 GATE SHUTDOWN CIRCUIT 240 ohm VI- 7 27 SHUT-DOWN SPEED CONTROL 28 FAULT OUTPUT 21 5,17,18 pin : N.C. 22 VEE HYBRID IC PRELIMINARY VLA539-01R DRIVER FOR IGBT MODULES MAXIMUM RATINGS (Unless otherwise noted, Ta=25°C) Symbol Parameter Conditions Ratings Unit -1～16.5 V -1 ~ +7 V VD Supply voltage DC VI Input signal voltage Applied between pin 6 – 7 50% duty cycle, pulse width 1ms Output current Pulse width 3µs Viso Isolation voltage Sine wave voltage 60Hz, for 1min. , R.H.<60% TC1 Case temperature1 Surface temperature(opto-coupler mounting part) (*3) 85 °C TC2 Case temperature2 Surface temperature(excepting opto-coupler mounting part) 100 °C Topr Operating temperature No condensation allowable -20 ~ +60 °C Tstg Storage temperature -25 ~ +100 (*1) °C IFO Fault output current No condensation allowable Applied pin 28 20 mA IOHP IOLP VR30 Input voltage to pin 30 Applied pin 30 Idrive Gate drive current Gate average current -24 A 24 A 4000 Vrms 60 V 210(*2) mA (*1) Differs from H/C condition (*2) Refer to Idrive-Ta CHARACTERISTICS (Now preliminary) (*3) Refer to the below figure. Tc1 measurement point (opto-coupler mounting part) Marking side ELECTRICAL CHARACTERISTICS (Unless otherwise noted, Ta=25°C, VD=15V, RG=1 ohm, CL=1.6uF, f=3kHz ) Symbo l Parameter Conditions Limits Typ 15 Max 15.8 Unit VD Supply voltage Recommended range Min 14.2 VIN Pull-up voltage on input side Recommended range 4.75 5 5.25 IIH Input signal current Recommended range 10 12 16 mA ｆ Switching frequency Recommended range - - 10 kHz RG Gate resistance Recommended range 0.33 - - ohm IIH Input signal current VIN = 5V - 12 - mA Vcc Gate positive supply voltage - 15.2 16.5 17.5 V VEE Gate negative supply voltage - HCMOS drive V V -6 -8 -11.5 V 60 72 - % 15.3 16.5 V Eta Gate supply efficiency Load current = 210mA Eta = (Vcc+lVEE l) x 0.21 / (15 x ID) x 100 VOH “H” output voltage 10k ohm connected between pin 23-20 14 VOL “L” output voltage 10k ohm connected between pin 23-20 -5.5 -7 -11 V tPLH “L-H” propagation time IIH = 12mA 0.5 0.9 1.5 µs “L-H” rise time IIH = 12mA - 0.6 1.2 µs IIH = 12mA 0.5 1.0 1.5 µs tr tPHL “H-L” propagation time “H-L” fall time IIH = 12mA - 0.3 Timer Between start and cancel (under input sign “OFF”) 1 - 1.2 2 ms IFO Fault output current Applied pin 28, R = 4.7k ohm - 5 - mA ttrip1 Controlled time detect short circuit 1 Pin 30 : 15V and more, - 3.5 - µs ttrip2 Controlled time detect short circuit 2 (*4) Pin 30 : 15V and more, pin 29-21,22 : 10pF (connective capacitance) - 3.9 - µs VSC SC detect voltage Collector voltage of IGBT 15 - - V tf ttimer pin 29 : open (*4) Length of wiring of condenser controlled time detect short-circuit is within 5cm from pin 21,22 and 29 coming and going. DEFINITION OF CHARACTERISTICS µs HYBRID IC PRELIMINARY VLA539-01R DRIVER FOR IGBT MODULES (1)SWITCHING OPERATION (2)OPERATION OF SHORT CIRCUIT PROTECTION VI VI VO tr tf 0V VO 0V -5V 90% 12.5V ttrip1,2 ttimer 0V 10V 0V tPHL tPLH 10V Pin 28 output -5V APPLICATION EXAMPLE D1 30 1 23 2 CM1800DY-34S etc. RG 24 VD Dz2 3 RC filter ~10us Dz3 20 4 Dz1 VLA539 VIN 21 4.7k Ctrip 6 Control signal Î 7 29 Cs 27 HC04 etc. PC1 19 4.7k PC1 28 4.7k VD=15V +/-5% VIN=5V +/-5% PC1 : TLP781 (TOSHIBA) etc. Ctrip : Depend on RG Cs : Depend on surge voltage Dz1 : 30V, 0.5W Dz2,3 : 18V, 0.5W D1 : Fast recovery diode (trr : 200ns Max) RP1H(SanKen) etc. PRECAUTION (1) Voltage compensate capacitors are expected to be located as close as possible to the Hybrid IC. (2) Minimize the area of closed circuit of gate circuit so as not to be affected by induction noise. (3) D1 requires approximately the same voltage of power modules. (4) When recovery current flow in D1 , pin 30 is applied high voltage . In that case , counterplan for protection which insert a zener diode between pin21 and 30 are necessary like above diagram. (5) When you make late speed of reverse bias at the time of short circuit protection operation, please adjust and connect a capacitor between pin 21 and 27. (6) When the built in short-circuit protection circuit need not be used, please connect resistance of 4.7k ohm between pin 30 and 20. (D1 and Dz1 are not required.) HYBRID IC PRELIMINARY VLA539-01R DRIVER FOR IGBT MODULES OPERATION OF PROTECTION CIRCUIT ADJUSTMENT OF OUTPUT FALL TIME (1) (When the protection circuit is operating) In case the gate voltage is “H” and the collector voltage is high, this Hybrid IC will recognize the circuit as short circuit and immediately (2) In case you want to decrease the speed of reverse bias when the reduce the gate voltage . Besides, put out a fault sign (“L”) which protection circuit is operating, you can adjust that speed by connecting inform that protection circuit is operating at the same time from pin 28 . the capacitor (Cs) between pin 21 and 27. The protection circuit reset and resorted to ordinary condition if input (Please refer to under figures. ) sign is “L” when the predetermined time(1 ~ 2ms) passed. (“L” period needs 15us or more ) (3) When the output rises, the controlled time detect short circuit INPUT SIGNAL (Typ 2.8us) is set up so that on-time of IGBT can be secured properly. t2 t1 It is possible to adjust that time by connecting the capacitor (Ctrip) 90% between pin 21,22 and 29. 50% OPERATION FLOW ON DETECTING SHORT CIRCUIT 0% 10% Vo START t1,t2 VS. Cs CHARACTERISTICS (TYPICAL) GATE SHUTDOWN TIMER START OUTPUT ALARM END OF TIMER 1 ~ 2ms NO FALL TIME ON ACTIVITY OF SHORT CIRCUIT PROTECTION t1,t2(us) 45 DETECTION OF SHORT CIRCUIT V D = 15 V 40 Ta=2 5deg 35 30 25 t2 20 15 10 t1 5 0 0 YES INPUT SIGNAL IS “OFF” NO YES CLEAR ALARM ENABLE OUTPUT Note : Output voltage with protection circuit operating is about -lVEEl + 2V. 10 0 200 30 0 40 0 500 60 0 700 CONNECTIVE CAPACITANCE Cs(pF) (PIN:27 -2 1) 80 0 HYBRID IC PRELIMINARY VLA539-01R DRIVER FOR IGBT MODULES FOR SAFETY USING Great detail and careful attention are given to the production activity of Hics, such as the development, the quality of production, and in it’s reliability. However the reliability of Hics depends not only on their own factors but also in their condition of usage. When handling Hics, please note the following cautions. CAUTIONS Packing The materials used in packing Hics can only withstand normal external conditions. When exposed to outside shocks, rain and certain environmental contaminators, the packing materials will deteriorates. Please take care in handling. Carrying Storage 1) Don’t stack boxes too high. Avoid placing heavy materials on boxes. 2) Boxes must be positioned correctly during transportation to avoid breakage. 3) Don't throw or drop boxes. 4) Keep boxes dry. Avoid rain or snow. 5) Minimal vibration and shock during transportation is desirable. When storing Hics, please observe the following notices or possible deterioration of their electrical characteristics, risk of solder ability, and external damage may occur. 1) Devices must be stored where fluctuation of temperature and humidity is minimal, and must not be exposed to direct sunlight. Store at the normal temperature of 5 to 30 degrees Celsius with humidity at 40 to 60%. 2) Extended storage Avoid locations where corrosive gasses are generated or where much dust accumulates. 3) Storage cases must be static proof. 4) Avoid putting weight on boxes. When extended storage is necessary, Hics must be kept non-processed. When using Hics which have been stored for more than one year or under severe conditions, be sure to check that the exterior is free from flaw and other damages. Maximum ratings To prevent any electrical damages, use Hics within the maximum ratings. The temperature, current, voltage, etc. must not exceed these conditions. Polarity To protect Hics from destruction and deterioration due to wrong insertion, make sure of polarity in inserting leads into the board holes, conforming to the external view for the terminal arrangement. HYBRID IC PRELIMINARY VLA539-01R DRIVER FOR IGBT MODULES Marketing division, Marketing planning department 6-41 Tsukuba, Isahaya, Nagasaki, 854-0065 Japan Keep safety first in your circuit designs! ·ISAHAYA Electronics Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (1) placement of substitutive, auxiliary circuits, (2) use of non-flammable material or (3) prevention against any malfunction or mishap. Notes regarding these materials ·These materials are intended as a reference to our customers in the selection of the ISAHAYA products best suited to the customer’s application; they don't convey any license under any intellectual property rights, or any other rights, belonging to ISAHAYA or a third party. ·ISAHAYA Electronics Corporation assumes no responsibility for any damage, or infringement of any third party's rights, originating in the use of any product data, diagrams, charts or circuit application examples contained in these materials. ·All information contained in these materials, including product data, diagrams and charts, represent information on products at the time of publication of these materials, and are subject to change by ISAHAYA Electronics Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact ISAHAYA Electronics Corporation or an authorized ISAHAYA products distributor for the latest product information before purchasing product listed here in. ·ISAHAYA Electronics Corporation products are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact ISAHAYA Electronics Corporation or an authorized ISAHAYA products distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. ·The prior written approval of ISAHAYA Electronics Corporation is necessary to reprint or reproduce in whole or in part these materials. ·If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. ·Please contact ISAHAYA Electronics Corporation or authorized ISAHAYA products distributor for further details on these materials or the products contained there in. Jun.2010