KODENSHI SMN18T50FD

SMN18T50FD
Advanced N-Ch Power MOSFET
SWITCHING REGULATOR APPLICATION
Features
 Drain-Source breakdown voltage: BVDSS = 500V
 Low gate charge: Qg=65nC (Typ.)
 Low drain-source On resistance: RDS(on)=0.21Ω (Typ.)
 100% avalanche tested
 RoHS compliant device
Ordering Information
Part Number
Marking
Package
SMN18T50FD
SMN18T50
TO-220F-3L
GDS
TO-220F-3L
Marking Information
Column 1: Manufacturer
Column 2: Production Information
e.g.) FYMDD
-. F: Factory Management Code
-. YMDD: Date Code (Year, Month, Date)
Column 3: Device Code
AUK
AUK
FYMDD
ΔYMDD
SMN18T50
SDB20D45
Absolute maximum ratings (TC=25C unless otherwise noted)
Characteristic
Symbol
Rating
Unit
Drain-source voltage
VDSS
500
V
Gate-source voltage
VGSS
30
V
Tc=25C
18
A
Tc=100C
11.4
A
IDM
72
A
EAS
900
mJ
Repetitive avalanche current (Note 1)
IAR
18
A
Repetitive avalanche energy (Note 1)
EAR
4.8
mJ
Power dissipation
PD
48
W
dv/dt
4.5
V/ns
Junction temperature
TJ
150
C
Storage temperature range
Tstg
-55~150
C
Drain current (DC) *
Drain current (Pulsed)
ID
*
Single pulsed avalanche energy
Peak diode recovery dv/dt
(Note 2)
(Note 3)
* Drain current limited by maximum junction temperature
Rev. date: 27-MAR-13
KSD-T0O097-001
www.auk.co.kr
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SMN18T50FD
Thermal Characteristics
Characteristic
Symbol
Rating
Unit
Thermal resistance, junction to case
Rth(j-c)
Max. 2.6
Thermal resistance, junction to ambient
Rth(j-a)
Max. 62.5
C/W
Electrical Characteristics (TC=25C unless otherwise noted)
Characteristic
Symbol
Test Condition
Min.
Typ.
Max.
Unit
500
-
-
V
Drain-source breakdown voltage
BVDSS
ID=250uA, VGS=0
Gate threshold voltage
VGS(th)
ID=250uA, VDS=VGS
2
-
4
V
VDS=500V, VGS=0V
-
-
1
uA
VDS=400V, Tc=125C
-
-
100
uA
VDS=0V, VGS=30V
-
-
100
nA
RDS(ON)
VGS=10V, ID=9A
-
0.21
0.26

Forward transfer conductance (Note 4)
gfs
VDS=10V, ID=9A
-
24.6
-
S
Input capacitance
Ciss
-
3120
-
-
355
-
Drain-source cut-off current
IDSS
Gate leakage current
IGSS
Drain-source on-resistance
VDS=25V, VGS=0V,
f=1.0MHz
Output capacitance
Coss
Reverse transfer capacitance
Crss
-
27
-
td(on)
-
95
-
-
375
-
-
100
-
-
105
-
-
65
85
-
17.6
-
-
18.4
-
Turn-on delay time
(Note 4,5)
(Note 4,5)
tr
Turn-off delay time (Note 4,5)
td(off)
Rise time
Fall time (Note 4,5)
Total gate charge
VDD=250V, ID=18A,
RG=25Ω
tf
(Note 4,5)
Gate-source charge
Qg
(Note 4,5)
Gate-drain charge (Note 4,5)
VDS=400V, VGS=10V,
ID=18A
Qgs
Qgd
pF
ns
nC
Source-Drain Diode Ratings and Characteristics (TC=25C unless otherwise noted)
Characteristic
Symbol
Test Condition
Min.
Typ.
Max.
Unit
-
-
18
A
-
-
72
A
Source current (DC)
IS
Source current (Pulsed)
ISM
Integral reverse diode
in the MOSFET
Forward voltage
VSD
VGS=0V, IS=18A
-
-
1.4
V
trr
IS=18A, VGS=0V
dIS/dt=100A/us
-
507
-
ns
-
7.2
-
uC
Reverse recovery time (Note 4,5)
Reverse recovery charge
(Note 4,5)
Qrr
Note:
1. Repeated rating: Pulse width limited by safe operating area
2. L=5mH, IAS=18A, VDD=50V, RG=25, Starting TJ=25C
3. IS≤18A, di/dt≤200A/us, VDD≤BVDSS, Starting TJ=25C
4. Pulse test: Pulse width≤300us, Duty cycle≤2%
5. Essentially independent of operating temperature typical characteristics
Rev. date: 27-MAR-13
KSD-T0O097-001
www.auk.co.kr
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SMN18T50FD
Electrical Characteristics Curve
Fig. 1 ID - VDS
Fig. 2 ID – VGS
℃
-
Fig. 3 RDS(ON) - ID
Fig. 4 IDR - VSD
℃
Reverse Drain Current, IDR [A]
60
VGS =0V
250㎲ Pulse Test
50
150℃
40
30
25℃
20
10
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Source - Drain Voltage, VSD [V]
Fig. 5 Capacitance - VDS
Gate-source voltage VGS [V]
Fig. 6 VGS - QG
Note
ID=18A
Tc=25
10
VDD=400V
5
0
0
15
30
45
75
60
Total Gate Charge Qg [nC]
Rev. date: 27-MAR-13
KSD-T0O097-001
www.auk.co.kr
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SMN18T50FD
Electrical Characteristics Curve (Continue)
Fig. 7 BVDSS - TJ
Fig. 8 RDS(ON) - TJ
3.0
RDS(on) ' (Nomalized)
2.5
Note
1.VGS=10A
2. ID=9A
2.0
1.5
1.0
0.5
0.0
-50
-25
Fig. 9 ID - TC
0
25
50
75
100
125
150
Junction Temperature, TJ [°C]
C
Fig. 10 Safe Operating Area
Fig. 11 Transient Thermal Impedance
Rev. date: 27-MAR-13
KSD-T0O097-001
www.auk.co.kr
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175
SMN18T50FD
Fig. 12 Gate Charge Test Circuit & Waveform
Fig. 13 Resistive Switching Test Circuit & Waveform
Fig. 14 EAS Test Circuit & Waveform
Rev. date: 27-MAR-13
KSD-T0O097-001
www.auk.co.kr
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SMN18T50FD
Fig. 15 Diode Reverse Recovery Time Test Circuit & Waveform
Rev. date: 27-MAR-13
KSD-T0O097-001
www.auk.co.kr
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SMN18T50FD
Package Outline Dimensions
Rev. date: 27-MAR-13
KSD-T0O097-001
www.auk.co.kr
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SMN18T50FD
The AUK Corp. products are intended for the use as components in general electronic
equipment (Office and communication equipment, measuring equipment, home
appliance, etc.).
Please make sure that you consult with us before you use these AUK Corp. products
in equipments which require high quality and / or reliability, and in equipments which
could have major impact to the welfare of human life(atomic energy control, airplane,
spaceship, transportation, combustion control, all types of safety device, etc.). AUK
Corp. cannot accept liability to any damage which may occur in case these AUK Corp.
products were used in the mentioned equipments without prior consultation with AUK
Corp..
Specifications mentioned in this publication are subject to change without notice.
Rev. date: 27-MAR-13
KSD-T0O097-001
www.auk.co.kr
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