HGL341A thru HGL341M SURFACE SURFACEMOUNT GLASS FEATURES DO-213AA / MINI MELF Ldeal for surface mounted applications Low leakage current Glass passivated chips High temperature soldering guaranteed 250oC/10 seconds/.375 , (9.5mm) lead lengths SOLDERABLE ENDS CATHODE BAND D1= 0.066(1.676) 0.060(1.524) D2 MECHANICAL DATA 0.022(0.559) 0.016(0.406) 0.145(3.683) 0.131(3.327) Case Molded plastic use UL94V-0 recoqnized flame retardant epoxy Terminals Plated terminals, solderable per MIL-STD-202, Method208 Polarity Color band on body denotes cathode Mounting position Any Weight 0.036gram D2=D1 +0 -0.008(0.20) Dimension in inches (millimeters ) MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS Ratings at 25oC ambient temp. unless otherwise specified Single phase, half sine wave, 60Hz, resistive or inductive load For capacitive load, derate current by 20% SYMBOL HGL 341A HGL 341B HGL 341D HGL 341G HGL 341J HGL 341K HGL 341M UNITS Maximum Current Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 Volts Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 Volts Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 Maximum Average Forward Rectified Current TT=550C I(AV) 1.0 Amps Peak Forward Surge Current Single Sine-Wave on Rated Load (JEDEC Method) IFSM 10 Amps Maximum Instantaneous Forward Voltage Drop at 1.0A DC VF 1.1 1.3 0 1.75 Volts Volts Maximum DC Reverse Current TA=25 C at Rated DC Blocking Voltage TA=1250C IR Maximum Reverse Recovery Time, Test Conditions IF=0.5A, IR=1.0A , IRR=0.25A TRR 50 75 nS Typical Junction Capacitance CJ 17 15 pF Operating Junction and Storage Temperature Range TJ TSTG 5.0 100 A -55 to +150 http://www.luguang.cn Email:[email protected] 0 C HGL341A thru HGL341M http://www.luguang.cn Email:[email protected] RECT