http://www.luguang.cn Email: [email protected] 1 SCOPE This specification shall cover the characteristics of the ceramic fliter with the type LTCV10.7MJ. The LTCV10.7MJ filters are small, high performance and very thin (1.5mm) chip devices consisting of 2 ceramic elements for communication equipment. They are designed on MgTiO3 ceramic cap package. 2 PART NO. PART NUMBER CUSTOMER PART NO. SPECIFICATION NO. LTCV10.7MJ 3 OUTLINE DRAWING 3.1 Appearance No visible damage and dirt. 3.2 Dimensions 7.0± 0.3 4.1± 0.4 1.2± 0.3 1.2± 0.3 1.2± 0.3 MJ 3.0± 0.3 1.5± 0.2 ① ② ③ range of frequency 1.5± 0.2 ①:Input ②:Ground ③:output 1.2± 0.3 1.2± 0.3 1.2± 0.3 Unit:mm DRAWING 1 SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 1 http://www.luguang.cn Email: [email protected] 3.3 STRUCTURE Output/Input Electrode Cermic Cover Oscillation Electrode glue Cermic Substrate 4 ELECTRICAL SPECIFICATIONS TABLE 1 Items Requirements Center Frequency(fo)(MHz) A:10.700±0.030 B:10.670±0.030 The center point of 3dB band width is C:10.730±0.030 D:10.640±0.030 defined as the center frequency and E:10.760±0.030 identified by the letters:A,B,C,D or E. 3dB Bandwidth(kHz) 150±40 380 20dB Bandwidth(kHz) max 5.5±2.0 Insertion Loss (dB) max Ripple (dB) max Spurious Response (dB) min 1.0 (within 3dB Bandwidth) 35 (9MHz-12MHz) Input/Output Impedance(Ω) 330 Withstanding Voltage 50V DC Insulation Resistance (MΩ) min 100 1 min (DC 10V) Operating temperature range(℃) -25～+85 Storage temperature range(℃) -40～+85 SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 2 http://www.luguang.cn Email: [email protected] 5 TEST 5.1 Test Conditions Parts shall be tested under a condition (Temperature:+20℃±15℃， Humidity:65%±20%R.H.)unless the standard condition (Temperature:+25℃±3℃, Humidity:65%±5% R.H.) is regulated to test. 5.2 Test Circuit: 3 1 Rg 2 R2 S.S.G. DRAWING 2 C2 RF Voltmeter R1=280Ω(1±5%),R2=330Ω(1±5%),Rg=50Ω C2=10 PF (Including stray capacitance and capacitance of RF Voltmeter) S.S.G:Output Voltmeter ①:Input ②:Ground ③:Output 6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS TABLE 2 No Item 2.1 Humidity 2.2 2.3 High Temperature Exposure Low Temperature Exposure 2.4 Temperature Cycling 2.5 Soldering Test Performance Requirements Stored at 40℃±2℃，in 90%～95%R.H. for It shall fulfill the 96h, and left at room temp. for 1h before specifications in measurement.。 Table 3. It shall fulfill the Stored in 85℃±2℃ for 96h，and left at specifications in room temp. for 1h before measurement. Table 3. It shall fulfill the Stored in -40℃±3℃ for 96h，and left at specifications in room temp. for 1h before measurement. Table 3. After temp. cycling of -40℃(30 min) to +85℃(30 min) was performed 5 times, filter shall be measured after being placed in natural condition for 1h . Passed through the reflow oven under the following condition for 2 times, and left at room temp. for 24h before measurement. Condition of Test SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 3 http://www.luguang.cn 2.6 Solderability 2.7 Drop test Vibration 2.8 Email: [email protected] Dipped in 235℃±5℃ solder bath for 3s± 0.5s with rosin flux. Temperature at the surface of Time the substrate Preheat 150℃±5℃ 60s±10s Peak 235℃±5℃ 10s±3s The terminals shall be at least 95% covered by solder It shall fulfill Free drop to the wood plate from the height of specifications 70 cm for 3 times. Table 3. Apply the vibration of sweep frequency 10 to It shall fulfill 55Hz/minutes, amplitude 1.5mm, duration 2h specifications in each direction of 3 planes. Table 3. Mount a glass-epoxy board (Width=40mm, thickness=1.6mm),then bend it to 1mm displacement and keep it for 5s. (See the following figure) the in the in PRESS Board Bending 2.9 PRESS HEAD Mechanical damage such as breaks shall not occur. SUPPORT BAR TABLE 3 SPECIFICATION AFTER TEST ABOUT CHARACTERISTICS No. Item Specification after test 3.1 Insertion Loss Drift (dB) max ±2 3.2 3dB Bandwidth Drift (kHz) max ±25 20dB Bandwidth Drift (kHz) max ±60 Note ： The limits in the above table are referenced to the initial measurements. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 4 http://www.luguang.cn Email: [email protected] 7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING STANDARD CONDITIONS 7.1 Recommended land pattern 2.9± 0.3 4.0±0.3 2.9± 0.3 1.5± 0.3 1.5± 0.3 1.5± 0.3 DRAWING 4 ℃ 7.2 Recommended reflow soldering standard conditions w ithin 10s ℃ Pre-heating within 80s-120s. within 20s-40s DRAWING 5 8 PACKAGE To protect the products in storage and transportation，it is necessary to pack them（outer and inner package）.On paper pack, the following requirements are requested. 8.1 Dimensions and Mark At the end of package, the warning (moisture proof, upward put) should be stick to it. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 5 http://www.luguang.cn Email: [email protected] Dimensions and Mark (see below) 1 2 3 4 5 6 7 Package Certificate ofapproval Label Tying Adhesive tape Belt Box Inner U N IT:m m DRAWING 6 8.2 Section of package Package is made of corrugated paper with thickness of 0.8cm.Package has 12 inner boxes, each box has 5 reels (each reel for plastic bag). 8.3 Quantity of package Per plastic reel 1000 pieces of piezoelectric ceramic part Per inner box 5 reels Per package （60000 pieces of 12 inner boxes piezoelectric ceramic part ） 8.4 Reel φ max SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 6 http://www.luguang.cn 8.5 Packing Method Sketch Map Blank Pocket 10 Pitches Email: [email protected] Loaded Pocket Blank Pocket 10 Pitches Leader 200mm Max 8.6 Test Condition Of Peeling Strength T op T ape S tre n g t P e e lin g h 20-70g 10° Max C a rrie r T a p e 9 OTHER 9.1 Caution of use 9.1.1 Do not use this product with bend. Please don’t apply excess mechanical stress to the component and terminals at soldering. 9.1.2 The component may be damaged when an excess stress will be applied. 9.1.3 Conformal coating of the component is acceptable, However the resin materials ,curing temperature and other process conditions should be evaluated to conform stable electrical characteristics are maintained. 9.2 Notice 9.2.1 This specification mentions the quality of the component as a single unit. Please insure the component is thoroughly evaluated in your application circuit. 9.2.2 Please return one of this specification after your signature of acceptance. 9.2.3 When something gets doubtful with this specifications, we shall jointly work to get an agreement. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 7