LUGUANG LTCS107MA5

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SCOPE
This specification shall cover the characteristics of the ceramic
fliter with the
type LTCS10.7MA5. The LTCS10.7MA5 filters are small, high performance and very
thin (1.4mm) chip devices consisting of 2 ceramic elements for communication
equipment. They are designed on MgTiO3 ceramic cap package.
2
PART NO.
PART NUMBER
CUSTOMER PART NO.
SPECIFICATION NO.
LTCS10.7MA5
3 OUTLINE DRAWING AND STRUCTURE
3.1
Appearance
No visible damage and dirt.
3.2
Except the chip(ceramic element, ceramic base, capacitance slice), the materials
don’t contain lead.
3.3 Dimensions
A5 *
Input electrode marker
(1)
(2)
(3)
(4)
(*)
:Input
:Ground
:Float(signal line)
:Output
:Range of frequency
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Email: [email protected]
ELECTRICAL SPECIFICATIONS
4.1 RATING
Items
Content
Withstanding Voltage (V)
50 (DC,1min)
Insulation Resistance Ri,(MΩ)min.
100 (100V,1min)
Operating Temperature Range (℃)
-20~+80
Storage Temperature Range (℃)
4.2 ELECTRICAL SPECIFICATIONS
Items
-40~+85
Content
A:10.700±0.030
B:10.670±0.030
Center Frequency(fo) (MHz)*
C:10.730±0.030
D:10.640±0.030
E:10.760±0.030
5
3dB Bandwidth(kHz)
280±50
20dB Bandwidth(kHz) max
590
Insertion Loss (dB) (at minimum loss point)
3.0±2.0
Ripple (dB) max (within 3dB Bandwidth)
1.0
Spurious Response (dB) min(9MHz-12MHz)
30
Input/Output Impedance(Ω)
330
TEST
5.1
Test Conditions
Parts shall be tested under a condition (Temperature:+20℃±15℃,Humidity:65%
±20%R.H.)unless the standard condition(Temperature:+25℃±3℃,Humidity:65%±5%
R.H.) is regulated to test.
5.2 Test Circuit
R1=280Ω(1±5%,) R2=330Ω(1±5%,) Rg=50Ω
C2=10pF(Including stray capacitance
and capacitance of RF Voltmeter)
S.S.G:Output Voltmeter
①:Input ②:Ground ③:Float ④:Output
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6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
Performance
Requirment
NO.
Item
6.1
Low Temp
Storage
Stored in -40℃±3℃ for 96h,and left at room
Meet Table 1
temp. for 1h before measurement.
6.2
High Temp
Storage
Stored in 85℃±2℃ for 96h,and left at room
Meet Table 1
temp. for 1h before measurement.
6.3
Humidity
Stored at 40℃±2℃,in 90%~95%R.H. for 96h,
Meet Table 1
and left at room temp. for 1h before measurement
6.4
Thermal
Shock
6.5
Soldering
Test
Condition of Test
After temp. cycling of -40℃(30 minutes) to +85℃
(30min) was performed 5 times, filter shall be
Meet Table 1
measured after being placed in natural condition for
1h.
Passed through the reflow oven under the following
condition for 2 times, and left at room temp. for
24h before measurement.
Temp. at the surface of the substrate
Time
Meet Table 1
Preheat 150℃±5℃
60s±10s
≥200℃
20s-40 s
Soldering
240℃±5℃
10s±1s
The terminals
6.6
Solderability
Dipped in 235℃±5℃ solder bath for 3s±0.5s shall be at least
95% covered
with rosin flux.
by solder
6.7
Drop test
6.8
Vibration
Free drop to the wood plate from the height of 70
Meet Table 1
cm for 3 times.
Apply the vibration of sweep frequency 10 to
55Hz/minutes, amplitude 1.5mm, duration 2h in Meet Table 1
each direction of 3 planes.
Mount on a glass-epoxy board( width=50 mm,
thickness=1.6mm),then
bend
it
to 1mm
displacement(velocity 1mm/s) and keep it for 5s.
Press
20
Board
Bending
Press Head
R10
Support bar
5
45± 2
D.U.T
1.0± 0.2
6.9
Mechanical
damage such
as break shall
not occur
45± 2
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Table 1
Item
Specification after test
Insertion Loss Drift (dB) max
±2
3dB Bandwidth Drift (kHz) max
±25
20dB Bandwidth Drift (kHz) max
±60
Note:The limits in the above table are referenced to the initial measurements.
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RECOMMENDED
LAND
PATTERN
AND
REFLOW
SOLDERING
STANDARD CONDITIONS
7.1 Recommended land pattern
(4)
(2)
(3)
(1)
℃
7.2 Recommended reflow soldering standard conditions
within 10s
℃
Pre-heating
within
80s-120s.
within
20s-40s
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8 PACKAGE
To protect the products in storage and transportation,it is necessary to pack them
(outer and inner package).On paper pack, the following requirements are requested.
8.1 Dimensions and Mark
At the end of package, the warning (moisture proof, upward put) should be stick
to it.
Dimensions and Mark (see below)
1
2
3
4
5
6
7
Package
Certificate ofapproval
Label
Tying
Adhesive tape
Belt Box
Inner
U N IT:m m
8.2 Section of package
Package is made of corrugated paper with thickness of 0.8cm.Package has 10 inner
boxes, each box has 1reel (each reel for plastic bag).
8.3 Quantity of package
Per plastic reel
4000 pieces of piezoelectric ceramic part
Per inner box
1 reel
Per package
10 inner boxes
(40000 pieces of
piezoelectric ceramic part )
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8.4 Reel
φ
max
8.5 Packing Method Sketch Map
Blank Pocket
10 Pitches
Loaded Pocket Blank Pocket
10 Pitches
Leader
200mm Max
8.6 Test Condition Of Peeling Strength
T op T ape
S tre n g t
P e e lin g
h 20-70g
10° Max
C a rrie r T a p e
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9 EIAJ Monthly Code
2003 / 2005 / 2007 / 2009
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CODE
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2004 / 2006 / 2008 / 2010
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10 OTHER
10.1 Caution of use
10.1.1
Do not use this product with bend. Please don’t apply excess mechanical
stress to the
component and terminals at soldering.
10.1.2
The component may be damaged when an excess stress will be applied.
10.1.3
This specification mentions the quality of the component as a single unit.
Please insure the component is thoroughly evaluated in your application circuit.
10.2
Notice
10.2.1
Please return one of this specification after your signature of acceptance.
10.2.2
When something gets doubtful with this specifications, we shall jointly work
to get an agreement.
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