1.6 x 0.8 x 0.45mm SMD OSXX0603C1D Ver.A.1 ■Features ■Outline ● Single chip ● Super high brightness of surface mount LED ● Sorting for Iv and Vf @ 20mA of If ● Compact package outline Recommended Solder Pad Top (LxWxT) of 1.6mm x 0.8mm x 0.45mm ● Dimension Side Compatible to IR reflow soldering. Anode ■Applications Bottom Notes: 1. All dimensions are in millimeters ; 2. Tolerance is ∮0.10 mm unless otherwise noted. ● Backlighting (switches, keys, etc.) ● Marker lights (e.g. steps, exit ways, etc.) ■Absolute Cathode Maximum Rating Value Symbo Item ■Directivity (Ta=25℃) 0 Unit l WT/BL/TG/ YG YL/OR/HR DC Forward Current IF 20 30 mA Pulse Forward Current* IFP 100 100 mA Reverse Voltage VR 5 5 V Power Dissipation PD 72 78 mW Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40~ +85 ℃ Lead Soldering Temperature Tsol 260℃/5sec 0 - *Pulse width Max 0.1ms, Duty ratio max 1/10 ■Electrical -Optical Characteristics (Ta=25℃) VF (V) Part Number Min. Color Typ. IR(µA) Max. IF=20mA Max. Iv(mcd) Min. Typ. λD(nm) Max. VR=5V Min. Typ. 2θ1/2(deg) Max. Typ. IF=20mA OSW50603C1D White W5 ■ 2.9 3.2 3.6 100 110 220 300 OSB50603C1D Blue B5 ■ 2.9 3.2 3.6 100 30 80 120 465 470 475 120 OSG50603C1D True Green G5 ■ 2.9 3.2 3.6 100 150 250 360 520 525 530 120 X=0.27, Y=0.28 Note: * Vf tolerance: ±0.05V * Dominant wavelength tolerance: ±1nm * Luminous intensity is NIST reading. Luminous intensity tolerance:±10% LED & Application Technologies http://www.optosupply.com VER A.0 120 1.6 x 0.8 x 0.45mm SMD OSXX0603C1D Ver.A.1 ■ Optical and electrical characteristics TYPICAL ELECTRICAL/OPTICAL CHARACTERISTIC CURVES F V F I 50 40 WT 30 TG 20 O R /H R 10 0.5 ) V ( f V e g a t l o V d r a w r o F 0 1.5 1.0 2.0 2.5 4.0 3.5 3.0 Relative Luminous Intensity (Normalized @5mA) BL YG YL 60 Forward Current If (mA) Relative luminous intensity - If 7 6 YG YL BL 5 4 WT 3 2 O R /H R 1 TG 0 0 10 20 30 40 50 60 Forward current IF(mA) WT If_Ta Forward Current If (mA) 50 40 30 20 10 0 -30 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) s c i t s i r e t c a r a h C h t g n e l e v a W Ta=25°C OR H R BL TG YG YL 100 80 60 40 20 0 y t i s n e t n I s u o n i m u L e v i t a l e R ) m n ( h t g n e l e v a W 400 450 500 550 600 650 700 LED & Application Technologies http://www.optosupply.com VER A.0 1.6 x 0.8 x 0.45mm SMD OSXX0603C1D Ver.A.1 ■ Recommended Soldering Temperature – Time Profile (Reflow Soldering) Surface Mounting Condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices. Soldering Reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -We cannot guarantee the LEDs after they have been assembled using the solder dipping method. LED & Application Technologies http://www.optosupply.com VER A.0 1.6 x 0.8 x 0.45mm SMD OSXX0603C1D Ver.A.1 3) Manual Soldering conditions. - Lead Solder Max. 300 for Max. 3sec, and only one time. ℃ - Lead-free Solder Max. 350 for Max. 3sec, and only one time. ℃ - There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient atmosphere during reflow. It is recommended to use the nitrogen reflow method. - After LEDs have been soldered, repair should not be done. As repair is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not. - Reflow soldering should not be done more than two times. LED & Application Technologies http://www.optosupply.com VER A.0 1.6 x 0.8 x 0.45mm SMD OSXX0603C1D Ver.A.1 ■ Material White/ Blue/ Yellow green/ Yellow/ Orange/ Red： LED & Application Technologies http://www.optosupply.com VER A.0 1.6 x 0.8 x 0.45mm SMD OSXX0603C1D Ver.A.1 ■ Taping and Orientation. Quantity: 4,000 units/reel Diameter: 178 mm General Tolerance : ± 0.1 ■ Cautions: 1. After open the package, the LED should be kept at 30°C, 30%RH or less. The LED should be soldered within 24 hours (1 day) after opening the package. 2. Heat generation must be taken into design consideration when using the LED. 3. Power must be applied resistors for protection, over current would be caused the optic damage to the devices and wavelength shift. 4. Manual tip solder may cause the damage to Chip devices, so advised that heat of iron should be lower than 15W with temperature control under 5 seconds at 230-260 deg. C. ( The device would be got damage in re working process, recommended under 5 seconds at 230-260 deg. C) 5. All equipment and machinery must be properly grounded. It is recommended to use a wristband or anti-electrostatic glove when handing the LED. 6. Use IPA as a solvent for cleaning the LED. The other solvent may dissolve the LED package and the epoxy, Ultrasonic cleaning should not be done. 7. Damaged LED will show unusual characteristics such as leak current remarkably increase, turn-on voltage becomes lower and the LED get unlight at low current. LED & Application Technologies http://www.optosupply.com VER A.0 1.6 x 0.8 x 0.45mm SMD OSXX0603C1D Ver.A.1 ■ Reliability Test : Conclusions: The reliability tests were designed to evaluate both package integrity as well as workability of product performance over time. All samples have done well by completed test requirement and passed all the qualification criteria with zero failure. From design standpoint, the package is robust enough to meet its datasheet conditions. Based on the good result shows on the above test, this product is qualified and released for market. LED & Application Technologies http://www.optosupply.com VER A.0