3.2 x 2.7 x 1.1mm Red & Yellow Green Chip LED OSRG1206C1C Ver.A.3 ■Features ■Outline ● Bi-Color ● Super high brightness of surface mount LED ● Water Clear Flat Mold ● Compact package outline 1 2 3 4 Dimension 1 2 3 4 (LxWxT) of 3.2mm x 2.7mm x 1.1mm ● Compatible to IR reflow soldering. Notes: 1. All dimensions are in millimeters ; 2. Tolerance is ± 0.10 mm unless otherwise noted. ■Applications ● Backlighting (switches, keys, etc.) ● Marker lights (e.g. steps, exit ways, etc.) ■Absolute Maximum Rating Item ■Directivity (Ta=25℃) Value Symbol Red YG DC Forward Current IF 30 30 mA Pulse Forward Current* IFP 100 100 mA Reverse Voltage VR 5 5 V Power Dissipation PD 78 78 mW Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40~ +85 Lead Soldering Temperature Tsol 0 Unit 0 ℃ ℃ ℃/5sec 260 - *Pulse width Max 0.1ms, Duty ratio max 1/10 ■Electrical -Optical Characteristics (Ta=25℃ (Ta=25℃) VF (V) Part Number Min. Color Typ. IR(µA) Max. IF=5mA OSRG1206C1C Max. λD(nm) Iv(mcd) Min. Typ. Max. VR=5V Min. 2θ1/2(deg) Typ. Max. Typ. IF=5mA HR ■ 1.8 2.1 2.6 10 - 100 - 620 625 630 120 Yellow green YG ■ 1.8 2.2 2.6 10 - 40 - 565 570 575 120 Red Note: * Vf tolerance: ±0.05V * Dominant wavelength tolerance: ±1nm * Luminous intensity is NIST reading. Luminous intensity tolerance:±10% LED & Application Technologies http://www.optosupply.com VER A.0 3.2 x 2.7 x 1.1mm Red & Yellow Green Chip LED OSRG1206C1C Ver.A.3 ■ Recommended Soldering Temperature – Time Profile (Reflow Soldering) Surface Mounting Condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices. Soldering Reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -We cannot guarantee the LEDs after they have been assembled using the solder dipping method. LED & Application Technologies http://www.optosupply.com VER A.0 3.2 x 2.7 x 1.1mm Red & Yellow Green Chip LED OSRG1206C1C Ver.A.3 3) Manual Soldering conditions. - Lead Solder Max. 300 for Max. 3sec, and only one time. - Lead-free Solder Max. 350 for Max. 3sec, and only one time. ℃ ℃ - There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient atmosphere during reflow. It is recommended to use the nitrogen reflow method. - After LEDs have been soldered, repair should not be done. As repair is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not. - Reflow soldering should not be done more than two times. LED & Application Technologies http://www.optosupply.com VER A.0 3.2 x 2.7 x 1.1mm Red & Yellow Green Chip LED OSRG1206C1C Ver.A.3 ■ Material True green： White/ Blue/ Yellow green/ Yellow/ Orange/ Red： LED & Application Technologies http://www.optosupply.com VER A.0 3.2 x 2.7 x 1.1mm Red & Yellow Green Chip LED OSRG1206C1C Ver.A.3 ■ Reliability Test : Conclusions: The reliability tests were designed to evaluate both package integrity as well as workability of product performance over time. All samples have done well by completed test requirement and passed all the qualification criteria with zero failure. From design standpoint, the package is robust enough to meet its datasheet conditions. Based on the good result shows on the above test, this product is qualified and released for market. LED & Application Technologies http://www.optosupply.com VER A.0