RFM SF2131B

SF2131B
• Low Insertion Loss
• 5.0 X 7.0 mm Surface-Mount Case
• Complies with Directive 2002/95/EC (RoHS)
92.16 MHz
SAW Filter
Pb
Absolute Maximum Ratings
Rating
Value
Units
Maximum Incident Power in Passband
+10
dBm
Maximum DC Voltage Between any Two Terminals
30
VDC
-40 to +85
°C
Storage Temperature Range in Tape and Reel
Maximum Soldering Profile
265 °C for 10 s
SMP-03
Electrical Characteristics
Characteristic
Sym
Nominal Center Frequency
1.5 dB Passband Bandwidth
Minimum Insertion Loss
Attenuation Relative to ILMIN
fC
ILMIN
0 to 40.72 MHz
40.72 to 66 MHz
61.44 to 122.88 MHz
109 to 143.6 MHz
143.6 to 153.6 MHz
218 to 1000 MHz
82.16 to 102.16 MHz
82.16 to 102.16 MHz
82.16 to 102.16 MHz
Amplitude Ripple
Group Delay Ripple
1 dB Compression Point
Input IP3
Operating Temperature Range
Terminating Source/Load Impedance
Case Style
Lid Symbolization (YY=year, WW=week, S=shift) See note 4
Notes
1
Min
1, 4
1, 4
1, 5
1
1
Max
Units
10.0
MHz
MHz
dB
20
1, 2
1, 3
Typ
92.16
42
45
52
40
56
58
12
35
-40
9
50
49.5
56
45
60
63
0.9
65
15
40
dB
1.2
100
+85
50
SMP-03 7 x 5 mm Nominal Footprint
RFM SF2131B YYWWS
dBP-P
nsP-P
dBm
dBm
°C
ohm
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
3.
4.
5.
6.
Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance
matching to 50 Ω and measured with 50 Ω network analyzer.
Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc.
Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external
impedance matching design. See Application Note No. 42 for details.
The design, manufacturing process, and specifications of this filter are subject to change.
US and international patents may apply.
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
www.RFM.com E-mail: [email protected]
©2009 by RF Monolithics, Inc.
Page 1 of 4
SF2131B - 7/9/09
SF2131B I/O Impedance (matched) and Amplitude Plots
5 Mar 2009 12:59:52
CH1
S11
1 U FS
0 . 2402
1 : 37 . 031
92 . 160 000
MHz
SF2131B SMALL PCB
414 . 87
CH3
S22
1 : 25 . 000
92 . 160
000
pH
1 U FS
-2 . 9297
MHz
1
m
589 . 46
nF
1
Cor
Cor
Full
CENTR
CH2
92 . 160
S21
MHz
LOG
SPAN
100 . 000
10 dB/
MHz
CENTR
REF -9.011 dB
92 . 160
1 : 0. 0000
MHz
dB
SPAN
100 . 000
0 . 000
000
MHz
MHz
1
CH2
Max
BW:
Cor
Full
2
3
4
cent
:
Markers
REF=1
22 . 142515
MHz
92 . 136991
MHz
Q: 4. 1611
1_ loss
CENTER
92 . 160
000
MHz
SPAN
100 . 000
000
: -9 . 0137
dB
MHz
SF2131B Matching Network
L1
IN
9
8
7
10
6
330nh
sf2131b demo
small PCB
L2
1
5
2
3
OUTPUT
4
240nh
c1
PCB
IND
IND
CAP
400-1608-001
501-0782-331
501-0782-241
501-1275-150
www.RFM.com E-mail: [email protected]
©2009 by RF Monolithics, Inc.
small PCB, 5X7
0805, 330 nH
0805, 240 nH
0805, 15 pF
15pf
PCB
L1
L2
C1
Page 2 of 4
SF2131B - 7/9/09
Tape and Reel Specifications
"B" REF.
100 REF.
“B “
Quantity Per Reel
Inches
millimeters
7
178
500
13
330
2000
See Detail "A"
13.
0
12.0
20
.2
2.0
COMPONENT ORIENTATION and DIMENSIONS
Carrier Tape Dimensions
Ao
9.4 mm
Bo
7.4 mm
Ko
2.0 mm
Pitch
8.0 mm
W
16.0 mm
PIN #1
USER DIRECTION OF FEED
www.RFM.com E-mail: [email protected]
©2009 by RF Monolithics, Inc.
Page 3 of 4
SF2131B - 7/9/09
SMP-03 Case
10-Terminal Ceramic Surface-Mount Case
7 x 5 mm Nominal Footprint
Case Dimensions
Dimension
A
B
C
D
E
H
J
K
P
Recommended PCB Footprint
mm
Inches
Min
Nom
Max
Min
Nom
Max
6.80
4.80
7.00
5.00
1.65
0.60
2.54
1.0
5.00
3.00
1.27
7.20
5.20
2.00
.73
2.67
1.13
5.13
3.13
1.40
0.268
0.189
0.276
0.197
0.065
0.024
0.100
0.039
0.197
0.118
0.050
0.283
0.205
0.079
0.029
0.105
0.044
0.202
0.123
0.055
.47
2.41
0.87
4.87
2.87
1.14
0.019
0.095
0.034
0.192
0.113
0.045
Electrical Connections
Connection
Port 1
Port 2
Terminals
Input or Return
10
Return or Input
1
Output or Return
5
Return or Output
6
Ground
All others
Single-ended Operation
Return is ground
Differential Operation
Return is hot
Materials
Solder Pad
Plating
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating
2.0 to 3.0 µm Nickel
Body
Al2O3 Ceramic
Pb Free
C
B
E
H
H
A
J
D
P
K
www.RFM.com E-mail: [email protected]
©2009 by RF Monolithics, Inc.
Page 4 of 4
SF2131B - 7/9/09