SF2024D • • • • • Designed for SDARS Receiver IF Application Low Insertion Loss 3.8 X 3.8 X 1.2 mm Surface-Mount Case Differential Input and Output Complies with Directive 2002/95/EC (RoHS) 467.751 MHz SAW Filter Pb Absolute Maximum Ratings Rating Maximum Incident Power in Passband Max. DC voltage between any 2 terminals Storage Temperature Range Value Units +10 dBm 30 VDC -40 to +85 Suitable for lead-free soldering - Max Soldering Profile Electrical Characteristics Characteristic Center Frequency Insertion Loss Amplitude Ripple (p-p) Sym fC IL fc-6.250 to fc-4.3925 MHz fc-4.3925 to fc-2.535 MHz fc-2.5350 to fc-0.025 MHz fc+0.025 to fc+2.535 MHz fc+2.5350 to fc+4.3925 MHz fc+4.3925 to fc+6.250 MHz Pass bandwidth of -2.0dB centered at fc Pass bandwidth of -3 dB Low Side Attenuation between 455.751 to 457.251 MHz (fc-10.5 MHz) Low Side Attenuation F<455.751 MHz High Side Attenuation between 476.751 to 479.751 MHz (fc+9.0 MHz) High Side Attenuation F<479.751 MHz Temperature Coefficient of frequency Delay Ripple (p-p) fc-6.250 to fc-4.3925 MHz fc-4.3925 to fc-2.535 MHz fc-2.5350 to fc-0.025 MHz fc+0.025 to fc+2.535 MHz fc+2.5350 to fc+4.3925 MHz fc+4.3925 to fc+6.250 MHz Source Impedance Load Impedance Case Style Lid Symbolization (YY=year, WW=week, S=shift) See note 4 °C 260°C for 30 s Notes 1 SM3838-8 Min Typ Max Units 467.704 467.751 12 467.798 13 2.0 2.0 2.0 2.0 2.0 2.0 MHz dB 1, 2 13.0 MHz 32 32 20 32 1, 2, 3 ZS ZL 6 dB dB -18 100 100 120 120 100 100 ppm/K ns 150 Ω 150 Ω SM3838-8 3.8 x 3.8 mm Nominal Footprint 580 YWWS CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. 2. 3. Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance matching to 50 Ω and measured with 50 Ω network analyzer. Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc. Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external impedance matching design. See Application Note No. 42 for details. www.RFM.com E-mail: [email protected] ©2008 by RF Monolithics, Inc. 4. 5. 6. 7. 8. The design, manufacturing process, and specifications of this filter are subject to change. Tape and Reel Standard Per ANSI / EIA 481. US and international patents may apply. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. ©Copyright 1999, RF Monolithics Inc. Page 1 of 5 SF2024D - 3/31/08 www.RFM.com E-mail: [email protected] ©2008 by RF Monolithics, Inc. Page 2 of 5 SF2024D - 3/31/08 www.RFM.com E-mail: [email protected] ©2008 by RF Monolithics, Inc. Page 3 of 5 SF2024D - 3/31/08 SM3838-8 Case 8-Terminal Ceramic Surface-Mount Case 3.8 X 3.8 mm Nominal Footprint Case Dimensions Dimension 0.066 (1.68) mm Nom 3.8 3.8 1.20 1.10 1.00 0.60 2.54 1.75 Max 4.0 4.0 1.35 1.25 1.10 0.70 2.69 2.05 Inches Nom 0.150 0.150 0.047 0.043 0.040 0.024 0.100 0.069 Min 0.142 0.142 0.041 0.037 0.035 0.020 0.090 0.055 Max 0.157 0.157 0.053 0.049 0.043 0.028 0.110 0.080 Electrical Connections Connection Differential Input Differential Output Ground Single Ended Operation Differential Operation Dot Indicates Pin 1 Terminals 1, 2 5, 6 All Others Return is Ground Return is Hot Port 1 Port 2 0.090 (2.29) 0.002 (0.05) 0.050 TYP. (1.27) 0.029 TYP. (O.74) A B C D E F G H Min 3.6 3.6 1.05 0.95 0.90 0.50 2.39 1.40 0.033 (0.84) Materials Solder Pad Ter- Au plating 30 - 60 uInches (76.2-152 uM) over 80-200 mination uInches (203-508 uM) Ni. 0.055 TYP. (1.40) Lid Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phosphorus) 100-200 uInches Thick Body Al2O3 Ceramic PCB Footprint Pb Free TOP VIEW BOTTOM VIEW A E C B 8 8 1 7 H 7 1 2 6 6 2 3 5 5 3 4 4 D www.RFM.com E-mail: [email protected] ©2008 by RF Monolithics, Inc. G F Page 4 of 5 SF2024D - 3/31/08 Tape and Reel Specifications "B" REF. 100 REF. “B “ Nominal Size Quantity Per Reel Inches millimeters 7 178 500 13 330 3000 See Detail "A" 13. 0 12.0 20 .2 2.0 COMPONENT ORIENTATION and DIMENSIONS Carrier Tape Dimensions 2.0 4.25 mm Bo 4.25 mm Ko 1.30 mm Pitch 8.0 mm W 12.0 mm 4.0 PIN #1 A 1.50 1.75 0.3 ± 0.05 Ao Bo B Ao 12.0 5.5 RO.3 (MAX.) B Pitch A Ko R0.5 (MAX.) 1.5 SECTION A-A SECTION B-B www.RFM.com E-mail: [email protected] ©2008 by RF Monolithics, Inc. USER DIRECTION OF FEED Page 5 of 5 SF2024D - 3/31/08