SF2140A-1 • Excellent Size-to-Performance Ratio • Hermetic 13.3 X 6.5 mm Surface-Mount Case • Complies with Directive 2002/95/EC (RoHS) Absolute Maximum Ratings Rating 140.0 MHz SAW Filter Pb Value Units +10 dBm Input Power Level Storage Temperature Range -40 to +85 °C Operating Temperature Range -30 to +80 °C Suitable for Lead-free Soldering - Maximum Soldering Profile 260 °C for 30 s SMP-53 Electrical Characteristics Characteristic Sym Notes Nominal Center Frequency fC 1 Maximum Insertion Loss at fC IL Min Typ Max 140.0 10.3 1 dB Bandwidth 18.4 20.8 3 dB Bandwidth 19.6 21.4 Units MHz 11.0 dB MHz MHz 35 dB Bandwidth 25.2 26.4 MHz Passband Ripple, 130.8 to 149.2 MHz 0.8 1.0 dB Group Delay Ripple, 130.8 to 149.2 MHz 115 160 Absolute Group Delay 1.0 Input VSWR, 130.8 to 149.2 MHz 1.7 2.8 Output VSWR, 130.8 to 149.2 MHz 1.8 2.3 ns µs Temperature Coefficient dB dB ppm/°C Attenuation Referenced to Insertion Loss at fC 10 to 90 MHz 35 49 90 to 120 MHz 40 47 120 to 126.8 MHz 35 50 153.2 to 160 MHz 35 45 160 to 190 MHz 40 53 190 to 800 MHz 35 62 Source/Load Impedance Case Style Lid Symbolization (YY=year, WW=week) See note 4 50 dB ohms SMP-53 13.3 X 6.5 mm Nominal Footprint RFM SF2140A-1 YYWWS## CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. 2. 3. 4. 5. 6. 7. 8. Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance matching to 50 Ω and measured with 50 Ω network analyzer. Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc. Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external impedance matching design. See Application Note No. 42 for details. "LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering prototypes." The design, manufacturing process, and specifications of this filter are subject to change. Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port 2, so that the filter must always be installed in one direction per the circuit design. US and international patents may apply. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. www.RFM.com E-mail: [email protected] ©2009 by RF Monolithics, Inc. Page 1 of 6 SF2140A-1 7/27/09 SF2140A-1 S21 Amplitude Response SF2140A-1 Pass-band Amplitude and Group Delay Ripple www.RFM.com E-mail: [email protected] ©2009 by RF Monolithics, Inc. Page 2 of 6 SF2140A-1 7/27/09 SF2140A-1 S11 Impedance Plot through Matching Network SF2140A-1 S22 Impedance Plot through Matching Network www.RFM.com E-mail: [email protected] ©2009 by RF Monolithics, Inc. Page 3 of 6 SF2140A-1 7/27/09 SF2140A-1 50 ohm Matching Network 1 0 0 n H 5 0 o h m s 1 1 3 9 p F 1 0 9 8 7 6 S F 2 1 4 0 A -1 1 8 n H 5 0 o h m s 5 1 2 1 2 3 4 8 2 p F SF2140A-1 Circuit Board Pad Layout www.RFM.com E-mail: [email protected] ©2009 by RF Monolithics, Inc. Page 4 of 6 SF2140A-1 7/27/09 SMP-53 Case 12-Terminal Ceramic Surface-Mount Case 13.3 x 6.5 mm Nominal Footprint Case Dimensions Dimension A B C D E H P Min 13.08 6.27 mm Nom 13.31 6.50 1.91 1.50 0.79 1.0 2.54 Max 13.60 6.80 2.00 Min 0.515 0.247 Inches Nom 0.524 0.256 0.075 0.059 0.031 0.039 0.100 Max 0.535 0.268 0.079 Electrical Connections Connection Port 1 Port 2 Terminals RF Input 11 RF Input Ground 12 RF Output 5 RF Output Ground 6 Ground All others Materials Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free C B 12 1 D H 11 10 11 12 1 10 P (8 Places) 2 9 9 2 3 8 8 3 4 7 7 4 A 5 6 TOP VIEW www.RFM.com E-mail: [email protected] ©2009 by RF Monolithics, Inc. 6 E (10 Places) 5 BOTTOM VIEW Page 5 of 6 SF2140A-1 7/27/09 Tape and Reel Specifications Quantity Per Reel 1000 Max 254 "B" REF. 100 REF. 100 Min See Detail "A" 13. 0 12.0 24.4 20 .2 2.0 21.0 COMPONENT ORIENTATION and DIMENSIONS Carrier Tape Dimensions Ao 7.0 mm Bo 13.8 mm Ko 2.0 mm Pitch 12.0 mm W 24.0 mm PIN #1 USER DIRECTION OF FEED www.RFM.com E-mail: [email protected] ©2009 by RF Monolithics, Inc. Page 6 of 6 SF2140A-1 7/27/09