RFM SF2204E

SF2204E
• Low-loss SAW Filter
• Surface-mount 3.0 x 3.0 x 1.4 mm Package
• Complies with Directive 2002/95/EC (RoHS)
Pb
1900 MHz
SAW Filter
Absolute Maximum Ratings
Rating
Value
Units
10
dBm
Input Power Level
DC Voltage on any Non-ground Terminal
3
V
Operating Temperature Range
-20 to +70
°C
Storage Temperature Range in Tape and Reel
-40 to +85
°C
260
°C
Solder Reflow Temperature, 10 seconds, 5 cycles maximum
SM3030-6
Electrical Characteristics
Characteristic
Sym
Notes
Min
Typ
Max
Units
Center Frequency
FC
1900
Insertion Loss, 1880 to 1920 MHz
IL
2.7
3.5
dB
Amplitude Ripple, 1880 to 1920 MHz
1.0
1.5
dBP-P
Group Delay Ripple, 1880 to 1920 MHz
10
40
nsP-P
Input VSWR, 1880 to 1920 MHz
1.5:1
2.0:1
Output VSWR, 1880 to 1920 MHz
1.5:1
2.0:1
MHz
Attenuation Referenced to 0 dB
0.3 to 1000 MHz
30
35
1000 to 1700 MHz
30
35
1700 to 1830 MHz
32
38
1970 to 2400 MHz
38
45
2400 to 3000 MHz
30
40
3000 to 4000 MHz
25
34
Source Impedance
ZS
50
Load Impedance
ZL
50
Case Style
Ω
SM3030-6 3.0 x 3.0 mm Nominal Footprint
Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator
Standard Reel Quantity
dB
936, YWWS
Reel Size 7 Inch
500 Pieces/Reel
Reel Size 13 Inch
3000 Pieces/Reel
Electrical Connections
Connection
Input
Terminals
5
Output
2
Ground
All Others
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance
matching to 50 Ω and measured with 50 Ω network analyzer.
Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc.
Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external
impedance matching design. See Application Note No. 42 for details.
"LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering prototypes."
The design, manufacturing process, and specifications of this filter are subject to change.
Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port
2, so that the filter must always be installed in one direction per the circuit design.
US and international patents may apply.
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
Page 1 of 7
SF2204E - 8/10/10
Filter Passband Response, 1800 to 2000 MHz
Filter Test Circuit
5 0 o h m
5
SF2204E
2
5 0 o h m
1 , 3 , 4 , 6
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©2010 by RF Monolithics, Inc.
Page 2 of 7
SF2204E - 8/10/10
Filter Broadband Response, 300 kHz to 4000 MHz
Filter Group Delay Plot, 1800 to 2000 MHz
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
Page 3 of 7
SF2204E - 8/10/10
Input and Output VSWR Plots
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©2010 by RF Monolithics, Inc.
Page 4 of 7
SF2204E - 8/10/10
SM3030-6 Case
6-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
K
L
N
K
N
mm
Nom
3.00
3.00
1.25
0.90
2.80
1.60
0.85
1.50
0.60
1.30
3.20
1.70
1.05
0.81
0.38
Min
2.87
2.87
1.12
0.77
2.67
1.47
0.72
1.37
0.47
1.17
Max
3.13
3.13
1.38
1.03
2.93
1.73
0.98
1.63
0.73
1.43
Inches
Nom
0.118
0.118
0.049
0.035
0.110
0.063
0.033
0.059
0.024
0.051
0.126
0.067
0.041
0.032
0.015
Min
0.113
0.113
0.044
0.030
0.105
0.058
0.028
0.054
0.019
0.046
Max
0.123
0.123
0.054
0.040
0.115
0.068
0.038
0.064
0.029
0.056
Case Materials
O
Materials
N
M
M
PCB Footprint Top View
Solder Pad
Plating
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating
2.0 to 3.0 µm Nickel
Body
Al2O3 Ceramic
Pb Free
TOP VIEW
BOTTOM VIEW
B
1
3
6
936
YWWS
A 2
5
E
4
D
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©2010 by RF Monolithics, Inc.
G
C
F
H
6
1
5
2
4
3
I
J
Page 5 of 7
SF2204E - 8/10/10
Tape and Reel Specifications
Quantity Per Reel
millimeters
7
178
500
13
330
3000
"B" REF.
100 REF.
“B”
Inches
See Detail "A"
13.
0
12.0
20
.2
2.0
COMPONENT ORIENTATION and DIMENSIONS
Carrier Tape Dimensions
2.0
3.35 mm
Bo
3.35 mm
Ko
1.40 mm
Pitch
8.0 mm
W
12.0 mm
4.0
PIN #1
A
1.50
1.75
0.3 ± 0.05
Ao
Bo
B
Ao
12.0
5.5
RO.3
(MAX.)
B
Pitch
A
Ko
R0.5
(MAX.)
1.5
SECTION A-A
SECTION B-B
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©2010 by RF Monolithics, Inc.
USER DIRECTION OF FEED
Page 6 of 7
SF2204E - 8/10/10
Typical Solder Reflow Profile
R a m p u p
3 0 0
P re h e a t
R e flo w
C o o l D o w n
T e m p e ra tu re (d e g C )
2 5 0
2 0 0
1 5 0
1 0 0
5 0
0
0
6 0
1 2 0
1 8 0
2 4 0
3 0 0
3 6 0
T im e (s e c o n d s )
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©2010 by RF Monolithics, Inc.
Page 7 of 7
SF2204E - 8/10/10