SF2204E • Low-loss SAW Filter • Surface-mount 3.0 x 3.0 x 1.4 mm Package • Complies with Directive 2002/95/EC (RoHS) Pb 1900 MHz SAW Filter Absolute Maximum Ratings Rating Value Units 10 dBm Input Power Level DC Voltage on any Non-ground Terminal 3 V Operating Temperature Range -20 to +70 °C Storage Temperature Range in Tape and Reel -40 to +85 °C 260 °C Solder Reflow Temperature, 10 seconds, 5 cycles maximum SM3030-6 Electrical Characteristics Characteristic Sym Notes Min Typ Max Units Center Frequency FC 1900 Insertion Loss, 1880 to 1920 MHz IL 2.7 3.5 dB Amplitude Ripple, 1880 to 1920 MHz 1.0 1.5 dBP-P Group Delay Ripple, 1880 to 1920 MHz 10 40 nsP-P Input VSWR, 1880 to 1920 MHz 1.5:1 2.0:1 Output VSWR, 1880 to 1920 MHz 1.5:1 2.0:1 MHz Attenuation Referenced to 0 dB 0.3 to 1000 MHz 30 35 1000 to 1700 MHz 30 35 1700 to 1830 MHz 32 38 1970 to 2400 MHz 38 45 2400 to 3000 MHz 30 40 3000 to 4000 MHz 25 34 Source Impedance ZS 50 Load Impedance ZL 50 Case Style Ω SM3030-6 3.0 x 3.0 mm Nominal Footprint Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator Standard Reel Quantity dB 936, YWWS Reel Size 7 Inch 500 Pieces/Reel Reel Size 13 Inch 3000 Pieces/Reel Electrical Connections Connection Input Terminals 5 Output 2 Ground All Others CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. 2. 3. 4. 5. 6. 7. 8. Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance matching to 50 Ω and measured with 50 Ω network analyzer. Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc. Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external impedance matching design. See Application Note No. 42 for details. "LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering prototypes." The design, manufacturing process, and specifications of this filter are subject to change. Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port 2, so that the filter must always be installed in one direction per the circuit design. US and international patents may apply. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc www.RFM.com E-mail: [email protected] ©2010 by RF Monolithics, Inc. Page 1 of 7 SF2204E - 8/10/10 Filter Passband Response, 1800 to 2000 MHz Filter Test Circuit 5 0 o h m 5 SF2204E 2 5 0 o h m 1 , 3 , 4 , 6 www.RFM.com E-mail: [email protected] ©2010 by RF Monolithics, Inc. Page 2 of 7 SF2204E - 8/10/10 Filter Broadband Response, 300 kHz to 4000 MHz Filter Group Delay Plot, 1800 to 2000 MHz www.RFM.com E-mail: [email protected] ©2010 by RF Monolithics, Inc. Page 3 of 7 SF2204E - 8/10/10 Input and Output VSWR Plots www.RFM.com E-mail: [email protected] ©2010 by RF Monolithics, Inc. Page 4 of 7 SF2204E - 8/10/10 SM3030-6 Case 6-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint Case and PCB Footprint Dimensions Dimension A B C D E F G H I J K L M N O K L N K N mm Nom 3.00 3.00 1.25 0.90 2.80 1.60 0.85 1.50 0.60 1.30 3.20 1.70 1.05 0.81 0.38 Min 2.87 2.87 1.12 0.77 2.67 1.47 0.72 1.37 0.47 1.17 Max 3.13 3.13 1.38 1.03 2.93 1.73 0.98 1.63 0.73 1.43 Inches Nom 0.118 0.118 0.049 0.035 0.110 0.063 0.033 0.059 0.024 0.051 0.126 0.067 0.041 0.032 0.015 Min 0.113 0.113 0.044 0.030 0.105 0.058 0.028 0.054 0.019 0.046 Max 0.123 0.123 0.054 0.040 0.115 0.068 0.038 0.064 0.029 0.056 Case Materials O Materials N M M PCB Footprint Top View Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free TOP VIEW BOTTOM VIEW B 1 3 6 936 YWWS A 2 5 E 4 D www.RFM.com E-mail: [email protected] ©2010 by RF Monolithics, Inc. G C F H 6 1 5 2 4 3 I J Page 5 of 7 SF2204E - 8/10/10 Tape and Reel Specifications Quantity Per Reel millimeters 7 178 500 13 330 3000 "B" REF. 100 REF. “B” Inches See Detail "A" 13. 0 12.0 20 .2 2.0 COMPONENT ORIENTATION and DIMENSIONS Carrier Tape Dimensions 2.0 3.35 mm Bo 3.35 mm Ko 1.40 mm Pitch 8.0 mm W 12.0 mm 4.0 PIN #1 A 1.50 1.75 0.3 ± 0.05 Ao Bo B Ao 12.0 5.5 RO.3 (MAX.) B Pitch A Ko R0.5 (MAX.) 1.5 SECTION A-A SECTION B-B www.RFM.com E-mail: [email protected] ©2010 by RF Monolithics, Inc. USER DIRECTION OF FEED Page 6 of 7 SF2204E - 8/10/10 Typical Solder Reflow Profile R a m p u p 3 0 0 P re h e a t R e flo w C o o l D o w n T e m p e ra tu re (d e g C ) 2 5 0 2 0 0 1 5 0 1 0 0 5 0 0 0 6 0 1 2 0 1 8 0 2 4 0 3 0 0 3 6 0 T im e (s e c o n d s ) www.RFM.com E-mail: [email protected] ©2010 by RF Monolithics, Inc. Page 7 of 7 SF2204E - 8/10/10