RFM SF2236G

Preliminary
SF2236G
• Low-loss SAW Filter
• 2.5 x 2.0 x 1.0 mm Surface-Mount Case
• No Matching Circuit Required
1642.5 MHz
SAW Filter
Absolute Maximum Ratings
Rating
Value
Units
Maximum Input Power
+5
dBm
Maximum DC Voltage on any Non-ground Terminal
5
VDC
Storage Temperature Range in Tape and Reel
-40 to +85
Maximum Soldering Profile, 5 cycles maximum
°C
265 °C for 10 s
SM2520-4
Electrical Characteristics
Characteristic
Nominal Operating Frequency
Passband Insertion Loss, 1625 to 1660 MHz
Amplitude Ripple, 1625 to 1660 MHz
Attenuation Referenced to 0 dB:
DC to 1500 MHz
1525 to 1559 MHz
1700 to 2050 MHz
2050 to 3500 MHz
VSWR, 1625 to 1660 MHz
Source impedance
Load impedance
Operating Temperature Range
Sym
fC
IL
Notes
Min
Single-ended Input / Output Impedance Match
No matching network required for operation at 50 ohms
21
30
30
25
ZS
ZL
TA
Case Style
-20
Typ
1642.5
2.1
0.9
28
34
33
33
1.5:1
50
50
Max
3.5
2.0
Units
MHz
dB
dBP-P
dB
2.3:1
+75
Ω
Ω
°C
SM2520-4
Lid Symbolization (3K = Filter ID, Y = year, W = week)
3K, YW
Electrical Connections
Connection
Input
Terminals
1
Output
3
Ground
All others
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
US and international patents may apply.
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered
trademarks of RF Monolithics, Inc.
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
Page 1 of 5
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Filter Amplitude Plots
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
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SF2236G - 6/8/10
Filter Impedance Plots
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
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SM2520-4 Case
4-Terminal Ceramic Surface-Mount Case
2.5 X 2.0 mm Nominal Footprint
Case Dimensions
mm
Dimension
A
B
C
D
E
F
G
Inches
Min
Nom
Max
Min
Nom
Max
1.88
2.38
0.67
0.80
0.55
0.50
2.0
2.5
0.80
0.95
0.70
0.60
2.12
2.62
1.00
0.83
1.10
0.85
0.70
0.074
0.094
0.026
0.031
0.022
0.020
0.079
0.098
0.031
0.037
0.028
0.024
0.083
0.103
0.039
0.033
0.433
0.033
0.028
Electrical Connections
Connection
Terminals
Port 1
Single-ended Input
1
Port 2
Single-ended Output
PCB Footprint (mm)
3
Ground
All others
Case Materials
Materials
Solder Pad
Plating
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating
2.0 to 3.0 µm Nickel
Body
Al2O3 Ceramic
Pb Free
TOP VIEW
4
B
BOTTOM VIEW
3
C
E
3
4
F
A
1
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
G
2
2
G
1
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Reel Dimension
Tape Dimension
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
Page 5 of 5
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