Preliminary SF2251E • • • • Low-loss RF SAW Filter 3.0 x 3.0 x 1.4 mm Surface-mount Case No Matching Required for 50Ω Operation Complies with Directive 2002/95/EC (RoHS) 1600 MHz SAW Filter Pb Absolute Maximum Ratings Rating Incident Power in Passband DC Voltage on any Non-ground Terminal Value Units +10 dBm 3 VDC Operating Temperature Range -55 to +85 °C Storage Temperature Range in Tape and Reel -55 to +95 °C 265 °C Maximum Soldering Profile, 5 cycles/10 seconds maximum SM3030-6 Electrical Characteristics Characteristic Center Frequency Insertion Loss, 1580 to 1620 MHz 1500 MHz Attenuation Referenced to 0 dB 1700 MHz Attenuation Referenced to 0 dB Terminating Source Impedance Terminating Load Impedance Input/Output Impedance Match Sym Notes Min Typ 45 40 1600 3.15 64 47 50 50 fC IL ZS ZL Max 5.00 Units MHz dB dB dB Ω Ω No matching network required for 50 ohm source/load Case Style Lid Symbolization SM3030-6 992 CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. 2. US and international patents may apply. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. www.RFM.com E-mail: [email protected] © 2010-2011 by RF Monolithics, Inc. Page 1 of 5 SF2251E - 9/29/11 Matching Circuit 5 0 o h m 2 5 . % SF2251E 5 5 0 o h m 1 , 3 , 4 , 6 Frequency Response Plots www.RFM.com E-mail: [email protected] © 2010-2011 by RF Monolithics, Inc. Page 2 of 5 SF2251E - 9/29/11 Input/Output Impedance Plots www.RFM.com E-mail: [email protected] © 2010-2011 by RF Monolithics, Inc. Page 3 of 5 SF2251E - 9/29/11 6-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint Case and PCB Footprint Dimensions Dimension A B C D E F G H I J K L M N O K L N K N mm Nom 3.00 3.00 1.25 0.90 2.80 1.60 0.85 1.50 0.60 1.30 3.20 1.70 1.05 0.81 0.38 Min 2.87 2.87 1.12 0.77 2.67 1.47 0.72 1.37 0.47 1.17 Max 3.13 3.13 1.38 1.03 2.93 1.73 0.98 1.63 0.73 1.43 Inches Nom 0.118 0.118 0.049 0.035 0.110 0.063 0.033 0.059 0.024 0.051 0.126 0.067 0.041 0.032 0.015 Min 0.113 0.113 0.044 0.030 0.105 0.058 0.028 0.054 0.019 0.046 Max 0.123 0.123 0.054 0.040 0.115 0.068 0.038 0.064 0.029 0.056 Case Materials O Materials N M M PCB Footprint Top View Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free TOP VIEW BOTTOM VIEW B 1 3 6 992 YWWS A 2 5 E 4 D www.RFM.com E-mail: [email protected] © 2010-2011 by RF Monolithics, Inc. G C F H 6 1 5 2 4 3 I J Page 4 of 5 SF2251E - 9/29/11 Tape and Reel Specifications "B" REF. 100 REF. “B” Quantity Per Reel Inches millimeters 7 178 500 13 330 3000 See Detail "A" 13. 0 12.0 20 .2 2.0 COMPONENT ORIENTATION and DIMENSIONS Carrier Tape Dimensions 2.0 3.35 mm Bo 3.35 mm Ko 1.40 mm Pitch 8.0 mm W 12.0 mm 4.0 PIN #1 A 1.50 1.75 0.3 ± 0.05 Ao Bo B Ao 12.0 5.5 RO.3 (MAX.) B Pitch A Ko R0.5 (MAX.) 1.5 SECTION A-A SECTION B-B www.RFM.com E-mail: [email protected] © 2010-2011 by RF Monolithics, Inc. USER DIRECTION OF FEED Page 5 of 5 SF2251E - 9/29/11