RFM SF2251E

Preliminary
SF2251E
•
•
•
•
Low-loss RF SAW Filter
3.0 x 3.0 x 1.4 mm Surface-mount Case
No Matching Required for 50Ω Operation
Complies with Directive 2002/95/EC (RoHS)
1600 MHz
SAW Filter
Pb
Absolute Maximum Ratings
Rating
Incident Power in Passband
DC Voltage on any Non-ground Terminal
Value
Units
+10
dBm
3
VDC
Operating Temperature Range
-55 to +85
°C
Storage Temperature Range in Tape and Reel
-55 to +95
°C
265
°C
Maximum Soldering Profile, 5 cycles/10 seconds maximum
SM3030-6
Electrical Characteristics
Characteristic
Center Frequency
Insertion Loss, 1580 to 1620 MHz
1500 MHz Attenuation Referenced to 0 dB
1700 MHz Attenuation Referenced to 0 dB
Terminating Source Impedance
Terminating Load Impedance
Input/Output Impedance Match
Sym
Notes
Min
Typ
45
40
1600
3.15
64
47
50
50
fC
IL
ZS
ZL
Max
5.00
Units
MHz
dB
dB
dB
Ω
Ω
No matching network required for 50 ohm source/load
Case Style
Lid Symbolization
SM3030-6
992
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
US and international patents may apply.
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered
trademarks of RF Monolithics, Inc.
www.RFM.com E-mail: [email protected]
© 2010-2011 by RF Monolithics, Inc.
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SF2251E - 9/29/11
Matching Circuit
5 0 o h m
2
5 . % SF2251E
5
5 0 o h m
1 , 3 , 4 , 6
Frequency Response Plots
www.RFM.com E-mail: [email protected]
© 2010-2011 by RF Monolithics, Inc.
Page 2 of 5
SF2251E - 9/29/11
Input/Output Impedance Plots
www.RFM.com E-mail: [email protected]
© 2010-2011 by RF Monolithics, Inc.
Page 3 of 5
SF2251E - 9/29/11
6-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
K
L
N
K
N
mm
Nom
3.00
3.00
1.25
0.90
2.80
1.60
0.85
1.50
0.60
1.30
3.20
1.70
1.05
0.81
0.38
Min
2.87
2.87
1.12
0.77
2.67
1.47
0.72
1.37
0.47
1.17
Max
3.13
3.13
1.38
1.03
2.93
1.73
0.98
1.63
0.73
1.43
Inches
Nom
0.118
0.118
0.049
0.035
0.110
0.063
0.033
0.059
0.024
0.051
0.126
0.067
0.041
0.032
0.015
Min
0.113
0.113
0.044
0.030
0.105
0.058
0.028
0.054
0.019
0.046
Max
0.123
0.123
0.054
0.040
0.115
0.068
0.038
0.064
0.029
0.056
Case Materials
O
Materials
N
M
M
PCB Footprint Top View
Solder Pad
Plating
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating
2.0 to 3.0 µm Nickel
Body
Al2O3 Ceramic
Pb Free
TOP VIEW
BOTTOM VIEW
B
1
3
6
992
YWWS
A 2
5
E
4
D
www.RFM.com E-mail: [email protected]
© 2010-2011 by RF Monolithics, Inc.
G
C
F
H
6
1
5
2
4
3
I
J
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SF2251E - 9/29/11
Tape and Reel Specifications
"B" REF.
100 REF.
“B”
Quantity Per Reel
Inches
millimeters
7
178
500
13
330
3000
See Detail "A"
13.
0
12.0
20
.2
2.0
COMPONENT ORIENTATION and DIMENSIONS
Carrier Tape Dimensions
2.0
3.35 mm
Bo
3.35 mm
Ko
1.40 mm
Pitch
8.0 mm
W
12.0 mm
4.0
PIN #1
A
1.50
1.75
0.3 ± 0.05
Ao
Bo
B
Ao
12.0
5.5
RO.3
(MAX.)
B
Pitch
A
Ko
R0.5
(MAX.)
1.5
SECTION A-A
SECTION B-B
www.RFM.com E-mail: [email protected]
© 2010-2011 by RF Monolithics, Inc.
USER DIRECTION OF FEED
Page 5 of 5
SF2251E - 9/29/11