Preliminary SF2017E • 200 ohm Balanced Input and Output Ports • Complies with Directive 2002/95/EC (RoHS) 1220 MHz SAW Filter Pb Maximum Rating Value Units Input Power Level Rating 0 dBm DC Voltage on any Non-ground Terminal 3 V Operating Temperature Range -40 to +85 °C Storage Temperature Range in Tape and Reel -40 to +85 °C Suitable for Lead-free Soldering - Maximum Soldering Profile 260°C for 30 s SM3030-8 Electrical Characteristics Characteristic Sym Center Frequency fC Notes Min 1220 Insertion Loss, 1216 to 1224 MHz IL 3.4 5.3 dB 0.6 1.8 dBP-P Amplitude Ripple, 1216 to 1224 MHz Typ Max Units MHz Attenuation, Referenced to 0 dB 500 to 1129 MHz 50 57 1129 to 1135 MHz 50 57 1144 to 1152 MHz 46 57 1132 MHz 50 57 1148 MHz 48 57 1176 MHz 50 56 1184 MHz 46 55 1290 to 2000 MHz 50 55 dB Group Delay Ripple, 1216 to 1224 MHz 12 nsP-P Balanced Source Impedance 200 ohms Balanced Load Impedance 200 ohms Case Style SM3030-8 3.0 x 3.0 mm Nominal Footprint Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator Standard Reel Quantity Port 1 Port 2 898, YWWS Reel Size 7 Inch 500 Pieces/Reel Reel Size 13 Inch 3000 Pieces/Reel Connection Balanced Input Balanced Output Ground Terminals 1,2 5,6 All Others Dot Indicates Pin 1 CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. 2. US and international patents may apply. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 1 of 5 SF2017E - 4/21/10 Frequency Response Plots www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 2 of 5 SF2017E - 4/21/10 Matching Network Topology S F 2 0 1 7 E T e s t C ir c u it 2 0 0 o h m B a la n c e d In p u t 1 7 S F 2 0 1 7 E 2 3 www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. 8 4 5 6 2 0 0 o h m B a la n c e d O u tp u t Page 3 of 5 SF2017E - 4/21/10 8-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint Case and PCB Footprint Dimensions Dimension J J I J K N I A B C D E F G H I J K L M N O L M N mm Nom 3.0 3.0 1.27 0.92 0.75 0.60 0.60 1.20 3.19 0.81 0.96 0.81 1.39 0.23 0.38 Min 2.87 2.87 1.14 0.79 0.62 0.47 0.47 1.07 Max 3.13 3.13 1.40 1.05 0.88 0.73 0.73 1.33 Min 0.113 0.113 0.045 0.031 0.024 0.018 0.018 0.042 Inches Nom 0.118 0.118 0.050 0.036 0.029 0.024 0.024 0.047 0.126 0.032 0.038 0.032 0.055 0.009 0.015 Max 0.123 0.123 0.055 0.041 0.034 0.029 0.029 0.052 Case Materials Materials K O O Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free PCB Footprint Top View TOP VIEW BOTTOM VIEW 1 2 8 7 898 YWWS A E C B 8 3 7 1 6 2 H 6 G 5 5 4 4 D www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. 3 F Page 4 of 5 SF2017E - 4/21/10 “B” Nominal Size Inches millimeters "B" REF. 100 REF. Tape and Reel Specifications Quantity Per Reel 7 178 500 13 330 3000 See Detail "A" 13. 0 12.0 20 .2 2.0 COMPONENT ORIENTATION and DIMENSIONS Carrier Tape Dimensions Ao Bo Ko Pitch W 2.0 4.0 PIN #1 A 1.50 1.75 0.3 ± 0.05 3.35 mm 3.35 mm 1.4 mm 8.0 mm 12.0 mm Bo B Ao 12.0 5.5 RO.3 (MAX.) B Pitch A Ko R0.5 (MAX.) 1.5 SECTION A-A SECTION B-B www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. USER DIRECTION OF FEED Page 5 of 5 SF2017E - 4/21/10