RFM XTL1029

Preliminary
XTL1029
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•
•
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High Performance Crystal for Wireless Communications Devices
Excellent Frequency Stability and Reliability
Ultra-Miniature Surface Mount Seam Weld Package
Complies with Directive 2002/95/EC (RoHS)
13.52915 MHz
Crystal Unit
2 >
The XTL1029 is a very high stability 13.52915 MHz crystal
suitable for a wide range of communications applications. The XTL1029’s
excellent frequency stability supports operation from -40 to +85 °C.
SM3225-4 Case
Electrical Characteristics
Characteristic
Sym
Notes
Minimum
FO
Nominal Frequency
Typical
Maximum
13.52915
Mode of Oscillation
Units
MHz
Fundamental
Storage Temperature Range in Tape and Reel
-40
+85
°C
Operating Temperature Range
-40
+85
°C
Frequency Stability over Operating Temperature Range
±100 ppm (referred to the value at 25 °C)
FL
Frequency Make Tolerance
Equivalent Series Resistance
Shunt Capacitance
±30 ppm @ 25 °C ±3 °C
ESR
70
Ω
CO
7
pF
100
µW
Nominal Drive Level
CL
Load Capacitance
16
Aging
pF
±1.0 ppm/year @ 25 °C
Insulation Resistance
500
MΩ
Standard Shipping Quantity on 178 mm (7”) Reel
3000
Lid Symbolization (in addition to Lot and/or Date Codes)
units
1029 YWWS
C r y s ta l E q u iv a le n t C ir c u it
1
C
E S R
3
O
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
3.
US and international patents may apply.
The design, manufacturing process, and specifications of this device are subject to change without notice.
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
www.RFM.com E-mail: [email protected]
©2009-2010 by RF Monolithics, Inc.
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XTL1029 2/4/10
4-Terminal Surface-Mount Seam Weld Case
3.2 x 2.5 mm Nominal Footprint
PCB Footprint (mm)
Package Dimensions
1028
YWWS
1028
YWWS
1028
YWWS
Package Orientation in Carrier Tape
www.RFM.com E-mail: [email protected]
©2009-2010 by RF Monolithics, Inc.
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XTL1029 2/4/10
Reel Dimensions
Tape Dimensions
www.RFM.com E-mail: [email protected]
©2009-2010 by RF Monolithics, Inc.
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XTL1029 2/4/10
Packing Details
3K pcs maximum per reel
Typical Solder Reflow Profile
www.RFM.com E-mail: [email protected]
©2009-2010 by RF Monolithics, Inc.
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XTL1029 2/4/10
Reliability Specifications
Test name
Test process / method
Reference
standard
Mechanical characteristics
resistance to
Soldering heat
(IR reflow)
Temp./ Duration : 260°C /10sec ×2 times
Total time : 4min.(IR-reflow)
Vibration
Total peak amplitude : 1.5mm
Vibration frequency : 10 to 55 Hz
Sweep period
: 1.0 minute
Vibration directions : 3 mutually perpendicular
Duration
: 2 hr / direc.
directions : 3 impacts per axis
Acceleration : 3000g's, +20/-0 %
Duration
: 0.3 ms (total 18 shocks)
Waveform : Half-sine
Solder Temperature:265±5°C
Duration time: 5±0.5 seconds.
Mechanical
Shock
Solderability
EIAJED-4701
-300(301)M(II)
MIL-STD 202F
method 201A
MIL-STD 202F
method 213C
MIL-STD 883G
method 2003
Environmental characteristics
Thermal Shock
Humidity test
Dry heat
( Aging test )
PCT test
www.RFM.com E-mail: [email protected]
©2009-2010 by RF Monolithics, Inc.
Heat cycle conditions
-55
(30min)
* cycle time : 10 times
125
(30min)
MIL-STD 883G
method 1010.7
Temperature : 70 ± 2 °C
Relative humidity : 90~95%
Duration
: 96 hours
Temperature : 125 ± 2 °C
Duration
: 168 hours
MIL-STD 202F
method 103B
Pressure: 2.06kg/cm 2 (2.03*10 5 pa)
Temperature : 121 ± 2 °C
Relative humidity : 100%
Duration
: 24 hours
EIAJED-4701-3
B-123A
MIL-STD 883G
method 1008.2
condition C
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