Preliminary XTL1029 • • • • High Performance Crystal for Wireless Communications Devices Excellent Frequency Stability and Reliability Ultra-Miniature Surface Mount Seam Weld Package Complies with Directive 2002/95/EC (RoHS) 13.52915 MHz Crystal Unit 2 > The XTL1029 is a very high stability 13.52915 MHz crystal suitable for a wide range of communications applications. The XTL1029’s excellent frequency stability supports operation from -40 to +85 °C. SM3225-4 Case Electrical Characteristics Characteristic Sym Notes Minimum FO Nominal Frequency Typical Maximum 13.52915 Mode of Oscillation Units MHz Fundamental Storage Temperature Range in Tape and Reel -40 +85 °C Operating Temperature Range -40 +85 °C Frequency Stability over Operating Temperature Range ±100 ppm (referred to the value at 25 °C) FL Frequency Make Tolerance Equivalent Series Resistance Shunt Capacitance ±30 ppm @ 25 °C ±3 °C ESR 70 Ω CO 7 pF 100 µW Nominal Drive Level CL Load Capacitance 16 Aging pF ±1.0 ppm/year @ 25 °C Insulation Resistance 500 MΩ Standard Shipping Quantity on 178 mm (7”) Reel 3000 Lid Symbolization (in addition to Lot and/or Date Codes) units 1029 YWWS C r y s ta l E q u iv a le n t C ir c u it 1 C E S R 3 O CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. 2. 3. US and international patents may apply. The design, manufacturing process, and specifications of this device are subject to change without notice. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 1 of 5 XTL1029 2/4/10 4-Terminal Surface-Mount Seam Weld Case 3.2 x 2.5 mm Nominal Footprint PCB Footprint (mm) Package Dimensions 1028 YWWS 1028 YWWS 1028 YWWS Package Orientation in Carrier Tape www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 2 of 5 XTL1029 2/4/10 Reel Dimensions Tape Dimensions www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 3 of 5 XTL1029 2/4/10 Packing Details 3K pcs maximum per reel Typical Solder Reflow Profile www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 4 of 5 XTL1029 2/4/10 Reliability Specifications Test name Test process / method Reference standard Mechanical characteristics resistance to Soldering heat (IR reflow) Temp./ Duration : 260°C /10sec ×2 times Total time : 4min.(IR-reflow) Vibration Total peak amplitude : 1.5mm Vibration frequency : 10 to 55 Hz Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. directions : 3 impacts per axis Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine Solder Temperature:265±5°C Duration time: 5±0.5 seconds. Mechanical Shock Solderability EIAJED-4701 -300(301)M(II) MIL-STD 202F method 201A MIL-STD 202F method 213C MIL-STD 883G method 2003 Environmental characteristics Thermal Shock Humidity test Dry heat ( Aging test ) PCT test www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Heat cycle conditions -55 (30min) * cycle time : 10 times 125 (30min) MIL-STD 883G method 1010.7 Temperature : 70 ± 2 °C Relative humidity : 90~95% Duration : 96 hours Temperature : 125 ± 2 °C Duration : 168 hours MIL-STD 202F method 103B Pressure: 2.06kg/cm 2 (2.03*10 5 pa) Temperature : 121 ± 2 °C Relative humidity : 100% Duration : 24 hours EIAJED-4701-3 B-123A MIL-STD 883G method 1008.2 condition C Page 5 of 5 XTL1029 2/4/10