XTL1003-1 • Surface Mount Seam-Weld Package • Good Frequency Stability over Temperature • Excellent Reliability • Complies with Directive 2002/95/EC (RoHS) 13.56000 MHz Crystal Unit P b The XTL1003-1 is a surface mount 5.0 x 3.2 mm crystal unit for use in wireless telecommunications devices, especially where an ultra-miniature package is needed for mobility. SM5032-4 Case Electrical Characteristics Characteristic Sym Notes Minimum Typical Nominal Frequency 13.56000 Mode of Oscillation Fundamental Maximum Units MHz Storage Temperature Range, Crystal Only -50 +125 °C Storage Temperature Range, in Tape and Reel -40 +85 °C Operating Temperature Range -20 +70 °C Frequency Stability over Operating Temperature Range ±20 ppm (referred to the value at 25 °C) FL Frequency Make Tolerance ±10 ppm @ 25 °C ±3 °C ESR 40 Ω Shunt Capacitance CO 2.0 pF Motional Capacitance CM Equivalent Series Resistance Nominal Drive Level CL Load Capacitance Insulation Resistance at 100 VDC 4.2 ±20% fF 10 µW 13.5 pF 500 MΩ Aging ±1.0 ppm/year @ 25 °C Weight 0.037 ±0.005 g 3000 units Stanard Shipping Quantity on 330 mm (13”) Reel Lid Symbolization (in addition to Lot and/or Date Codes) 1003-1 YWWS C r y s ta l E q u iv a le n t C ir c u it 1 C E S R 3 O CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. 2. 3. US and international patents may apply. The design, manufacturing process, and specifications of this device are subject to change without notice. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 1 of 6 XTL1003-1 - 2/3/10 SM5032-4 Case 4-Terminal Surface-Mount Seam Weld Case 5.0 x 3.2 mm Nominal Footprint T o p V ie w 3 .2 ± 0 .1 5 .0 ± 0 .1 D o t in d ic a te s P in 3 lo c a tio n S id e V ie w Electrical Connections Pin Connection 1 2 3 4 COSC GND (lid) FSKOUT GND (lid) 0 .8 ± 0 .1 B o tto m 1 .2 ± 0 .1 V ie w 2 .4 ± 0 .2 0 .8 ± 0 .1 1 2 4 3 1.2 ±0.1 1 .4 ± 0 .2 1.2 ±0.1 1.7 ±0.1 P in s 2 a n d 4 a r e c o n n e c te d to th e lid D im e n s io n s a r e in m m 2.2 ±0.1 Dot indicates Pin 4 Footprint (mm) Pin 3 Package Orientation in Carrier Tape www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 2 of 6 XTL1003-1 - 2/3/10 Reel Dimensions Tape Dimensions Notes: 1. Unless otherwise specified, tolerance on dimensions is ±0.1 mm 2. Material is black conductive polystyrene 3. 10 pitch cumulative tolerance is ±0.2 mm www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 3 of 6 XTL1003-1 - 2/3/10 Typical Reflow Profile R a m p u p 3 0 0 P re h e a t R e flo w C o o l D o w n T e m p e ra tu re (d e g C ) 2 5 0 2 0 0 1 5 0 1 0 0 5 0 0 0 6 0 1 2 0 1 8 0 2 4 0 3 0 0 3 6 0 T im e (s e c o n d s ) Notes: 1. Maximum peak temperature: 265 degrees C for 8 to 12 seconds 2. Typical reflow temperature: 217 ±5 degrees C for 90 to 100 seconds www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 4 of 6 XTL1003-1 - 2/3/10 Packing - 3,000 units per reel maximum www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 5 of 6 XTL1003-1 - 2/3/10 Reliability Specifications Test name Test process / method Reference standard Mechanical characteristics resistance to Soldering heat (IR reflow) Temp./ Duration : 260 °C /10 seconds ×2 times Total time : 4 minutes (IR-reflow) Vibration Total peak amplitude: 1.5 mm Vibration frequency: 10 to 55 Hz Sweep period: 1.0 minute Vibration directions: 3 mutually perpendicular Duration: 2 hours per direction Directions: 3 impacts per axis Acceleration: 3000g's, +20/-0 % Duration: 0.3 ms (total 18 shocks) Waveform : Half-sine Solder Temperature: 265 ±5°C Duration time: 5 ±0.5 seconds. Mechanical Shock Solderability EIAJED-4701 -300(301)M(II) MIL-STD 202F method 201A MIL-STD 202F method 213C MIL-STD 883G method 2003 Environmental characteristics Thermal Shock Heat cycle conditions -55 °C, 30 minutes <> 125 °C, 30 minutes * cycle time : 10 times MIL-STD 883G method 1010.7 Humidity test Temperature: Relative humidity: Duration: Temperature: Duration: MIL-STD 202F method 103B Dry heat ( Aging test ) PCT test www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. 70 ± 2 °C 90~95% 96 hours 125 ± 2 °C 168 hours Pressure: 2.06 kg/cm 2 (2.03*105 pa) Temperature : 121 ± 2 °C Relative humidity : 100% Duration: 24 hours MIL-STD 883G method 1008.2 condition C EIAJED-4701-3 B-123A Page 6 of 6 XTL1003-1 - 2/3/10