® RT7270 3A, 18V, 340kHz Synchronous Step-Down Converter General Description Features The RT7270 is a high efficiency, monolithic synchronous step-down DC/DC converter that can deliver up to 3A output current from a 4.5V to 18V input supply. The RT7270's current mode architecture and external compensation allow the transient response to be optimized over a wide input voltage range and loads. Cycle-by-cycle current limit provides protection against shorted outputs, and soft-start eliminates input current surge during start-up. The RT7270 also provides under voltage protection and thermal shutdown protection. The low current (<3μA) shutdown mode provides output disconnection, enabling easy power management in battery-powered systems. The RT7270 is available in an SOP-8 (Exposed Pad) package. z z z z z z z z z z z z z z z Ordering Information RT7270 Package Type SP : SOP-8 (Exposed Pad-Option 2) Lead Plating System Z : ECO (Ecological Element with Halogen Free and Pb free) H : UVP Hiccup N : UVP Disabled ±1.5% High Accuracy Reference Voltage 4.5V to 18V Input Voltage Range 3A Output Current Integrated N-MOSFET Switches Current Mode Control Fixed Frequency Operation : 340kHz Output Adjustable from 0.925V to 15V Up to 95% Efficiency Programmable Soft-Start Stable with Low ESR Ceramic Output Capacitors Cycle-by-Cycle Over Current Protection Input Under Voltage Lockout Output Under Voltage Protection Thermal Shutdown Protection RoHS Compliant and Halogen Free Applications z z z z z z Wireless AP/Router Set-Top-Box Industrial and Commercial Low Power Systems LCD Monitors and TVs Green Electronics/Appliances Point of Load Regulation of High-Performance DSPs Pin Configurations Note : Richtek products are : ` ments of IPC/JEDEC J-STD-020. ` (TOP VIEW) RoHS compliant and compatible with the current requireSuitable for use in SnPb or Pb-free soldering processes. Marking Information RT7270xZSP : Product Number RT7270x ZSPYMDNN VIN 2 SW GND 3 GND EN 6 COMP 5 FB 9 4 SS 7 SOP-8 (Exposed Pad) x : H or N YMDNN : Date Code Copyright © 2012 Richtek Technology Corporation. All rights reserved. DS7270-01 8 BOOT September 2012 is a registered trademark of Richtek Technology Corporation. www.richtek.com 1 RT7270 Typical Application Circuit 2 VIN 4.5V to 18V CIN 10µF x 2 REN 100k CSS 0.1µF VIN BOOT 1 RT7270 SW 3 R1 26.1k 7 EN 8 SS 4, 9 (Exposed Pad) GND CBOOT L 0.1µF 10µH FB 5 COMP 6 CC RC 3.9nF 6.8k VOUT 3.3V COUT 22µF x 2 R2 10k CP Open Table 1. Recommended Component Selection VOUT (V) R1 (kΩ) R2 (kΩ) RC (kΩ) CC (nF) L (μH) COUT (μF) 15 153 10 30 3.9 33 22 x 2 10 97.6 10 20 3.9 22 22 x 2 8 76.8 10 15 3.9 22 22 x 2 5 45.3 10 13 3.9 15 22 x 2 3.3 26.1 10 6.8 3.9 10 22 x 2 2.5 16.9 10 6.2 3.9 6.8 22 x 2 1.8 9.53 10 4.3 3.9 4.7 22 x 2 1.2 3 10 3 3.9 3.6 22 x 2 Functional Pin Description Pin No. Pin Name Pin Function 1 BOOT Bootstrap for High Side Gate Driver. Connect a 0.1μF or greater ceramic capacitor from BOOT to SW pins. 2 VIN Input Supply Voltage, 4.5V to 18V. Must bypass with a suitable large ceramic capacitor. 3 SW Switch Node. Connect this pin to an external L-C filter. GND Ground. The exposed pad must be soldered to a large PCB and connected to GND for maximum power dissipation. 5 FB Feedback Input. It is used to regulate the output of the converter to a set value via an external resistive voltage divider. 6 COMP Compensation Node. COMP is used to compensate the regulation control loop. Connect a series RC network from COMP to GND. In some cases, an additional capacitor from COMP to GND is required. 7 EN 8 SS 4, 9 (Exposed Pad) Enable Input Pin. A logic high enables the converter; a logic low forces the IC into shutdown mode reducing the supply current to less than 3μA. Soft-Start Control Input. SS controls the soft-start period. Connect a capacitor from SS to GND to set the soft-start period. A 0.1μF capacitor sets the soft-start period to 15.5ms. Copyright © 2012 Richtek Technology Corporation. All rights reserved. www.richtek.com 2 is a registered trademark of Richtek Technology Corporation. DS7270-01 September 2012 RT7270 Function Block Diagram VIN Internal Regulator Oscillator Slope Comp Shutdown VA VCC Comparator 1.2V Foldback Control + - 5kΩ EN - RSENSE VA 0.4V + UV Comparator Lockout Comparator 2.5V Current Sense Amplifier + + BOOT S + R Current Comparator Q 110mΩ Q 90mΩ SW GND VCC 6µA 0.925V SS FB + +EA - COMP Copyright © 2012 Richtek Technology Corporation. All rights reserved. DS7270-01 September 2012 is a registered trademark of Richtek Technology Corporation. www.richtek.com 3 RT7270 Absolute Maximum Ratings z z z z z z z z z z (Note 1) Supply Input Voltage, VIN -----------------------------------------------------------------------------------------Switch Voltage, SW -----------------------------------------------------------------------------------------------VBOOT − VSW ---------------------------------------------------------------------------------------------------------Other Pins Voltage ------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C −0.3V to 20V −0.3V to (VIN + 0.3V) −0.3V to 6V −0.3V to 20V SOP-8 (Exposed Pad) --------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2) SOP-8 (Exposed Pad), θJA ---------------------------------------------------------------------------------------SOP-8 (Exposed Pad), θJC --------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------Junction Temperature ----------------------------------------------------------------------------------------------Storage Temperature Range -------------------------------------------------------------------------------------ESD Susceptibility (Note 3) HBM (Human Body Mode) ---------------------------------------------------------------------------------------MM (Machine Mode) ------------------------------------------------------------------------------------------------ 1.333W Recommended Operating Conditions z z z 75°C/W 15°C/W 260°C 150°C −65°C to 150°C 2kV 200V (Note 4) Supply Input Voltage, VIN ------------------------------------------------------------------------------------------ 4.5V to 18V Junction Temperature Range -------------------------------------------------------------------------------------- −40°C to 125°C Ambient Temperature Range -------------------------------------------------------------------------------------- −40°C to 85°C Electrical Characteristics (VIN = 12V, TA = 25°C, unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit Shutdown Supply Current VEN = 0V -- 0.5 3 μA Supply Current VEN = 3V, VFB = 0.9V -- 0.8 1.2 mA 0.911 0.925 0.939 V -- 940 -- μA/V Reference Voltage VREF 4.5V ≤ VIN ≤ 18V Error Amplifier Transconductance GEA ΔIC = ±10μA High Side Switch On-Resistance RDS(ON)1 -- 110 -- mΩ Low Side Switch On-Resistance RDS(ON)2 -- 90 -- mΩ High Side Switch Leakage Current VEN = 0V, VSW = 0V -- 0 10 μA Upper Switch Current Limit Min. Duty Cycle, VBOOT − VSW = 4.8V -- 5.1 -- A COMP to Current Sense Transconductance GCS -- 5.1 -- A/V Oscillation Frequency fOSC1 300 340 380 kHz Short Circuit Oscillation Frequency fOSC2 -- 100 -- kHz VFB = 0V Copyright © 2012 Richtek Technology Corporation. All rights reserved. www.richtek.com 4 is a registered trademark of Richtek Technology Corporation. DS7270-01 September 2012 RT7270 Parameter Symbol Test Conditions Typ Max Unit -- 93 -- % ns Maximum Duty Cycle DMAX Minimum On Time tON -- 100 -- Logic-High VIH 2.7 -- 18 Logic-Low VIL -- -- 0.4 3.8 4.2 4.5 V -- 320 -- mV EN Input Threshold Voltage VUVLO VFB = 0.7V Min VIN Rising V Input Under Voltage Lockout Threshold Input Under Voltage Lockout Hysteresis Soft-Start Current ISS VSS = 0V -- 6 -- μA Soft-Start Period tSS CSS = 0.1μF -- 15.5 -- ms Thermal Shutdown TSD -- 150 -- °C ΔVUVLO Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability. Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is measured at the exposed pad of the package. Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions. Copyright © 2012 Richtek Technology Corporation. All rights reserved. DS7270-01 September 2012 is a registered trademark of Richtek Technology Corporation. www.richtek.com 5 RT7270 Typical Operating Characteristics Efficiency vs. Load Current 3.34 90 3.33 80 VIN = 4.5V VIN = 12V VIN = 17V 70 60 Output Voltage(V) Efficiency (%) Output Voltage vs. Input Voltage 100 50 40 30 20 3.32 3.31 3.30 3.29 3.28 3.27 10 VOUT = 3.3V VIN = 4.5V to 17V 0 3.26 0 0.5 1 1.5 2 2.5 3 4 6 8 Load Current (A) 12 14 3.34 3.33 3.33 3.32 3.32 Output Voltage (V) 3.34 3.31 3.30 3.29 3.28 18 VIN = 4.5V VIN = 12V VIN = 17V 3.31 3.30 3.29 3.28 3.27 3.27 VIN = 12V, VOUT = 3.3V VOUT = 3.3V 3.26 3.26 -50 -25 0 25 50 75 100 125 0 0.5 1 Temperature (°C) 1.5 2 2.5 3 Output Current (A) Switching Frequency vs. Input Voltage Switching Frequency vs. Temperature 380 380 370 370 Switching Frequency (kHz)1 Switching Frequency (kHz)1 16 Output Voltage vs. Output Current Output Voltage vs. Temperature Output Voltage (V) 10 Input Voltage(V) 360 350 340 330 320 310 VIN = 17V VIN = 12V VIN = 4.5V 360 350 340 330 320 310 VIN = 4.5V to 17V, VOUT = 3.3V, IOUT = 0A 300 VOUT = 3.3V, IOUT = 0A 300 4.5 7 9.5 12 14.5 Input Voltage (V) Copyright © 2012 Richtek Technology Corporation. All rights reserved. www.richtek.com 6 17 -50 -25 0 25 50 75 100 125 Temperature (°C) is a registered trademark of Richtek Technology Corporation. DS7270-01 September 2012 RT7270 Input UVLO vs. Temperature Current Limit vs. Temperature 4.4 7.0 4.3 6.5 Input UVLO (V) Current Limit (A) 4.2 6.0 5.5 5.0 4.5 4.0 4.1 Rising 4.0 3.9 3.8 3.7 Falling 3.6 3.5 VIN = 12V, VOUT = 3.3V 3.5 3.4 3.0 -50 -25 0 25 50 75 100 125 -50 0 25 50 75 100 Temperature (°C) Temperature (°C) Load Transient Response Load Transient Response VOUT (100mV/Div) VOUT (100mV/Div) IOUT (2A/Div) IOUT (2A/Div) VIN = 12V, VOUT = 3.3V, IOUT = 0A to 3A Time (100μs/Div) Time (100μs/Div) Switching Switching VOUT (10mV/Div) VSW (10V/Div) VSW (10V/Div) IL (2A/Div) IL (2A/Div) VIN = 12V, VOUT = 3.3V, IOUT = 1.5A Time (2.5μs/Div) Copyright © 2012 Richtek Technology Corporation. All rights reserved. September 2012 125 VIN = 12V, VOUT = 3.3V, IOUT = 1.5A to 3A VOUT (10mV/Div) DS7270-01 -25 VIN = 12V, VOUT = 3.3V, IOUT = 3A Time (2.5μs/Div) is a registered trademark of Richtek Technology Corporation. www.richtek.com 7 RT7270 Power Off from VIN Power On from VIN VIN (5V/Div) VIN (5V/Div) VOUT (2V/Div) VOUT (2V/Div) IL (2A/Div) IL (2A/Div) VIN = 12V, VOUT = 3.3V, IOUT = 3A VIN = 12V, VOUT = 3.3V, IOUT = 3A Time (5ms/Div) Time (5ms/Div) Power On from EN Power Off from EN VEN (5V/Div) VEN (5V/Div) VOUT (2V/Div) VOUT (2V/Div) IL (2A/Div) IL (2A/Div) VIN = 12V, VOUT = 3.3V, IOUT = 3A VIN = 12V, VOUT = 3.3V, IOUT = 3A Time (5ms/Div) Time (5ms/Div) Copyright © 2012 Richtek Technology Corporation. All rights reserved. www.richtek.com 8 is a registered trademark of Richtek Technology Corporation. DS7270-01 September 2012 RT7270 Application Information Output Voltage Setting Soft-Start The resistive divider allows the FB pin to sense the output voltage as shown in Figure 1. The RT7270 provides soft-start function. The soft-start function is used to prevent large inrush current while converter is being powered-up. The soft-start timing can be programmed by the external capacitor between SS and GND. An internal current source ISS (6μA) charges an external capacitor to build a soft-start ramp voltage. The VFB voltage will track the internal ramp voltage during softstart interval. The typical soft-start time is calculated as follows : 0.925 × CSS Soft-Start time tSS = , if CSS capacitor ISS VOUT R1 FB RT7270 R2 GND Figure 1. Output Voltage Setting The output voltage is set by an external resistive voltage divider according to the following equation : VOUT = VREF ⎛⎜ 1+ R1 ⎞⎟ ⎝ R2 ⎠ is 0.1μF, then soft-start time = 0.925 × 0.1μ ≒ 15.5ms 6μ Chip Enable Operation Where VREF is the reference voltage (0.925V typ.). External Bootstrap Diode Connect a 0.1μF low ESR ceramic capacitor between the BOOT pin and SW pin. This capacitor provides the gate driver voltage for the high side MOSFET. It is recommended to add an external bootstrap diode between an external 5V and BOOT pin for efficiency improvement when input voltage is lower than 5.5V or duty ratio is higher than 65%. The bootstrap diode can be a low cost one such as IN4148 or BAT54. The external 5V can be a 5V fixed input from system or a 5V output of the RT7270. Note that the external boot voltage must be lower than 5.5V 5V BOOT RT7270 0.1µF The EN pin is the chip enable input. Pulling the EN pin low (<0.4V) will shutdown the device. During shutdown mode, the RT7270 quiescent current drops to lower than 3μA. Driving the EN pin high (>2.5V, <18V) will turn on the device again. For external timing control, the EN pin can also be externally pulled high by adding a REN resistor and CEN capacitor from the VIN pin (see Figure 3). EN VIN EN RT7270 CEN GND Figure 3. Enable Timing Control An external MOSFET can be added to implement digital control on the EN pin when no system voltage above 1.8V is available, as shown in Figure 4. In this case, a 100kΩ pull-up resistor, REN, is connected between VIN and the EN pin. MOSFET Q1 will be under logic control to pull down the EN pin. SW VIN Figure 2. External Bootstrap Diode REN EN REN 100k EN Q1 RT7270 GND Figure 4. Digital Enable Control Circuit Copyright © 2012 Richtek Technology Corporation. All rights reserved. DS7270-01 September 2012 is a registered trademark of Richtek Technology Corporation. www.richtek.com 9 RT7270 Over Temperature Protection CIN and COUT Selection The RT7270 features an Over Temperature Protection (OTP) circuitry to prevent from overheating due to excessive power dissipation. The OTP will shut down switching operation when junction temperature exceeds 150°C. Once the junction temperature cools down by approximately 20°C, the converter will resume operation. To maintain continuous operation, the maximum junction temperature should be lower than 125°C. The input capacitance, C IN, is needed to filter the trapezoidal current at the source of the high side MOSFET. To prevent large ripple current, a low ESR input capacitor sized for the maximum RMS current should be used. The approximate RMS current equation is given : Inductor Selection The inductor value and operating frequency determine the ripple current according to a specific input and output voltage. The ripple current ΔIL increases with higher VIN and decreases with higher inductance. V V ΔIL = ⎡⎢ OUT ⎤⎥ × ⎡⎢1− OUT ⎤⎥ VIN ⎦ ⎣ f ×L ⎦ ⎣ Having a lower ripple current reduces not only the ESR losses in the output capacitors but also the output voltage ripple. High frequency with small ripple current can achieve the highest efficiency operation. However, it requires a large inductor to achieve this goal. For the ripple current selection, the value of ΔIL = 0.24(IMAX) will be a reasonable starting point. The largest ripple current occurs at the highest VIN. To guarantee that the ripple current stays below the specified maximum, the inductor value should be chosen according to the following equation : ⎡ VOUT ⎤ ⎡ VOUT ⎤ L =⎢ × ⎢1 − ⎥ ⎥ ⎣ f × ΔIL(MAX) ⎦ ⎣ VIN(MAX) ⎦ The inductor's current rating (caused a 40°C temperature rising from 25°C ambient) should be greater than the maximum load current and its saturation current should be greater than the short circuit peak current limit. Please see Table 2 for the inductor selection reference. Table 2. Suggested Inductors for Typical Application Circuit Component Supplier Series Dimensions (mm) TDK VLF10045 10 x 9.7 x 4.5 TDK TAIYO YUDEN SLF12565 12.5 x 12.5 x 6.5 NR8040 8x8x4 Copyright © 2012 Richtek Technology Corporation. All rights reserved. www.richtek.com 10 V IRMS = IOUT(MAX) OUT VIN VIN −1 VOUT This formula has a maximum at VIN = 2VOUT, where IRMS = IOUT / 2. This simple worst case condition is commonly used for design because even significant deviations do not offer much relief. Choose a capacitor rated at a higher temperature than required. Several capacitors may also be paralleled to meet size or height requirements in the design. For the input capacitor, two 10μF low ESR ceramic capacitors are suggested. For the suggested capacitor, please refer to Table 3 for more details. The selection of COUT is determined by the required ESR to minimize voltage ripple. Moreover, the amount of bulk capacitance is also a key for COUT selection to ensure that the control loop is stable. Loop stability can be checked by viewing the load transient response as described in a later section. The output ripple, ΔVOUT , is determined by : 1 ⎤ ΔVOUT ≤ ΔIL ⎡⎢ESR + 8fC OUT ⎥⎦ ⎣ The output ripple will be the highest at the maximum input voltage since ΔIL increases with input voltage. Multiple capacitors placed in parallel may be needed to meet the ESR and RMS current handling requirement. Higher values, lower cost ceramic capacitors are now becoming available in smaller case sizes. Their high ripple current, high voltage rating and low ESR make them ideal for switching regulator applications. However, care must be taken when these capacitors are used at input and output. When a ceramic capacitor is used at the input and the power is supplied by a wall adapter through long wires, a load step at the output can induce ringing at the input, VIN. At best, this ringing can couple to the output and be mistaken as loop instability. At worst, a sudden inrush of current through is a registered trademark of Richtek Technology Corporation. DS7270-01 September 2012 RT7270 Thermal Considerations For continuous operation, do not exceed the maximum operation junction temperature 125°C. The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : PD(MAX) = (TJ(MAX) − TA ) / θJA Where T J(MAX) is the maximum operation junction temperature , TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification, the maximum junction temperature is 125°C. The junction to ambient thermal resistance θJA is layout dependent. For SOP-8 (Exposed Pad) package, the thermal resistance θJA is 75°C/W on the standard JEDEC 51-7 four-layers thermal test board. The maximum power dissipation at TA = 25°C can be calculated by following formula : P D(MAX) = (125°C − 25°C) / (75°C/W) = 1.333W (min.copper area PCB layout) P D(MAX) = (125°C − 25°C) / (49°C/W) = 2.04W (70mm2copper area PCB layout) As shown in Figure 5, the amount of copper area to which the SOP-8 (Exposed Pad) is mounted affects thermal performance. When mounted to the standard SOP-8 (Exposed Pad) pad (Figure 5.a), θJA is 75°C/W. Adding copper area of pad under the SOP-8 (Exposed Pad) (Figure 5.b) reduces the θJA to 64°C/W. Even further, increasing the copper area of pad to 70mm2 (Figure 5.e) reduces the θJA to 49°C/W. The maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance θJA. The Figure 6 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power dissipation allowed. 2.2 Four-Layer PCB 2.0 Power Dissipation (W) the long wires can potentially cause a voltage spike at VIN large enough to damage the part. 1.8 Copper Area 70mm2 50mm2 30mm2 10mm2 Min.Layout 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 25 50 75 100 125 Ambient Temperature (°C) Figure 6. Derating Curve of Maximum Power Dissipation The thermal resistance θJA of SOP-8 (Exposed Pad) is determined by the package architecture design and the PCB layout design. However, the package architecture design had been designed. If possible, it's useful to increase thermal performance by the PCB layout copper design. The thermal resistance θJA can be decreased by adding copper area under the exposed pad of SOP-8 (Exposed Pad) package. Copyright © 2012 Richtek Technology Corporation. All rights reserved. DS7270-01 September 2012 is a registered trademark of Richtek Technology Corporation. www.richtek.com 11 RT7270 Layout Consideration Follow the PCB layout guidelines for optimal performance of the RT7270. (a) Copper Area = (2.3 x 2.3) mm2, θJA = 75°C/W ` Keep the traces of the main current paths as short and wide as possible. ` Put the input capacitor as close as possible to the device pins (VIN and GND). ` SW node is with high frequency voltage swing and should be kept at small area. Keep analog components away from the SW node to prevent stray capacitive noise pick-up. ` Connect feedback network behind the output capacitors. Keep the loop area small. Place the feedback components near the RT7270. ` An example of PCB layout guide is shown in Figure 7 for reference. (b) Copper Area = 10mm2, θJA = 64°C/W (c) Copper Area = 30mm2 , θJA = 54°C/W (d) Copper Area = 50mm2 , θJA = 51°C/W (e) Copper Area = 70mm2 , θJA = 49°C/W Figure 5. Thermal Resistance vs. Copper Area Layout Design Copyright © 2012 Richtek Technology Corporation. All rights reserved. www.richtek.com 12 is a registered trademark of Richtek Technology Corporation. DS7270-01 September 2012 RT7270 VIN GND SW GND VIN CBOOT Input capacitor must be placed as close to the IC as possible. BOOT L VOUT REN CSS CIN VIN 2 SW 3 GND 4 GND CC 8 SS 7 EN 6 COMP 5 FB 9 The feedback components must be connected as close to the device as possible. CP RC R1 R2 COUT VOUT GND SW node is with high frequency voltage swing and should be kept at small area. Keep analog components away from the SW node to prevent stray capacitive noise pick-up Figure 7. PCB Layout Guide Table 3. Suggested Capacitors for CIN and COUT Location Component Supplier Part No. Capacitance (μF) Case Size CIN MURATA GRM31CR61E106K 10 1206 CIN TDK C3225X5R1E106K 10 1206 CIN TAIYO YUDEN TMK316BJ106ML 10 1206 COUT MURATA GRM31CR60J476M 47 1206 COUT TDK C3225X5R0J476M 47 1210 COUT MURATA GRM32ER71C226M 22 1210 COUT TDK C3225X5R1C22M 22 1210 Copyright © 2012 Richtek Technology Corporation. All rights reserved. DS7270-01 September 2012 is a registered trademark of Richtek Technology Corporation. www.richtek.com 13 RT7270 Outline Dimension H A M EXPOSED THERMAL PAD (Bottom of Package) Y J X B F C I D Dimensions In Millimeters Symbol Dimensions In Inches Min Max Min Max A 4.801 5.004 0.189 0.197 B 3.810 4.000 0.150 0.157 C 1.346 1.753 0.053 0.069 D 0.330 0.510 0.013 0.020 F 1.194 1.346 0.047 0.053 H 0.170 0.254 0.007 0.010 I 0.000 0.152 0.000 0.006 J 5.791 6.200 0.228 0.244 M 0.406 1.270 0.016 0.050 X 2.000 2.300 0.079 0.091 Y 2.000 2.300 0.079 0.091 X 2.100 2.500 0.083 0.098 Y 3.000 3.500 0.118 0.138 Option 1 Option 2 8-Lead SOP (Exposed Pad) Plastic Package Richtek Technology Corporation 5F, No. 20, Taiyuen Street, Chupei City Hsinchu, Taiwan, R.O.C. Tel: (8863)5526789 Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries. www.richtek.com 14 DS7270-01 September 2012