LMC6035/LMC6036 Low Power 2.7V Single Supply CMOS Operational Amplifiers General Description Features The LMC6035/6 is an economical, low voltage op amp capable of rail-to-rail output swing into loads of 600Ω. LMC6035 is available in a chip sized package (8-Bump micro SMD) using National’s micro SMD package technology. Both allow for single supply operation and are guaranteed for 2.7V, 3V, 5V and 15V supply voltage. The 2.7 supply voltage corresponds to the End-of-Life voltage (0.9V/cell) for three NiCd or NiMH batteries in series, making the LMC6035/6 well suited for portable and rechargeable systems. It also features a well behaved decrease in its specifications at supply voltages below its guaranteed 2.7V operation. This provides a “comfort zone” for adequate operation at voltages significantly below 2.7V. Its ultra low input currents (IIN) makes it well suited for low power active filter application, because it allows the use of higher resistor values and lower capacitor values. In addition, the drive capability of the LMC6035/6 gives these op amps a broad range of applications for low voltage systems. (Typical Unless Otherwise Noted) n LMC6035 in micro SMD Package n Guaranteed 2.7V, 3V, 5V and 15V Performance n Specified for 2 kΩ and 600Ω Loads n Wide Operating Range: 2.0V to 15.5V n Ultra Low Input Current: 20fA n Rail-to-Rail Output Swing @ 600Ω: 200mV from either rail at 2.7V @ 100kΩ: 5mV from either rail at 2.7V n High Voltage Gain: 126dB n Wide Input Common-Mode Voltage Range -0.1V to 2.3V at VS = 2.7V n Low Distortion: 0.01% at 10kHz n LMC6035 Dual LMC6036 Quad n See AN-1112 for micro SMD considerations Applications n n n n Filters High Impedance Buffer or Preamplifier Battery Powered Electronics Medical Instrumentation Connection Diagram 8-Bump microSMD microSMD Connection Table Bump Number 01283065 © 2002 National Semiconductor Corporation DS012830 LMC6035ITL LMC6035ITLX A1 OUTPUT A OUTPUT B B1 IN A− V+ C1 + IN A OUTPUT A C2 V− IN A− C3 Top View (Bump Side Down) LM6035IBP LMC6035IBPX + IN A+ − IN B B3 IN B V− A3 OUTPUT B IN B+ A2 V+ IN B− www.national.com LMC6035/LMC6036 Low Power 2.7V Single Supply CMOS Operational Amplifiers October 2002 LMC6035/LMC6036 Absolute Maximum Ratings Junction Temperature (Note 4) (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Operating Ratings (Note 1) Supply Voltage ESD Tolerance (Note 2) Human Body Model Supply Voltage (V − V ) 16V 230˚C/W 175˚C/W 127˚C/W Output Short Circuit to V + (Note 8) Output Short Circuit to V − (Note 3) 14-pin SOIC Current at Output Pin Current at Input Pin ≤ +85˚C 8-pin MSOP 8-pin SOIC Lead Temperature (soldering, 10 sec.) J Thermal Resistance (θJA) ± Supply Voltage − −40˚C ≤ T LMC6035I and LMC6036I 300V Differential Input Voltage 2.0V to 15.5V Temperature Range 3000V Machine Model + 150˚C 14-pin TSSOP 137˚C/W 260˚C 8-Bump (6 mil) micro SMD 220˚C/W ± 18mA ± 5mA 8-Bump (12 mil) Thin micro SMD 220˚C/W Current at Power Supply Pin 35mA Storage Temperature Range −65˚C to +150˚C DC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.7V, V− = 0V, VCM = 1.0V, VO = 1.35V and RL > 1MΩ. Boldface limits apply at the temperature extremes. LMC6035I/LMC6036I Symbol Parameter Conditions Min (Note 6) Typ (Note 5) Max (Note 6) Units 5 6 mV VOS Input Offset Voltage 0.5 TCVOS Input Offset Voltage Average Drift 2.3 µV/˚C IIN Input Current (Note 11) 0.02 90 pA IOS Input Offset Current (Note 11) 0.01 45 PA RIN Input Resistance CMRR Common Mode Rejection Ratio 0.7V ≤ VCM ≤ 12.7V, V+ = 15V +PSRR Positive Power Supply Rejection Ratio −PSRR VCM > 10 Tera Ω 63 60 96 dB 5V ≤ V+ ≤ 15V, VO = 2.5V 63 60 93 dB Negative Power Supply Rejection Ratio 0V ≤ V− ≤ −10V, VO = 2.5V, V+ = 5V 74 70 97 dB Input Common-Mode Voltage Range V+ = 2.7V For CMRR ≥ 40dB −0.1 2.0 1.7 V+ = 3V For CMRR ≥ 40dB V+ = 5V For CMRR ≥ 50dB V+ = 15V For CMRR ≥ 50dB 2 −0.2 0.0 4.5 −0.5 14.0 13.7 0.1 0.3 2.6 −0.5 4.2 3.9 www.national.com 2.3 −0.3 2.3 2.0 0.3 0.5 14.4 −0.2 0.0 V V V V (Continued) Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.7V, V− = 0V, VCM = 1.0V, VO = 1.35V and RL > 1MΩ. Boldface limits apply at the temperature extremes. LMC6035I/LMC6036I Symbol Parameter Conditions Large Signal Voltage Gain (Note 7) AV RL = 600Ω RL = 2kΩ Typ (Note 5) Sourcing 100 75 1000 V/mV Sinking 25 20 250 V/mV 2000 V/mV 500 V/mV Sourcing Sinking VO V + = 2.7V RL = 600Ω to 1.35V Output Swing 2.0 1.8 2.5 0.2 V + = 2.7V RL = 2kΩ to 1.35V 2.4 2.2 13.5 13.0 2.62 14.2 13.5 14.5 Output Current Supply Current IS V 1.25 1.50 14.8 0.12 IO V 0.2 0.4 0.36 V + = 15V, RL = 2 kΩ to 7.5V V 0.5 0.7 0.07 V + = 15V RL = 600Ω to 7.5V Max (Note 6) Units Min (Note 6) V O = 0V Sourcing 4 3 8 V O = 2.7V Sinking 3 2 5 V 0.4 0.5 mA LMC6035 for Both Amplifiers V O = 1.35V 0.65 1.6 1.9 LMC6036 for All Four Amplifiers V O = 1.35V 1.3 2.7 3.0 mA AC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.7V, V− = 0V, VCM = 1.0V, V Boldface limits apply at the temperature extremes. Symbol Parameter Conditions O = 1.35V and RL > 1 MΩ. Typ Units (Note 5) SR Slew Rate (Note 9) GBW Gain Bandwidth Product V θm Phase Margin 48 ˚ Gm Gain Margin 17 dB dB + = 15V 1.5 V/µs 1.4 MHz Amp-to-Amp Isolation (Note 10) 130 en Input-Referred Voltage Noise f = 1kHz 27 in Input Referred Current Noise f = 1kHz THD Total Harmonic Distortion f = 10kHz, AV = −10 V R CM L = 1V = 2kΩ, VO = 8 VPP 3 0.2 0.01 % www.national.com LMC6035/LMC6036 DC Electrical Characteristics LMC6035/LMC6036 AC Electrical Characteristics (Continued) Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.7V, V− = 0V, VCM = 1.0V, V Boldface limits apply at the temperature extremes. Symbol Parameter Conditions O = 1.35V and RL > 1 MΩ. Typ Units (Note 5) V + = 10V Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. Note 2: Human body model, 1.5kΩ in series with 100pF. Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C. Output currents in excess of 30mA over long term may adversely affect reliability. Note 4: The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) −TA)/θ JA. All numbers apply for packages soldered directly onto a PC board with no air flow. Note 5: Typical Values represent the most likely parametric norm or one sigma value. Note 6: All limits are guaranteed by testing or statistical analysis. Note 7: V+ = 15V, VCM = 7.5V and R L connected to 7.5V. For Sourcing tests, 7.5V ≤ VO ≤ 11.5V. For Sinking tests, 3.5V ≤ VO ≤ 7.5V. Note 8: Do not short circuit output to V+ when V+ is greater than 13V or reliability will be adversely affected. Note 9: V+ = 15V. Connected as voltage follower with 10V step input. Number specified is the slower of the positive and negative slew rates. Note 10: Input referred, V + = 15V and RL = 100kΩ connected to 7.5V. Each amp excited in turn with 1kHz to produce VO = 12 VPP. Note 11: Guaranteed by design. www.national.com 4 Unless otherwise specified, VS = 2.7V, single supply, TA = Supply Current vs. Supply Voltage (Per Amplifier) Input Current vs. Temperature 01283052 01283053 Sourcing Current vs. Output Voltage Sourcing Current vs. Output Voltage 01283054 01283055 Sinking Current vs. Output Voltage Sinking Current vs. Output Voltage 01283056 01283057 5 www.national.com LMC6035/LMC6036 Typical Performance Characteristics 25˚C LMC6035/LMC6036 Typical Performance Characteristics Unless otherwise specified, VS = 2.7V, single supply, TA = 25˚C (Continued) Output Voltage Swing vs. Supply Voltage Input Noise vs. Frequency 01283058 01283059 Input Noise vs. Frequency Amp to Amp Isolation vs. Frequency 01283060 01283061 Amp to Amp Isolation vs. Frequency +PSRR vs. Frequency 01283032 01283062 www.national.com 6 −PSRR vs. Frequency CMRR vs. Frequency 01283033 01283034 CMRR vs. Input Voltage CMRR vs. Input Voltage 01283036 01283035 Input Voltage vs. Output Voltage Input Voltage vs. Output Voltage 01283014 01283015 7 www.national.com LMC6035/LMC6036 Typical Performance Characteristics Unless otherwise specified, VS = 2.7V, single supply, TA = 25˚C (Continued) LMC6035/LMC6036 Typical Performance Characteristics Unless otherwise specified, VS = 2.7V, single supply, TA = 25˚C (Continued) Frequency Response vs. Temperature Frequency Response vs. Temperature 01283016 01283017 Gain and Phase vs. Capacitive Load Gain and Phase vs. Capacitive Load 01283018 01283019 Slew Rate vs. Supply Voltage Non-Inverting Large Signal Response 01283020 01283037 www.national.com 8 Non-Inverting Large Signal Response Non-Inverting Large Signal Response 01283021 01283022 Non-Inverting Small Signal Response Non-Inverting Small Signal Response 01283023 01283024 Non-Inverting Large Signal Response Inverting Large Signal Response 01283025 01283026 9 www.national.com LMC6035/LMC6036 Typical Performance Characteristics Unless otherwise specified, VS = 2.7V, single supply, TA = 25˚C (Continued) LMC6035/LMC6036 Typical Performance Characteristics Unless otherwise specified, VS = 2.7V, single supply, TA = 25˚C (Continued) Inverting Large Signal Response Inverting Large Signal Response 01283027 01283028 Inverting Small Signal Response Inverting Small Signal Response 01283029 01283030 Inverting Small Signal Response Stability vs. Capacitive Load 01283031 01283038 www.national.com 10 Stability vs. Capacitive Load Stability vs. Capacitive Load 01283039 01283040 Stability vs. Capacitive Load Stability vs. Capacitive Load 01283041 01283042 Stability vs. Capacitive Load 01283043 11 www.national.com LMC6035/LMC6036 Typical Performance Characteristics Unless otherwise specified, VS = 2.7V, single supply, TA = 25˚C (Continued) LMC6035/LMC6036 1.0 Application Notes 1.1 Background The LMC6035/6 is exceptionally well suited for low voltage applications. A desirable feature that the LMC6035/6 brings to low voltage applications is its output drive capability — a hallmark for National’s CMOS amplifiers. The circuit of Figure 1 illustrates the drive capability of the LMC6035/6 at 3V of supply. It is a differential output driver for a one-to-one audio transformer, like those used for isolating ground from the telephone lines. The transformer (T1) loads the op amps with about 600Ω of AC load, at 1 kHz. Capacitor C1 functions to block DC from the low winding resistance of T1. Although the value of C1 is relatively high, its load reactance (Xc) is negligible compared to inductive reactance (XI) of T1. 01283045 FIGURE 2. Output Swing Performance of the LMC6035 per the Circuit of Figure 1 01283044 FIGURE 1. Differential Driver The circuit in Figure 1 consists of one input signal and two output signals. U1A amplifies the input with an inverting gain of −2, while the U1B amplifies the input with a non-inverting gain of +2. Since the two outputs are 180˚ out of phase with each other, the gain across the differential output is 4. As the differential output swings between the supply rails, one of the op amps sources the current to the load, while the other op amp sinks the current. How good a CMOS op amp can sink or source a current is an important factor in determining its output swing capability. The output stage of the LMC6035/6 — like many op amps — sources and sinks output current through two complementary transistors in series. This “totem pole” arrangement translates to a channel resistance (Rdson) at each supply rail which acts to limit the output swing. Most CMOS op amps are able to swing the outputs very close to the rails — except, however, under the difficult conditions of low supply voltage and heavy load. The LMC6035/6 exhibits exceptional output swing capability under these conditions. The scope photos of Figure 2 and Figure 3 represent measurements taken directly at the output (relative to GND) of U1A, in Figure 1. Figure 2 illustrates the output swing capability of the LMC6035, while Figure 3 provides a benchmark comparison. (The benchmark op amp is another low voltage (3V) op amp manufactured by one of our reputable competitors.) www.national.com 01283046 FIGURE 3. Output Swing Performance of Benchmark Op Amp per the Circuit of Figure 1 Notice the superior drive capability of LMC6035 when compared with the benchmark measurement — even though the benchmark op amp uses twice the supply current. Not only does the LMC6035/6 provide excellent output swing capability at low supply voltages, it also maintains high open loop gain (A VOL) with heavy loads. To illustrate this, the LMC6035 and the benchmark op amp were compared for their distortion performance in the circuit of Figure 1. The graph of Figure 4 shows this comparison. The y-axis represents percent Total Harmonic Distortion (THD plus noise) across the loaded secondary of T1. The x-axis represents the input amplitude of a 1 kHz sine wave. (Note that T1 loses about 20% of the voltage to the voltage divider of RL (600Ω) and T1’s winding resistances — a performance deficiency of the transformer.) 12 LMC6035/LMC6036 1.0 Application Notes (Continued) 01283048 FIGURE 5. 2-Pole, 3kHz, Active, Sallen and Key, Lowpass Filter with Butterworth Response 22.214.171.124 Low-Pass Frequency Scaling Procedure The actual component values represented in bold of Figure 5 were obtained with the following scaling procedure: 1. First determine the frequency scaling factor (FSF) for the desired cutoff frequency. Choosing fc at 3kHz, provides the following FSF computation: FSF = 2π x 3kHz (desired cutoff freq.) = 18.84 x 10 3 01283047 FIGURE 4. THD+Noise Performance of LMC6035 and “Benchmark” per Circuit of Figure 1 2. Figure 4 shows the superior distortion performance of LMC6035/6 over that of the benchmark op amp. The heavy loading of the circuit causes the AVOL of the benchmark part to drop significantly which causes increased distortion. Then divide all of the normalized capacitor values by the C1’ = FSF as follows: C1’ = C(Normalized)/FSF C2’ = 1.414/18.84 0.707/18.84 x 103 = 37.93 x 10−6 (C1’ and C2’: prior to impedance x 103 = 75.05 x 10−6 scaling) 3. Last, choose an impedance scaling factor (Z). This Z factor can be calculated from a standard value for C2. Then Z can be used to determine the remaining component values as follows: Z = C2’/C2(chosen) = 75.05 x 10 −6/6.8nF = 8.4k C1 = C1’/Z = 37.93 x 10−6 /8.4k = 4.52nF (Standard capacitor value chosen for C1 is 4.7nF ) R1 = R2 = R2(normalized) R1(normalized) x Z = 1Ω x 8.4k = 8.4kΩ x Z = 1Ω x 8.4k = 8.4kΩ (Standard value chosen for R1 and R2 is 8.45kΩ ) 1.2 APPLICATION CIRCUITS 1.2.1 Low-Pass Active Filter A common application for low voltage systems would be active filters, in cordless and cellular phones for example. The ultra low input currents (IIN) of the LMC6035/6 makes it well suited for low power active filter applications, because it allows the use of higher resistor values and lower capacitor values. This reduces power consumption and space. Figure 5 shows a low pass, active filter with a Butterworth (maximally flat) frequency response. Its topology is a Sallen and Key filter with unity gain. Note the normalized component values in parenthesis which are obtainable from standard filter design handbooks. These values provide a 1Hz cutoff frequency, but they can be easily scaled for a desired cutoff frequency (fc). The bold component values of Figure 5 provide a cutoff frequency of 3kHz. An example of the scaling procedure follows Figure 5. 1.2.2 High Pass Active Filter The previous low-pass filter circuit of Figure 5 converts to a high-pass active filter per Figure 6. 01283049 FIGURE 6. 2 Pole, 300Hz, Sallen and Key, High-Pass Filter 13 www.national.com LMC6035/LMC6036 1.0 Application Notes 1.3 PRINTED-CIRCUIT-BOARD LAYOUT FOR HIGH-IMPEDANCE WORK It is generally recognized that any circuit which must operate with < 1000pA of leakage current requires special layout of the PC board. If one wishes to take advantage of the ultra-low bias current of the LMC6035/6, typically < 0.04pA, it is essential to have an excellent layout. Fortunately, the techniques for obtaining low leakages are quite simple. First, the user must not ignore the surface leakage of the PC board, even though it may at times appear acceptably low. Under conditions of high humidity, dust or contamination, the surface leakage will be appreciable. (Continued) 126.96.36.199 High-Pass Frequency Scaling Procedure Choose a standard capacitor value and scale the impedances in the circuit according to the desired cutoff frequency (300Hz) as follows: C = C1 = C2 Z = 1 Farad/C(chosen) x 2π x (desired cutoff freq.) = 1 Farad/6.8nF x 2π x 300 Hz = 78.05k R1 = Z x R1(normalized) = 78.05k x (1/0.707) = 110.4kΩ (Standard value chosen for R1 is 110kΩ ) R2 = Z x R2(normalized) = 78.05k x (1/1.414) = 55.2kΩ (Standard value chosen for R1 is 54.9kΩ ) To minimize the effect of any surface leakage, lay out a ring of foil completely surrounding the LMC6035 or LMC6036 inputs and the terminals of capacitors, diodes, conductors, resistors, relay terminals, etc. connected to the op amp’s inputs. See Figure 8. To have a significant effect, guard rings should be placed on both the top and bottom of the PC board. This PC foil must then be connected to a voltage which is at the same voltage as the amplifier inputs, since no leakage current can flow between two points at the same potential. For example, a PC board trace-to-pad resistance of 1012Ω, which is normally considered a very large resistance, could leak 5pA if the trace were a 5V bus adjacent to the pad of an input. This would cause a 100 times degradation from the amplifiers actual performance. However, if a guard ring is held within 5mV of the inputs, then even a resistance of 1011Ω would cause only 0.05pA of leakage current, or perhaps a minor (2:1) degradation of the amplifier’s performance. See Figure 9a, b, c for typical connections of guard rings for standard op amp configurations. If both inputs are active and at high impedance, the guard can be tied to ground and still provide some protection; see Figure 9 d. 1.2.3 Dual Amplifier Bandpass Filter The dual amplifier bandpass (DABP) filter features the ability to independently adjust fc and Q. In most other bandpass topologies, the fc and Q adjustments interact with each other. The DABP filter also offers both low sensitivity to component values and high Qs. The following application of Figure 7, provides a 1kHz center frequency and a Q of 100. 01283050 FIGURE 7. 2 Pole, 1kHz Active, Bandpass Filter 188.8.131.52 DABP Component Selection Procedure Component selection for the DABP filter is performed as follows: 1. First choose a center frequency (fc). Figure 7 represents component values that were obtained from the following computation for a center frequency of 1kHz. R2 = R3 Given: fc = 1kHz and C (chosen) = 6.8nF = 1/(2 πf cC) R2 = R3 = 1/(2π x 3kHz x 6.8nF) = 23.4kΩ (Chosen standard value is 23.7kΩ ) 2. 01283007 FIGURE 8. Example, using the LMC6036 of Guard Ring in P.C. Board Layout Then compute R1 for a desired Q (fc/BW) as follows: R1 = Q x R2. Choosing a Q of 100, R1 = 100 x 23.7kΩ = 2.37MΩ. www.national.com 14 LMC6035/LMC6036 1.0 Application Notes (Continued) 01283010 (c) Follower 01283008 (a) Inverting Amplifier 01283009 01283011 (b) Non-Inverting Amplifier (d) Howland Current Pump FIGURE 9. Guard Ring Connections plies, the maximum temperature rise will be under 4.5˚C. For application information specific to micro SMD, see Application note AN-1112. 1.3.1 CAPACITIVE LOAD TOLERANCE Like many other op amps, the LMC6035/6 may oscillate when its applied load appears capacitive. The threshold of oscillation varies both with load and circuit gain. The configuration most sensitive to oscillation is a unity-gain follower. See the Typical Performance Characteristics. The load capacitance interacts with the op amp’s output resistance to create an additional pole. If this pole frequency is sufficiently low, it will degrade the op amp’s phase margin so that the amplifier is no longer stable at low gains. As shown in Figure 10, the addition of a small resistor (50Ω–100Ω) in series with the op amp’s output, and a capacitor (5pF–10pF) from inverting input to output pins, returns the phase margin to a safe value without interfering with lower-frequency circuit operation. Thus, larger values of capacitance can be tolerated without oscillation. Note that in all cases, the output will ring heavily when the load capacitance is near the threshold for oscillation. 1.4 Micro SMD Considerations Contrary to what might be guessed, the micro SMD package does not follow the trend of smaller packages having higher thermal resistance. LMC6035 in micro SMD has thermal resistance of 220˚C/W compared to 230˚C/W in MSOP. Even when driving a 600Ω load and operating from ± 7.5V sup- 01283005 FIGURE 10. Rx, Cx Improve Capacitive Load Tolerance Capacitive load driving capability is enhanced by using a pull up resistor to V+ (Figure 11). Typically a pull up resistor conducting 500µA or more will significantly improve capacitive load responses. The value of the pull up resistor must be determined based on the current sinking capability of the amplifier with respect to the desired output swing. Open loop gain of the amplifier can also be affected by the pull up resistor (see Electrical Characteristics). 15 www.national.com LMC6035/LMC6036 1.0 Application Notes (Continued) 01283006 FIGURE 11. Compensating for Large Capacitive Loads with a Pull Up Resistor Connection Diagrams 8-Pin SO/MSOP 14-Pin SO/TSSOP 01283001 Top View 01283002 Top View Ordering Information Package Temperature Range Transport Media NSC Drawing Industrial −40˚C to +85˚C 8-pin Small Outline (SO) 8-pin Mini Small Outline (MSOP) 14-pin Small Outline (SO) 14-pin Thin Shrink Small Outline (TSSOP) LMC6035IM Rails LMC6035IMX 2.5k Units Tape and Reel LMC6035IMM 1k Units Tape and Reel LMC6035IMMX 3.5k Units Tape and Reel MUA08A LMC6036IM Rails LMC6036IMX 2.5k Units Tape and Reel LMC6036IMT Rails LMC6036IMTX 2.5k Units Tape and Reel 8-Bump micro SMD (Small Bump) LMC6035IBP 250 Units Tape and Reel LMC6035IBPX 3k Units Tape and Reel 8-Bump Thin micro SMD (Large Bump) LMC6035ITL 250 Units Tape and Reel LMC6035ITLX 3k Units Tape and Reel www.national.com M08A 16 M14A MTC14 BPA08FFB TLA08JQA LMC6035/LMC6036 Physical Dimensions inches (millimeters) unless otherwise noted 8-Lead (0.150" Wide) Molded Small Outline Package, JEDEC NS Package Number M08A 8-Lead (0.150" Wide) Molded Mini Small Outline Package, JEDEC NS Package Number MUA08A 17 www.national.com LMC6035/LMC6036 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 14-Lead (0.150" Wide) Molded Small Outline Package, JEDEC NS Package Number M14A 14-Pin TSSOP NS Package Number MTC14 www.national.com 18 LMC6035/LMC6036 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) NOTE: UNLESS OTHERWISE SPECIFIED. 1. EPOXY COATING. 2. 63Sn/37Pb EUTECTIC BUMP. 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION PINS ARE NUMBERED COUNTERCLOCKWISE. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC. 8-Bump micro SMD (6 mil bumps) NS Package Number BPA08FFB X1 = 1.412mm X2 = 1.412mm X3 = 0.850mm 19 www.national.com LMC6035/LMC6036 Low Power 2.7V Single Supply CMOS Operational Amplifiers Physical Dimensions inches (millimeters) unless otherwise noted (Continued) NOTE: UNLESS OTHERWISE SPECIFIED. 1. EPOXY COATING. 2. 63Sn/37Pb EUTECTIC BUMP. 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION PINS ARE NUMBERED COUNTERCLOCKWISE. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC. 8-Bump Thin micro SMD (12 mil bumps) NS Package Number TLA08JQA X1 = 1.717mm X2 = 1.869mm X3 = 0.600mm LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Email: [email protected] www.national.com National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: [email protected] Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: [email protected] National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.