Z-Power LED X10490 Technical Data Sheet RoHS Specification SSC-STW8C2SA SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet STW8C2SA Description STW8C2SA Features • Lead Frame type LED PKG size: 3.0*3.0 thickness 0.65mm • White colored SMT package • Pb-free Reflow Soldering Application • RoHS compliant This surface-mount LED comes in standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability. Applications • Interior lighting • General lighting • Indoor and out door displays • Architectural / Decorative lighting SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet [ Contents ] 1. Full code of STW8C2SA 2. Outline dimensions of STW8C2SA 3. Characteristics of STW8C2SA 4. Characteristic diagrams 5. Color & Binning 6. Bin Code Description 7. Labeling 8. Packing 9. Recommended solder pad 10. Soldering 11. Precaution for use 12. Handling of Silicone Resin LEDs SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 1. Full code of STW8C2SA Full code form : X1 X2 – X3 X4 – X5 – X6 X7 – X8 1. Part Number - X1 : Company - X2 : Kind of LED 2. Internal Number - X3X4 : CRI Group - X5 : Package series - X6 X7 : Characteristic code - X8 : Version SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 2. Outline dimensions of STW8C2SA Top View Bottom View Package Mark (-) Cathode Side View Circuit Cathode 1 Anode 2 ESD Protection Device Notes : [1] All dimensions are in millimeters. [2] Scale : none [3] Undefined tolerance is ±0.2mm SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet Material Structure ② ③ ④ ⑤ ⑥ ① Parts No. Name Description Materials ① LEAD FRAME Metal Copper Alloy (Silver Plated) ② Chip Source Blue LED GaN on Sapphire ③ Wire Metal Gold Wire ④ Encapsulation Silicone +Phosphor ⑤ Body Thermo Plastic Heat-resistant Polymer ⑥ Zener Diode Si - SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 3. Characteristics of STW8C2SA 1) Electro-Optical characteristics at 100mA (Ta=25℃, RH30%) Value Parameter Symbol Unit Min Typ Max VF - 6.3 6.8 V VR (IR=5mA) - 0.9 1.4 V Luminous Intensity* (3,700~7,000 K) Iv - 22.4 (72.6) - cd (lm) Luminous Intensity*[1] (2,600~3,700 K) Iv - 20.9 (66.1) - cd (lm) Correlated Color Temperature CCT 2,600 - 7,000 K Viewing Angle [2] 2Θ1/2 - 120 - - RthJS - 10 - ºC/W Ra 80 83 90 - Forward Voltage Reverse Voltage [1] Thermal resistance [3] Color Rendering Index* *Notes : All measurements were made under the standardized environment of SSC. [1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. [2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [3] Thermal resistance: Rth JS (Junction / solder) * Tolerance : VF :±0.2V, IV :±7%, Ra :±2, x,y :±0.007 2) Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current IF 200 mA Power Dissipation*[1] Pd 1.36 W Junction Temperature Tj 125 ºC Operating Temperature Topr -40 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC ±5,000V HBM V ESD (HBM) *Notes : LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. SSC--STW8C2SA SSC [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) 1) Spectrum data (IF=100mA, Ta=25℃, RH30%) 2600~3700K 3700~4700K 4700~7000K 1.0 Relative Emission Intensity Z-Power LED X10490 Technical Data Sheet 4. Characteristic diagrams 0.5 0.0 300 400 500 600 700 800 Wavelength [nm] 2) Viewing angle, Ta=25℃ SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) 0.20 0.15 IF[A] 0.10 0.05 0.00 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 VF[V] 4) Forward Current vs. Relative Luminous Intensity, Ta=25℃ 2.0 1.8 1.6 Relative Luminous Intensity Z-Power LED X10490 Technical Data Sheet 3) Forward Voltage vs. Forward Current, Ta=25℃ 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 20 40 60 80 100 120 140 Forward Current IF [mA] 160 180 200 SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) (4000~7000K) 0.358 0.356 0.354 20mA 0.352 y 50mA 75mA 0.350 100mA 150mA 0.348 200mA 0.346 0.344 0.342 0.338 0.339 0.340 0.341 0.342 0.343 x (2600~4000K) 0.403 0.402 75mA y Z-Power LED X10490 Technical Data Sheet 5) Chromaticity Coordinate vs. Forward Current, Ta=25℃ 50mA 100mA 20mA 0.435 0.436 0.401 150mA 0.400 200mA 0.399 0.433 0.434 x 0.437 0.438 SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) 1.0 Relative Luminous Intensity Z-Power LED X10490 Technical Data Sheet 6) Relative Luminous Intensity vs. Junction Temperature, IF=100mA 0.8 0.6 0.4 0.2 0.0 30 45 60 75 90 105 120 O Ju n ctio n tem pe ratu re Tj( C ) SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) (4000~7000K) 0.355 0.350 25 y 0.345 70 0.340 100 125 0.335 0.330 0.325 0.320 0.325 0.330 0.335 0.340 0.345 x (2600~4000K) 0.404 0.400 25 0.396 70 y Z-Power LED X10490 Technical Data Sheet 7) Chromaticity Coordinate vs. Junction Temperature 100 0.392 125 0.388 0.384 0.420 0.422 0.424 0.426 0.428 x 0.430 0.432 0.434 SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Relative Forward Voltage 1 .0 0 .8 0 .6 0 .4 0 .2 0 .0 30 45 60 75 90 105 120 O Ju n ctio n te m p era tu re T j( C ) 9) Ambient Temperature vs. Maximum Forward Current 250 Forward Current IF [mA] Z-Power LED X10490 Technical Data Sheet 8) Junction Temperature vs. Relative Forward Voltage 200 150 Rth j-a : 60 ℃/W 100 50 0 -40 -20 0 20 40 60 80 100 O Ambient Temperature T A [ C] SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 5. Color & Binning 0.44 2700K 2900K 2600K 3000K 3200K 0.42 3500K 3700K F1 4000K 0.40 4200K 4500K 5000K D0 0.36 6500K A1 7000K C1 C0 5600K 6000K D3 D2 F3 F2 F5 E3 F4 E2 E5 E4 D5 C3 D4 B1 C2 C5 B0 B3 C4 B2 B5 0.44 2600K 2700K 2900K 3000K 3200K 0.42 H11 G41 G21 G11 CIE Y G32 A4 G12 0.40 H12 G23 G34 G14 H13 G43 G33 G13 0.30 G42 G22 G44 H14 H24 H23 H34 H31 H21 G31 A0 A3 B4 A2 A5 0.32 H22 H32 H33 H41 H42 H43 H44 G24 0.38 0.42 0.44 0.46 0.48 CIE X 0.28 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 CIE X 0.44 2600K 2700K 2900K 3000K 3200K 0.42 H11 G41 H21 G31 G21 G11 G32 CIE Y CIE Y D1 5300K 0.34 E1 E0 4700K 0.38 F0 G42 H12 G22 G12 0.40 G43 G33 G23 G13 G34 G14 0.38 H13 G44 H14 H24 H23 H34 H22 H32 H33 H31 H41 H42 H43 H44 G24 MACADAM 3STEP Rank 0.42 0.44 0.46 CIE X 0.48 SSC--STW8C2SA SSC * Apply the Energy Star binning(3200~7000K) & MACADAM 3 Step binning (just, 2600~3200K) * Measurement Uncertainty of the Color Coordinates : ± 0.007 Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 5. Color & Binning ● COLOR RANK <IF=100mA, Ta=25℃> A0 A1 A2 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3028 0.3304 0.3115 0.3393 0.3041 0.324 0.3041 0.324 0.3126 0.3324 0.3055 0.3177 0.3126 0.3324 0.321 0.3408 0.3136 0.3256 0.3115 0.3393 0.3205 0.3481 0.3126 0.3324 A3 A4 A5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3126 0.3324 0.3055 0.3177 0.3136 0.3256 0.3136 0.3256 0.3068 0.3113 0.3146 0.3187 0.3216 0.3334 0.3146 0.3187 0.3221 0.3261 0.321 0.3408 0.3136 0.3256 0.3216 0.3334 B0 B1 B2 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3207 0.3462 0.3292 0.3539 0.3212 0.3389 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 0.3292 0.3539 0.3376 0.3616 0.3293 0.3461 B3 B4 B5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3293 0.3461 0.3217 0.3316 0.3293 0.3384 0.3293 0.3384 0.3222 0.3243 0.3294 0.3306 0.3369 0.3451 0.3294 0.3306 0.3366 0.3369 0.3373 0.3534 0.3293 0.3384 0.3369 0.3451 SSC--STW8C2SA SSC Jan 2013 * Measurement Uncertainty of the Color Coordinates : ± 0.007 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 5. Color & Binning ● COLOR RANK <IF=100mA, Ta=25℃> C0 C1 C2 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3376 0.3616 0.3463 0.3687 0.3373 0.3534 0.3373 0.3534 0.3456 0.3601 0.3369 0.3451 0.3456 0.3601 0.3539 0.3669 0.3448 0.3514 0.3463 0.3687 0.3552 0.376 0.3456 0.3601 C3 C4 C5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3456 0.3601 0.3369 0.3451 0.3448 0.3514 0.3448 0.3514 0.3366 0.3369 0.344 0.3428 0.3526 0.3578 0.344 0.3428 0.3514 0.3487 0.3539 0.3669 0.3448 0.3514 0.3526 0.3578 D0 D1 D2 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3548 0.3736 0.3641 0.3804 0.3536 0.3646 0.3536 0.3646 0.3625 0.3711 0.3523 0.3555 0.3625 0.3711 0.3714 0.3775 0.3608 0.3616 0.3641 0.3804 0.3736 0.3874 0.3625 0.3711 D3 D4 D5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3625 0.3711 0.3523 0.3555 0.3608 0.3616 0.3608 0.3616 0.3511 0.3465 0.359 0.3521 0.3692 0.3677 0.359 0.3521 0.367 0.3578 0.3714 0.3775 0.3608 0.3616 0.3692 0.3677 SSC--STW8C2SA SSC Jan 2013 * Measurement Uncertainty of the Color Coordinates : ± 0.007 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 5. Color & Binning ● COLOR RANK <IF=100mA, Ta=25℃> E0 E1 E2 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3736 0.3874 0.3869 0.3958 0.3714 0.3775 0.3714 0.3775 0.3842 0.3855 0.3692 0.3677 0.3842 0.3855 0.397 0.3935 0.3813 0.3751 0.3869 0.3958 0.4006 0.4044 0.3842 0.3855 E3 E4 E5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3842 0.3855 0.3692 0.3677 0.3813 0.3751 0.3813 0.3751 0.367 0.3578 0.3783 0.3646 0.3934 0.3825 0.3783 0.3646 0.3898 0.3716 0.397 0.3935 0.3813 0.3751 0.3934 0.3825 F0 F1 F2 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3996 0.4015 0.4146 0.4089 0.396 0.3907 0.396 0.3907 0.4104 0.3978 0.3925 0.3798 0.4104 0.3978 0.4248 0.4048 0.4062 0.3865 0.4146 0.4089 0.4299 0.4165 0.4104 0.3978 F3 F4 F5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4104 0.3978 0.3925 0.3798 0.4062 0.3865 0.4062 0.3865 0.3889 0.369 0.4017 0.3751 0.4198 0.3931 0.4017 0.3751 0.4147 0.3814 0.4248 0.4048 0.4062 0.3865 0.4198 0.3931 SSC--STW8C2SA SSC Jan 2013 * Measurement Uncertainty of the Color Coordinates : ± 0.007 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 5. Color & Binning ● COLOR RANK <IF=100mA, Ta=25℃> G11 G21 G31 G41 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4365 0.4189 0.4430 0.4212 0.4496 0.4236 0.4562 0.4260 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4515 0.4168 0.4261 0.4077 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4299 0.4165 0.4365 0.4189 0.4430 0.4212 0.4496 0.4236 G12 G22 G32 G42 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4515 0.4168 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4468 0.4077 0.4223 0.3990 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4261 0.4077 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 G13 G23 G33 G43 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4468 0.4077 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4420 0.3985 0.4185 0.3902 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4223 0.3990 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 G14 G24 G34 G44 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4316 0.3873 0.4203 0.3834 0.4259 0.3853 0.4259 0.3853 0.4302 0.3943 0.4147 0.3814 0.4203 0.3834 0.4420 0.3985 0.4373 0.3893 0.4185 0.3902 0.4243 0.3922 0.4316 0.3873 0.4361 0.3964 SSC--STW8C2SA SSC Jan 2013 * Measurement Uncertainty of the Color Coordinates : ± 0.007 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 5. Color & Binning ● COLOR RANK <IF=100mA, Ta=25℃> H11 H21 H31 H41 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4325 0.4275 0.4687 0.4289 0.4750 0.4304 0.4810 0.4319 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4758 0.4225 0.4515 0.4168 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4562 0.4260 0.4625 0.4275 0.4687 0.4289 0.4750 0.4304 H12 H22 H32 H42 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4758 0.4225 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4703 0.4132 0.4468 0.4077 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4515 0.4168 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 H13 H23 H33 H43 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4703 0.4132 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4648 0.4038 0.4420 0.3985 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4468 0.4077 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 H14 H24 H34 H44 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4648 0.4038 0.4428 0.3906 0.4483 0.3919 0.4538 0.3932 0.4593 0.3944 0.4373 0.3893 0.4428 0.3906 0.4483 0.3919 0.4538 0.3932 0.4420 0.3985 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 SSC--STW8C2SA SSC Jan 2013 * Measurement Uncertainty of the Color Coordinates : ± 0.007 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 6. Bin Code Description Bin Code Luminous Intensity [cd] Color Rank Forward Voltage [V] K21 C3 Z62 Color Rank @ IF = 100mA Luminous Intensity [cd] *[1] @ IF = 100mA RANK Min. Max. J17 17 19.5 J19 19.5 21.5 K21 21.5 24 K24 24 27.5 Forward Voltage [V] @ IF =100mA A~H RANK Min. Max. Z58 5.8 6.0 Z60 6.0 6.2 Z62 6.2 6.4 Z64 6.4 6.6 Z66 6.6 6.8 CCT CIE IV Rank 3200~7000K A-F J17 J19 K21 K24 2600~3200K G-H J17 J19 K21 K24 IV rank Flux rank ** RANK Min. Max. RANK Min. Max. J17 17 19.5 J17 52.7 60.5 J19 19.5 21.5 J19 60.5 66.7 K21 21.5 24 K21 66.7 74.4 K24 24 27.5 K24 74.4 85.3 Available ranks Not yet available ranks *Notes : All measurements were made under the standardized environment of SSC. In order to ensure availability, single color rank will not be orderable. [1] SSC sort the LED package according to the luminous intensity IV. ** The lumen table is only for reference. SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 7. Labeling X9X10X11X12X13X14X15X16X17 xxxx STW8C2SA SEOUL SEMICONDUCTOR CO.. Rank X9X10X11X12X13X14X15X16X17 - X9X10X11 : Luminous Intensity : IV [cd] - X12X13X14 : Color coordinates : x, y (3200K~7000K : 2 Digits except X14) - X15X16X17 : Forward Voltage : VF [V] SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 8. Packing Reel X9X10X11X12X13X14X15X16X17 xxxx QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : STW8Q2SA STW8C2SA SEOUL SEMICONDUCTOR SEOUL SEMICONDUCTOR CO.,CO.. LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag X9X10X11X12X13X14X15X16X17 xxxx QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : STW8Q2SA STW8C2SA SEOUL SEMICONDUCTOR CO.,CO.. LTD. SEOUL SEMICONDUCTOR Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) a c b 245 220 102 7inch 245 220 142 TYPE 1 SIDE c X9X X10X X11X X12X X13X X14X X15X X16X X17 X 9 10 11 12 13 14 15 16 17 xxxx xxxx 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX STW8Q2SA STW8C2SA STW8Q2SA b PART NUMBER : SEOUL SEMICONDUCTOR CO.. SEOUL SEMICONDUCTOR SEOUL SEMICONDUCTOR CO.,CO.. LTD. a SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 8. Packing ( Tolerance: ±0.2, Unit: mm ) 1)Quantity : Max 4,500pcs/Reel (2000 ~ 4500pcs by 500pcs provided) 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10˚ to the carrier tape. 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 9. Recommended solder pad Notes : [1] [2] [3] [4] All dimensions are in millimeters. Scale : none Recommended Solder Thickness : 0.15 mm Undefined tolerance is ±0.2mm This drawing without tolerances are for reference only. SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 10. Soldering IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. * Caution 1. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com 25 SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 11. Precaution for use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. SSC--STW8C2SA SSC (14)Attaching LEDs, do not use adhesives that outgas organic vapor. Jan 2013 (15)The driving circuit must be designed to allow forward voltage only when it is ON or OFF. www.seoulsemicon.com If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. SSC-QP-7-07-12 (Rev.01) Z-Power LED X10490 Technical Data Sheet 12. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. SSC--STW8C2SA SSC Jan 2013 www.seoulsemicon.com SSC-QP-7-07-12 (Rev.01)