SEOUL STW8C2SA

Z-Power LED
X10490
Technical
Data
Sheet
RoHS
Specification
SSC-STW8C2SA
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
STW8C2SA
Description
STW8C2SA
Features
• Lead Frame type
LED PKG
size: 3.0*3.0
thickness 0.65mm
• White colored
SMT package
• Pb-free Reflow
Soldering Application
• RoHS compliant
This surface-mount LED comes in standard
package dimension.
It has a substrate made up of a molded plastic reflector
sitting on top of a lead frame.
The die is attached within the reflector cavity and the
cavity is encapsulated by silicone.
The package design coupled with careful selection of
component materials allow these products to perform with
high reliability.
Applications
• Interior lighting
• General lighting
• Indoor and out door
displays
• Architectural /
Decorative lighting
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
[ Contents ]
1.
Full code of STW8C2SA
2.
Outline dimensions of STW8C2SA
3.
Characteristics of STW8C2SA
4.
Characteristic diagrams
5.
Color & Binning
6.
Bin Code Description
7.
Labeling
8.
Packing
9.
Recommended solder pad
10. Soldering
11. Precaution for use
12. Handling of Silicone Resin LEDs
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
1. Full code of STW8C2SA
Full code form : X1 X2 – X3 X4 – X5 – X6 X7 – X8
1. Part Number
- X1 : Company
- X2 : Kind of LED
2. Internal Number
- X3X4 : CRI Group
- X5
: Package series
- X6 X7 : Characteristic code
- X8
: Version
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
2. Outline dimensions of STW8C2SA
Top View
Bottom View
Package
Mark (-)
Cathode
Side View
Circuit
Cathode
1
Anode
2
ESD Protection Device
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] Undefined tolerance is ±0.2mm
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
Material Structure
②
③
④
⑤
⑥
①
Parts
No.
Name
Description
Materials
①
LEAD FRAME
Metal
Copper Alloy (Silver Plated)
②
Chip Source
Blue LED
GaN on Sapphire
③
Wire
Metal
Gold Wire
④
Encapsulation
Silicone
+Phosphor
⑤
Body
Thermo Plastic
Heat-resistant Polymer
⑥
Zener Diode
Si
-
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
3. Characteristics of STW8C2SA
1) Electro-Optical characteristics at 100mA
(Ta=25℃, RH30%)
Value
Parameter
Symbol
Unit
Min
Typ
Max
VF
-
6.3
6.8
V
VR (IR=5mA)
-
0.9
1.4
V
Luminous Intensity*
(3,700~7,000 K)
Iv
-
22.4
(72.6)
-
cd
(lm)
Luminous Intensity*[1]
(2,600~3,700 K)
Iv
-
20.9
(66.1)
-
cd
(lm)
Correlated Color
Temperature
CCT
2,600
-
7,000
K
Viewing Angle [2]
2Θ1/2
-
120
-
-
RthJS
-
10
-
ºC/W
Ra
80
83
90
-
Forward Voltage
Reverse Voltage
[1]
Thermal resistance
[3]
Color Rendering Index*
*Notes :
All measurements were made under the standardized environment of SSC.
[1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be
aligned with the mechanical axis of the LED package.
[2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[3] Thermal resistance: Rth JS (Junction / solder)
* Tolerance : VF :±0.2V, IV :±7%, Ra :±2, x,y :±0.007
2) Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
200
mA
Power Dissipation*[1]
Pd
1.36
W
Junction Temperature
Tj
125
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
±5,000V HBM
V
ESD (HBM)
*Notes :
LED’s properties might be different from suggested values like above and below tables if operation
condition will be exceeded our parameter range.
SSC--STW8C2SA
SSC
[1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the
product.
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
1) Spectrum data
(IF=100mA, Ta=25℃, RH30%)
2600~3700K
3700~4700K
4700~7000K
1.0
Relative Emission Intensity
Z-Power LED
X10490
Technical
Data
Sheet
4. Characteristic diagrams
0.5
0.0
300
400
500
600
700
800
Wavelength [nm]
2) Viewing angle, Ta=25℃
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
0.20
0.15
IF[A]
0.10
0.05
0.00
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
VF[V]
4) Forward Current vs. Relative Luminous Intensity, Ta=25℃
2.0
1.8
1.6
Relative Luminous Intensity
Z-Power LED
X10490
Technical
Data
Sheet
3) Forward Voltage vs. Forward Current, Ta=25℃
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
20
40
60
80
100
120
140
Forward Current IF [mA]
160
180
200
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
(4000~7000K)
0.358
0.356
0.354
20mA
0.352
y
50mA
75mA
0.350
100mA
150mA
0.348
200mA
0.346
0.344
0.342
0.338
0.339
0.340
0.341
0.342
0.343
x
(2600~4000K)
0.403
0.402
75mA
y
Z-Power LED
X10490
Technical
Data
Sheet
5) Chromaticity Coordinate vs. Forward Current, Ta=25℃
50mA
100mA
20mA
0.435
0.436
0.401
150mA
0.400
200mA
0.399
0.433
0.434
x
0.437
0.438
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
1.0
Relative Luminous Intensity
Z-Power LED
X10490
Technical
Data
Sheet
6) Relative Luminous Intensity vs. Junction Temperature, IF=100mA
0.8
0.6
0.4
0.2
0.0
30
45
60
75
90
105
120
O
Ju n ctio n tem pe ratu re Tj( C )
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
(4000~7000K)
0.355
0.350
25
y
0.345
70
0.340
100
125
0.335
0.330
0.325
0.320
0.325
0.330
0.335
0.340
0.345
x
(2600~4000K)
0.404
0.400
25
0.396
70
y
Z-Power LED
X10490
Technical
Data
Sheet
7) Chromaticity Coordinate vs. Junction Temperature
100
0.392
125
0.388
0.384
0.420
0.422
0.424
0.426
0.428
x
0.430
0.432
0.434
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Relative Forward Voltage
1 .0
0 .8
0 .6
0 .4
0 .2
0 .0
30
45
60
75
90
105
120
O
Ju n ctio n te m p era tu re T j( C )
9) Ambient Temperature vs. Maximum Forward Current
250
Forward Current IF [mA]
Z-Power LED
X10490
Technical
Data
Sheet
8) Junction Temperature vs. Relative Forward Voltage
200
150
Rth j-a : 60 ℃/W
100
50
0
-40
-20
0
20
40
60
80
100
O
Ambient Temperature T A [ C]
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
0.44
2700K
2900K
2600K
3000K
3200K
0.42
3500K
3700K
F1
4000K
0.40
4200K
4500K
5000K
D0
0.36
6500K
A1
7000K
C1
C0
5600K
6000K
D3
D2
F3
F2
F5
E3
F4
E2
E5
E4
D5
C3
D4
B1 C2 C5
B0 B3 C4
B2 B5
0.44
2600K
2700K
2900K
3000K
3200K
0.42
H11
G41
G21
G11
CIE Y
G32
A4
G12
0.40
H12
G23
G34
G14
H13
G43
G33
G13
0.30
G42
G22
G44
H14
H24
H23
H34
H31
H21
G31
A0 A3 B4
A2 A5
0.32
H22
H32
H33
H41
H42
H43
H44
G24
0.38
0.42
0.44
0.46
0.48
CIE X
0.28
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
CIE X
0.44
2600K
2700K
2900K
3000K
3200K
0.42
H11
G41
H21
G31
G21
G11
G32
CIE Y
CIE Y
D1
5300K
0.34
E1
E0
4700K
0.38
F0
G42
H12
G22
G12
0.40
G43
G33
G23
G13
G34
G14
0.38
H13
G44
H14
H24
H23
H34
H22
H32
H33
H31
H41
H42
H43
H44
G24
MACADAM 3STEP Rank
0.42
0.44
0.46
CIE X
0.48
SSC--STW8C2SA
SSC
* Apply the Energy Star binning(3200~7000K) & MACADAM 3 Step binning (just, 2600~3200K)
* Measurement Uncertainty of the Color Coordinates : ± 0.007
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
● COLOR RANK
<IF=100mA, Ta=25℃>
A0
A1
A2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3028
0.3304
0.3115
0.3393
0.3041
0.324
0.3041
0.324
0.3126
0.3324
0.3055
0.3177
0.3126
0.3324
0.321
0.3408
0.3136
0.3256
0.3115
0.3393
0.3205
0.3481
0.3126
0.3324
A3
A4
A5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3126
0.3324
0.3055
0.3177
0.3136
0.3256
0.3136
0.3256
0.3068
0.3113
0.3146
0.3187
0.3216
0.3334
0.3146
0.3187
0.3221
0.3261
0.321
0.3408
0.3136
0.3256
0.3216
0.3334
B0
B1
B2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3207
0.3462
0.3292
0.3539
0.3212
0.3389
0.3212
0.3389
0.3293
0.3461
0.3217
0.3316
0.3293
0.3461
0.3373
0.3534
0.3293
0.3384
0.3292
0.3539
0.3376
0.3616
0.3293
0.3461
B3
B4
B5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3293
0.3461
0.3217
0.3316
0.3293
0.3384
0.3293
0.3384
0.3222
0.3243
0.3294
0.3306
0.3369
0.3451
0.3294
0.3306
0.3366
0.3369
0.3373
0.3534
0.3293
0.3384
0.3369
0.3451
SSC--STW8C2SA
SSC
Jan 2013
* Measurement Uncertainty of the Color Coordinates : ± 0.007
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
● COLOR RANK
<IF=100mA, Ta=25℃>
C0
C1
C2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3376
0.3616
0.3463
0.3687
0.3373
0.3534
0.3373
0.3534
0.3456
0.3601
0.3369
0.3451
0.3456
0.3601
0.3539
0.3669
0.3448
0.3514
0.3463
0.3687
0.3552
0.376
0.3456
0.3601
C3
C4
C5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3456
0.3601
0.3369
0.3451
0.3448
0.3514
0.3448
0.3514
0.3366
0.3369
0.344
0.3428
0.3526
0.3578
0.344
0.3428
0.3514
0.3487
0.3539
0.3669
0.3448
0.3514
0.3526
0.3578
D0
D1
D2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3548
0.3736
0.3641
0.3804
0.3536
0.3646
0.3536
0.3646
0.3625
0.3711
0.3523
0.3555
0.3625
0.3711
0.3714
0.3775
0.3608
0.3616
0.3641
0.3804
0.3736
0.3874
0.3625
0.3711
D3
D4
D5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3625
0.3711
0.3523
0.3555
0.3608
0.3616
0.3608
0.3616
0.3511
0.3465
0.359
0.3521
0.3692
0.3677
0.359
0.3521
0.367
0.3578
0.3714
0.3775
0.3608
0.3616
0.3692
0.3677
SSC--STW8C2SA
SSC
Jan 2013
* Measurement Uncertainty of the Color Coordinates : ± 0.007
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
● COLOR RANK
<IF=100mA, Ta=25℃>
E0
E1
E2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3736
0.3874
0.3869
0.3958
0.3714
0.3775
0.3714
0.3775
0.3842
0.3855
0.3692
0.3677
0.3842
0.3855
0.397
0.3935
0.3813
0.3751
0.3869
0.3958
0.4006
0.4044
0.3842
0.3855
E3
E4
E5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3842
0.3855
0.3692
0.3677
0.3813
0.3751
0.3813
0.3751
0.367
0.3578
0.3783
0.3646
0.3934
0.3825
0.3783
0.3646
0.3898
0.3716
0.397
0.3935
0.3813
0.3751
0.3934
0.3825
F0
F1
F2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3996
0.4015
0.4146
0.4089
0.396
0.3907
0.396
0.3907
0.4104
0.3978
0.3925
0.3798
0.4104
0.3978
0.4248
0.4048
0.4062
0.3865
0.4146
0.4089
0.4299
0.4165
0.4104
0.3978
F3
F4
F5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4104
0.3978
0.3925
0.3798
0.4062
0.3865
0.4062
0.3865
0.3889
0.369
0.4017
0.3751
0.4198
0.3931
0.4017
0.3751
0.4147
0.3814
0.4248
0.4048
0.4062
0.3865
0.4198
0.3931
SSC--STW8C2SA
SSC
Jan 2013
* Measurement Uncertainty of the Color Coordinates : ± 0.007
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
● COLOR RANK
<IF=100mA, Ta=25℃>
G11
G21
G31
G41
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4365
0.4189
0.4430
0.4212
0.4496
0.4236
0.4562
0.4260
0.4324
0.4100
0.4387
0.4122
0.4451
0.4145
0.4515
0.4168
0.4261
0.4077
0.4324
0.4100
0.4387
0.4122
0.4451
0.4145
0.4299
0.4165
0.4365
0.4189
0.4430
0.4212
0.4496
0.4236
G12
G22
G32
G42
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4324
0.4100
0.4387
0.4122
0.4451
0.4145
0.4515
0.4168
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
0.4468
0.4077
0.4223
0.3990
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
0.4261
0.4077
0.4324
0.4100
0.4387
0.4122
0.4451
0.4145
G13
G23
G33
G43
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
0.4468
0.4077
0.4243
0.3922
0.4302
0.3943
0.4361
0.3964
0.4420
0.3985
0.4185
0.3902
0.4243
0.3922
0.4302
0.3943
0.4361
0.3964
0.4223
0.3990
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
G14
G24
G34
G44
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4243
0.3922
0.4302
0.3943
0.4361
0.3964
0.4316
0.3873
0.4203
0.3834
0.4259
0.3853
0.4259
0.3853
0.4302
0.3943
0.4147
0.3814
0.4203
0.3834
0.4420
0.3985
0.4373
0.3893
0.4185
0.3902
0.4243
0.3922
0.4316
0.3873
0.4361
0.3964
SSC--STW8C2SA
SSC
Jan 2013
* Measurement Uncertainty of the Color Coordinates : ± 0.007
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
● COLOR RANK
<IF=100mA, Ta=25℃>
H11
H21
H31
H41
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4325
0.4275
0.4687
0.4289
0.4750
0.4304
0.4810
0.4319
0.4575
0.4182
0.4636
0.4197
0.4697
0.4211
0.4758
0.4225
0.4515
0.4168
0.4575
0.4182
0.4636
0.4197
0.4697
0.4211
0.4562
0.4260
0.4625
0.4275
0.4687
0.4289
0.4750
0.4304
H12
H22
H32
H42
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4575
0.4182
0.4636
0.4197
0.4697
0.4211
0.4758
0.4225
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
0.4703
0.4132
0.4468
0.4077
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
0.4515
0.4168
0.4575
0.4182
0.4636
0.4197
0.4697
0.4211
H13
H23
H33
H43
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
0.4703
0.4132
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
0.4648
0.4038
0.4420
0.3985
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
0.4468
0.4077
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
H14
H24
H34
H44
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
0.4648
0.4038
0.4428
0.3906
0.4483
0.3919
0.4538
0.3932
0.4593
0.3944
0.4373
0.3893
0.4428
0.3906
0.4483
0.3919
0.4538
0.3932
0.4420
0.3985
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
SSC--STW8C2SA
SSC
Jan 2013
* Measurement Uncertainty of the Color Coordinates : ± 0.007
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
6. Bin Code Description
Bin Code
Luminous Intensity [cd]
Color Rank
Forward Voltage [V]
K21
C3
Z62
Color Rank
@ IF = 100mA
Luminous Intensity [cd] *[1]
@ IF = 100mA
RANK
Min.
Max.
J17
17
19.5
J19
19.5
21.5
K21
21.5
24
K24
24
27.5
Forward Voltage [V]
@ IF =100mA
A~H
RANK
Min.
Max.
Z58
5.8
6.0
Z60
6.0
6.2
Z62
6.2
6.4
Z64
6.4
6.6
Z66
6.6
6.8
CCT
CIE
IV Rank
3200~7000K
A-F
J17
J19
K21
K24
2600~3200K
G-H
J17
J19
K21
K24
IV rank
Flux rank **
RANK
Min.
Max.
RANK
Min.
Max.
J17
17
19.5
J17
52.7
60.5
J19
19.5
21.5
J19
60.5
66.7
K21
21.5
24
K21
66.7
74.4
K24
24
27.5
K24
74.4
85.3
Available ranks
Not yet available ranks
*Notes :
All measurements were made under the standardized environment of SSC.
In order to ensure availability, single color rank will not be orderable.
[1] SSC sort the LED package according to the luminous intensity IV.
** The lumen table is only for reference.
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
7. Labeling
X9X10X11X12X13X14X15X16X17
xxxx
STW8C2SA
SEOUL SEMICONDUCTOR CO..
Rank
X9X10X11X12X13X14X15X16X17
- X9X10X11 : Luminous Intensity : IV [cd]
- X12X13X14 : Color coordinates : x, y
(3200K~7000K : 2 Digits except X14)
- X15X16X17 : Forward Voltage : VF [V]
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
8. Packing
Reel
X9X10X11X12X13X14X15X16X17
xxxx
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
STW8Q2SA
STW8C2SA
SEOUL
SEMICONDUCTOR
SEOUL
SEMICONDUCTOR
CO.,CO..
LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
X9X10X11X12X13X14X15X16X17
xxxx
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
STW8Q2SA
STW8C2SA
SEOUL
SEMICONDUCTOR
CO.,CO..
LTD.
SEOUL
SEMICONDUCTOR
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
a
c
b
245 220 102
7inch
245 220 142
TYPE
1 SIDE
c
X9X
X10X
X11X
X12X
X13X
X14X
X15X
X16X
X17
X
9 10
11 12
13 14
15 16
17
xxxx
xxxx
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
STW8Q2SA
STW8C2SA
STW8Q2SA
b
PART NUMBER :
SEOUL SEMICONDUCTOR CO..
SEOUL
SEMICONDUCTOR
SEOUL
SEMICONDUCTOR
CO.,CO..
LTD.
a
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
8. Packing
( Tolerance: ±0.2, Unit: mm )
1)Quantity : Max 4,500pcs/Reel (2000 ~ 4500pcs by 500pcs provided)
2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10˚ to the carrier tape.
4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package.
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
9. Recommended solder pad
Notes :
[1]
[2]
[3]
[4]
All dimensions are in millimeters.
Scale : none
Recommended Solder Thickness : 0.15 mm
Undefined tolerance is ±0.2mm
This drawing without tolerances are for reference only.
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
10. Soldering
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
* Caution
1. Reflow soldering is recommended not to be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be
damaged.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
25
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
11. Precaution for use
(1) Storage
To avoid the moisture penetration, we recommend store in a dry box
with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum
humidity of RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens
may affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week(MSL_2a) or the color of the
desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products
are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and
etc. When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring
the package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months
or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should
be used for storage.
(11) The appearance and specifications of the product may be modified for improvement
without notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of
fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and
photonic energy. The result can be a significant loss of light output from the fixture.
Knowledge of the properties of the materials selected to be used in the construction of fixtures
can help prevent these issues.
SSC--STW8C2SA
SSC
(14)Attaching LEDs, do not use adhesives that outgas organic vapor.
Jan 2013
(15)The driving circuit must be designed to allow forward voltage only when it is ON or OFF.
www.seoulsemicon.com
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
12. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form of
the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions
must be considered during the handling of such devices. Compared to standard encapsulants,
silicone is generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution
must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured
that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this.
product with acid or sulfur material in sealed space.
SSC--STW8C2SA
SSC
Jan 2013
www.seoulsemicon.com
SSC-QP-7-07-12 (Rev.01)