APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet RoHS Specification SSC-SAW8P42A REV.00 May 2012 1 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet SAW8P42A SAW8P42A Features Description This surface-mount LED comes in standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector Cavity and the cavity is encapsulated by silicone. 사진 • Suitable for all SMT assembly methods; Suitable for all soldering • Lead Free product • RoHS compliant The package design coupled with careful selection of component materials allow these products to perform with high reliability. Applications • Interior lighting • General lighting • Indoor and door displays • Architectural/ Decorative lighting REV.00 May 2012 2 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Contents 1. Outline dimensions 2. Characteristics of SAW8P42A LED 3. Characteristic diagrams 4. Color & Binning 5. Bin Code Description 6. Labeling 7. Packing 8. Recommended solder pad 9. Soldering 10. Precaution for use 11. Handling of Silicone Resin LEDs REV.00 May 2012 3 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 1. Outline dimensions Anod e Cathod e Slug (Anode) Circuit Diagram Cathode 1 Anode 2 ESD Protection Device Notes : [1] All dimensions are in millimeters. [2] Scale : none [3] Undefined tolerance is ±0.1mm REV.00 May 2012 4 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 2. Characteristics of SAW8P42A (Ta=25℃) Electro-Optical characteristics Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage* VF IF=20mA 11.8 13.0 14.2 V Reverse Voltage VR IR=5mA - 0.7 1.2 V IV IF=20mA 8.5 (26.4) 9.7 (30.1) 10.5 (32.5) Cd (lm) CCT IF=20mA 3,700 - 7,000 K 2Θ ½ IF=20mA Ra IF=20mA 80 83 90 - 1.5kΩ;100 pF 5 - - KV IF=20mA - 20 - K/W Luminous Intensity (3700~7000K) [1] Color Correlated Temperature Viewing Angle [2] Color Rendering Index* ESD (HBM) Thermal resistance [3] RθJ-S 115 deg. [1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. [2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [3] Thermal resistance: RthJS (Junction / solder) * Tolerance : VF :±0.4V, IV :±7%, Ra :±2, x,y :±0.01 [Note] All measurements were made under the standardized environment of SSC. Absolute Maximum Ratings Parameter Symbol Value Unit Power Dissipation *[1] Pd 0.43 W Forward Current IF 30 mA Operating Temperature Topr -30~+85 ℃ Storage Temperature Tstg -40~+100 ℃ Junction Temperature Tj 125 ℃ [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. * LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. REV.00 May 2012 5 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 3. Characteristic diagrams Color Spectrum, Ta=25oC 1. Cool white 4700 K~7000 K 2. Neutral white 3700 K~4700 K 1.2 4700~7000K 3700~4700K Relative Spectral Power Distribution [a.u.] 1.0 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength [nm] REV.00 May 2012 6 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Current – Voltage characteristics, Ta=25oC 50 Forward current [mA] 40 30 20 10 0 0 5 10 15 Forward Votage [V] Forward Current–Relative Luminous Intensity characteristics, Ta=25oC Relative Luminous Intensity [%] 200 150 100 50 00 10 20 30 Forward Current [mA] 40 50 REV.00 May 2012 7 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Forward Voltage Shift - Junction Temperature characteristics, IF=20mA Relative Forward Voltage 1.0 0.8 0.6 0.4 0.2 0.0 30 45 60 75 90 105 120 O Ju n c tio n tem p era tu re Tj( C ) Relative Light Output - Junction Temperature characteristics , IF=20mA Relative Light Output 1.0 0.8 0.6 0.4 0.2 0.0 30 45 60 75 90 105 O Junction tem pera tu re Tj( C ) 120 REV.00 May 2012 8 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Viewing Angle Characteristics, IF=20mA Relative Luminous Intensity [a.u.] 1.0 0.8 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 60 90 Angle [degree] Forward Current -Chromaticity Coordinate characteristics, Ta=25℃ 0.370 0.368 5mA 0.366 y 10mA 15mA 0.364 20mA 0.362 0.360 0.3660 0.3665 0.3670 0.3675 0.3680 x 9 0.3685 0.3690 0.3695 0.3700 REV.00 May 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 0.3550 0.3525 0.3500 25 0.3475 y Z-Power LED X10490 Technical Data Sheet Junction Temperature (℃) - Chromaticity Coordinate characteristics 50 0.3450 80 0.3425 100 120 0.3400 0.3375 0.3500 0.3525 0.3550 0.3575 0.3600 0.3625 0.3650 x REV.00 May 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 4. Color & binning 1. SAW8P42A 0.42 Cool W hite Neutral W hite 3700K 0.40 E1 4200K E0 4700K 0.38 D1 CIE y D0 C1 5300K 0.36 0.34 C0 E2 E5 E4 D5 D4 B1 C2 6000K C5 B0 B3 C4 A1 B2 B5 7000K A0 A3 B4 A2 A5 0.32 0.30 0.28 D2 C3 D3 E3 A4 0.30 0.32 0.34 0.36 0.38 0.40 0.42 CIE x REV.00 May 2012 11 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet ● COLOR RANK <IF=20mA, Ta=25℃> 6500~7000K A0 A2 A4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3028 0.3304 0.3041 0.324 0.3055 0.3177 0.3041 0.324 0.3055 0.3177 0.3068 0.3113 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 6000~6500K A1 A3 A5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.321 0.3408 0.3216 0.3334 0.3221 0.3261 0.3205 0.3481 0.321 0.3408 0.3216 0.3334 5600~6000K B0 B2 B4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3207 0.3462 0.3212 0.3389 0.3217 0.3316 0.3212 0.3389 0.3217 0.3316 0.3222 0.3243 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 5300~5600K B1 B3 B5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 REV.00 * Measurement Uncertainty of the Color Coordinates : ± 0.01 May 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet ● COLOR RANK <IF=20mA, Ta=25℃> 5000~5300K C0 C2 C4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 4700~5000K C1 C3 C5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3539 0.3669 0.3526 0.3578 0.3514 0.3487 0.3552 0.376 0.3539 0.3669 0.3526 0.3578 4500~4700K D0 D2 D4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3548 0.3736 0.3536 0.3646 0.3523 0.3555 0.3536 0.3646 0.3523 0.3555 0.3511 0.3465 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 4200~4500K D1 D3 D5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.3736 0.3874 0.3714 0.3775 0.3692 0.3677 REV.00 * Measurement Uncertainty of the Color Coordinates : ± 0.01 May 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet ● COLOR RANK <IF=20mA, Ta=25℃> 4000~4200K E0 E2 E4 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3736 0.3874 0.3714 0.3775 0.3692 0.3677 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.3869 0.3958 0.3842 0.3855 0.3813 0.3751 3700~4000K E1 E3 E5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3869 0.3958 0.3842 0.3855 0.3813 0.3751 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.397 0.3935 0.3934 0.3825 0.3898 0.3716 0.4006 0.4044 0.397 0.3935 0.3934 0.3825 REV.00 * Measurement Uncertainty of the Color Coordinates : ± 0.01 May 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 5. Bin code description 1. Luminous Intensity Bins - Luminous Intensity bin structure for Cool white, neutral white, warm white · Example BIN CODE : R5C2B Luminous Intensity bin *[note] Flux (lm) Bin Code Luminous Intensity [cd] R5 8.5~9.0 26.4~27.9 S0 9.0~9.5 27.9~29.5 S5 9.5~10.0 29.5~31.0 T0 10.0~10.5 31.0~32.6 [Note] SSC sort the LED package according to the luminous intensity IV. (The lumen table is only for reference.) 2. Color Rank white product tested and binned by x,y coordinates and CC · Example BIN CODE : R5C2B [Note] Color bin Color Rank @ IF = 20mA 3. Voltage Bins · Example BIN CODE : R5C2B Voltage bin Bin Code Min. Max. A 11.8 12.4 B 12.4 13.0 C 13.0 13.6 D 13.6 14.2 [Note] Forward Voltage (V) @ IF = 20mA REV.00 May 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 6. Labeling 1,500 SAW8P42A REV.00 May 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 7. Packing Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX RoHS PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. b a REV.00 May 2012 17 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Cathode mark [ Tolerance: ±0.2, Unit: mm ] Notes : [1] Quantity : 1,500pcs/Reel [2] Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm [3] Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape REV.00 [4] Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 18 May 2012 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 8. Recommended solder pad 1. Solder pad Notes : [1] All dimensions are in millimeters. [2] Scale : none [3] This drawing without tolerances are for reference only REV.00 May 2012 19 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 9. Soldering IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. * Caution 1. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. REV.00 May 2012 20 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 10. Precaution for use (1) Storage To avoid the moisture penetration, we recommend storing SSC LEDs in a dry box with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures REV.00 can help prevent these issues. May 2012 21 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 11. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 22 (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not REV.00 handle this product with acid or sulfur material in sealed space. May 2012 (7) Avoid leaving fingerprints on silicone resin parts. www.seoulsemicon.com 서식번호 : SSC-QP-7-07-12 (Rev.01)