SEOUL SZM04A0A

Z-Power LED
X10490
Technical
Data
Sheet
SZM04A0A
Specification
Features
• Super high Flux output
and high Luminance
• Designed for high
current operation
• SMT solderable
• Lead Free product
• RoHS compliant
Description
The Z-Power series is designed for high current operation and
high flux output applications.
It incorporates state of the art SMD design and low thermal
resistant material.
Applications
The Z Power LED is ideal light sources for general illumination
applications, custom designed solutions and a high
luminous efficacy.
• General Luminaries
• Bulb
• Fixture
* The appearance and specifications of the product can be changed
for improvement without notice.
Rev. 00
January. 2012
1
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서식번호 : SSC- QP- 7- 07- 25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
[ Contents ]
1.
Description
------- 1
2.
Full code of Z4 series
------- 3
3.
Outline demensions
------- 4
4.
Characteristics of Z4 LED
------- 5
5.
Characteristic diagrams
------- 6
4.
Labeling
------ 13
5.
Reel packing
------ 16
6.
Recommended solder pad
------ 17
7.
Soldering profile
------ 18
8.
Precaution for use
------ 19
9.
Revision history
------ 21
Rev. 00
January. 2012
2
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Z-Power LED
X10490
Technical
Data
Sheet
Part Number of Z4 MINT (SZM04A0A)
1. Part Number Form : X1X2X3X4X5X6X7X8 – X9X10X11X12X13
X1
Company
S
SSC
X2
Package series
Z
Z-Power
M
X3
Color
X4
Mint White
0
X5
Z-Power series number
4
Z4 series
X6
Lens type
A
Dome type
X7
PCB type
0
Emitter
X8
Revision No.
A
Rev0
X9X10
Brightness bin
-
-
X11X12
Color bin
-
-
X13
VF bin
-
-
2. Sticker Diagram on Reel & Aluminum Vinyl Bag
X9X10X11X12X13
RANK :
QUANTITY : 500
LOT NUMBER : XXXXXXXXXX-XXX-XXX-XXXXXXX
SSC PART NUMBER : X1X2X3X4X5X6X7X8
X1X2X3X4X5X6X7X8
Rev. 00
January. 2012
3
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Z-Power LED
X10490
Technical
Data
Sheet
Outline dimensions
Top View
Side View
Bottom View
Circuit
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] Undefined tolerance is ± 0.20mm
Rev. 00
January. 2012
4
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Z-Power LED
X10490
Technical
Data
Sheet
Characteristics of Z4 (SZM04A0A)
Mint white
1. Electro-Optical characteristics at 350mA
Value
Parameter
Luminous Flux
Symbol
[1]
Correlated Color Temperature
[3]
Typ
ФV [2]
120
140
CCT
-
4400
-
K
Ra
-
57
-
-
VF
-
3.3
3.5
V
CRI
Forward Voltage
[4]
Thermal resistance (J to S)
View Angle
Unit
Min
Max
lm
RθJ-S
9.9
K /W
Θ½
130
deg.
2
2. Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
500
mA
Power Dissipation
Pd
2.0
W
Junction Temperature
Tj
125(@ IF ≤ 500mA)
ºC
Operating Temperature
Topr
-40 ~ +100
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
-
± 6,000V HBM
-
ESD Sensitivity
[5]
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] V is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tolerance.
[4] Tolerance is ±0.06V on forward voltage measurements
[5] A zener diode is included to protect the product from ESD.
Ф
Rev. 00
January. 2012
5
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Z-Power LED
X10490
Technical
Data
Sheet
Color Spectrum TA=25℃
℃
Relative Radiant Power [a.u.]
1.2
SZM04A0A
Standard eye response curve
1.0
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
wavelength [nm]
* The height of the Blue leak depends on CIE x and y.
It would be higher than the graph above if the CIE x and y is lower.
Rev. 00
January. 2012
6
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Z-Power LED
X10490
Technical
Data
Sheet
Forward Current Characteristics
℃
Forward Voltage vs. Forward Current, Ta=25
0.50
Average Forward Current [A]
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Forward Voltage [V]
Normalized Relative Luminous Flux vs. Forward Current, Ta=25
℃
Relative Luminous Flux
2.0
1.6
1.2
0.8
0.4
0.0
100
150
200
250
300
350
400
450
500
Forward Current(mA)
Rev. 00
January. 2012
7
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Z-Power LED
X10490
Technical
Data
Sheet
Forward Current Characteristics
℃
CCT vs. Forward Current, Ta=25
4500
CCT[K]
4400
4300
4200
4100
4000
100
150
200
250
300
350
400
450
500
Forward Current[mA]
Rev. 00
January. 2012
8
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Z-Power LED
X10490
Technical
Data
Sheet
Junction Temperature Characteristics
Relative Light Output vs. Junction Temperature at IF=350mA
120
Relative Luminous Flux [%]
100
80
60
40
20
0
25
50
75
℃
100
125
Junction Temperature [? ]
Forward Voltage Shift vs. Junction Temperature at IF =350mA
Foward Voltage Variaton [V]
0.1
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
25
50
75
100
125
o
Junction temperature [ C]
Rev. 00
January. 2012
9
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Z-Power LED
X10490
Technical
Data
Sheet
Junction Temperature Characteristics
Color Coordinate Shift vs Junction Temperature at IF=350mA
0.50
CIE Y
0.49
25C
40C
60C
0.48
80C
100C
125C
0.47
0.46
0.37
0.38
0.39
0.40
CIE X
CCT vs. Junction Temperature at IF=350mA
4600
CCT[K]
4500
4400
4300
4200
4100
25
50
75
100
125
o
Junction Temperature[ C]
Rev. 00
January. 2012
10
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Z-Power LED
X10490
Technical
Data
Sheet
Radiation pattern
0
1.0
30
Relative intensity
0.8
0.6
60
0.4
0.2
0.0
-80
-60
-40
-20
0
90
Angle [deg.]
Rev. 00
January. 2012
11
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Z-Power LED
X10490
Technical
Data
Sheet
Maximum Forward Current vs. Ambient Temperature
600
Current [mA]
500
400
300
o
RjaT = 25 C/W
200
o
RjaT = 35 C/W
o
100
0
0
RjaT = 45 C/W
25
50
75
100
125
o
Ambient Temperature [ C]
500
Current [mA]
400
300
o
RjaT = 25 C/W
200
o
RjaT = 35 C/W
o
RjaT = 45 C/W
100
0
0
25
50
75
100
125
o
Ambient Temperature [ C]
Rev. 00
January. 2012
12
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Z-Power LED
X10490
Technical
Data
Sheet
Label
X9X10X11X12X13
RANK :
QUANTITY : 500
LOT NUMBER : XXXXXXXXXX-XXX-XXX-XXXXXXX
SSC PART NUMBER : X1X2X3X4X5X6X7X8
X1X2X3X4X5X6X7X8
Full code form (SZWW4A0A)
1. Part Number Form : X1X2X3X4X5X6X7X8 – X9X10X11X12X13
X1
Company
S
SSC
X2
Package series
Z
Z-Power
X3
M
Color
X4
Mint White
0
X5
Z-Power series number
4
Z4 series
X6
Lens type
A
Dome type
X7
PCB type
0
Emitter
X8
Revision No.
A
Rev0
X9X10
Brightness bin
-
-
X11X12
Color bin
-
-
X13
VF bin
-
-
Rev. 00
January. 2012
13
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Z-Power LED
X10490
Technical
Data
Sheet
Binning Structure
IF=350mA, Ta=25
℃
CIE x
0.3422
0.3500
0.4006
0.3924
0.3422
0.3500
0.3578
0.4088
0.4006
0.3500
0.3578
0.3734
0.4248
0.4088
0.3578
M1
M2
M3
CIE y
0.4849
0.5020
0.4740
0.4604
0.4849
0.5020
0.5191
0.4875
0.4740
0.5020
0.5191
0.5532
0.5141
0.4875
0.5191
0.56
Mint white
0.54
M3
y
0.52
M2
0.50
M1
0.48
0.46
0.44
0.32
0.34
0.36
0.38
0.40
0.42
0.44
x
Tolerance
CCT : ±5% of value
Rev. 00
January. 2012
14
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Z-Power LED
X10490
Technical
Data
Sheet
Luminous Flux Bins
Bin Code
Luminous Flux [lm]
V1
118.5 ~ 130.0
V2
130.0 ~ 140.0
V3
140.0 ~ 154.0
W1
154.0 ~ 177.0
The list explains the photometric luminous flux bins for Z-Power LED. Z-Power LED are
tested and binned by photometric luminous flux. Not all bins are available in all colors.
Tolerance : ±10% of Luminous flux value
Forward voltage Bins
Bin Code
Forward Voltage [V]
H
3.00 ~ 3.25
I
3.25 ~ 3.50
Tolerance : ±0.06V
Rev. 00
January. 2012
www.seoulsemicon.com
Z-Power LED
X10490
Technical
Data
Sheet
Emitter Carrier & Reel Packaging
CATHODE MARK
22
13
Rev. 00
January. 2012
16
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Z-Power LED
X10490
Technical
Data
Sheet
Recommended solder pad
Temperature
check point
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] This drawing without tolerances are for reference only
Rev. 00
January. 2012
17
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Z-Power LED
X10490
Technical
Data
Sheet
Reflow Soldering Conditions / Profile
[°C]
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
260
240
220
200
Pre-heating
Rising
5 °C/sec
Cooling
-5 °C/sec
~
180
150
0
Time
[ Hr]
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
Rev. 00
January. 2012
18
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Z-Power LED
X10490
Technical
Data
Sheet
Precaution for use
• Storage
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box
with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum
humidity of 50%.
• Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Soldering should be done immediately after opening the package (within 24Hrs).
b. Required conditions after opening the package
- Sealing
- Temperature : 5 ~ 40
℃
Humidity : less than 30%
c. If the package has been opened more than 1 week or the color of the desiccant changes,
±℃
components should be dried for 10-12hr at 60 5
• Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
• Do not rapidly cool device after soldering.
• Components should not be mounted on warped (non coplanar) portion of PCB.
• Radioactive exposure is not considered for the products listed here in.
• Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed of.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
• When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
• LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used
for storage.
• The appearance and specifications of the product may be modified for improvement without
notice.
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
• The slug is isolated.
• Attaching LEDs, do not use adhesives that outgas organic vapor.
Rev. 00
January. 2012
19
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Z-Power LED
X10490
Technical
Data
Sheet
Handling of Silicone resin LEDs
The Z-Power LED is encapsulated with a silicone resin for the highest flux efficiency.
Notes for handling:
• Avoid touching silicone resin parts especially with sharp tools such as Pincette
(Tweezers)
• Avoid leaving fingerprints on silicone resin parts.
• Silicone resin will attract dust so use covered containers for storage.
• When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that excessive mechanical
pressure on the surface of the resin must be prevented.
• It is not recommend to cover the silicone resin of the LEDs with other resin
(epoxy, urethane, etc)
Rev. 00
January. 2012
20
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Z-Power LED
X10490
Technical
Data
Sheet
Revision Profile
No
Change Date
Change Issue
Version
1
2012.01.26
Initial Specification
Rev.00
Rev. 00
January. 2012
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