Z-Power LED X10490 Technical Data Sheet X92050C X92050C Description Features Z-Power series is designed for high • current operation and high flux Super high Flux output and high Luminance Designed for high current operation Low thermal resistance SMT solderbility Lead Free product RoHS compliant • output applications. Furthermore, • • • • its thermal Management characteristic is better than other LED Solutions. By package SMD design and good thermal emission material. According to these advantages, it enables to apply various lighting applications and design solution, Automotive lighting, and large size LCD backlight etc. Applications • • • • • • • • • • • • • Mobile phone flash Automotive interior / exterior lighting Automotive signal lighting Automotive forward lighting General Torch Architectural lighting LCD TV / Monitor Backlight Projector light source Traffic signals Task lighting Decorative / Pathway lighting Remote / Solar powered lighting Household appliances *The appearance and specifications of the product may be changed for improvement without notice. Rev. 04 May 2010 1 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Full Code of Z-Power LED Series Full code form : X1 X2 X3 X4 X5 X6 X7– X8 X9 – X10 X11 X12 X13 X14 1. Part Number - X1 : Color - X2 : Z-Power LED series number - X3 : LENS type - X4 : Chip quantity or Watt - X5 : Package outline size - X6 : Type of PCB - X7 : Grade of characteristic code 2. Internal Number - X8 - X9 3. Code Labeling - X10 : Luminous flux (or Radiant flux for royal blue) - X11 X12 X13 : Dominant wavelength (or x, y coordinates rank code) - X14 : Forward voltage 4. Sticker Diagram on Reel & Aluminum Vinyl Bag PART NO. : X1 X2 X3 X4 X5 X6 X7 – X8 X9 QUANTITY : # # # LOT NUMBER : # X #10# X#11#X#12#X#13#X#14 BIN CODE : For more information about binning and labeling, refer to the Application Note -1 Rev. 04 May 2010 2 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Outline Dimension Lens Body Lead 0 0 Cathode mark Slug Notes : Notes : 1. All dimensions are in millimeters. ( Lens tolerance : +0.25 Package tolerance : ± 0.2 ) 2. Scale : none 3. Slug of package is connected to anode. Rev. 04 May 2010 3 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Characteristics for Z-Power LED 1. Pure White (W92050C) 1-1 Electro-Optical characteristics at IF=150mA, TA=25ºC Value Parameter Luminous Flux Symbol [1] Correlated Color Temperature [3] Typ Max ФV [2] - 28 - lm CCT - 6300 - K Ra - 70 - - VF - 3.65 - V CRI Forward Voltage Unit Min [4] 2 Θ½ typ. 130 deg. Rθ 23 ºC /W Parameter Symbol Value Unit Forward Current IF 0.2 A Power Dissipation PD 0.8 W Junction Temperature Tj 125 ºC Operating Temperature Topr -40 ~ +85 ºC Storage Temperature Tstg -40 ~ +120 ºC - ± 15,000V HBM - View Angle Thermal resistance [5] 1-2 Absolute Maximum Ratings ESD Sensitivity [6] *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrating sphere. [3] CCT ±5% tester tolerance [4] A tolerance of ±0.06V on forward voltage measurements [5] Rθ is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC) Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. Ф * Caution 1. Please do not drive at rated current more than 5 sec. without proper heat sink Rev. 04 May 2010 4 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Characteristics for Z-Power LED 2. Warm White (N92050C) 2-1 Electro-Optical characteristics at IF=150mA, TA=25ºC Value Parameter Luminous Flux Symbol [1] Correlated Color Temperature [3] Typ Max ФV [2] - 15 - lm CCT - 3000 - K Ra - 80 - - VF - 3.65 - V CRI Forward Voltage [4] View Angle Unit Min 2 Θ½ typ. 120 deg. Rθ 23 ºC /W Parameter Symbol Value Unit Forward Current IF 0.2 A Power Dissipation PD 0.8 W Junction Temperature Tj 125 ºC Operating Temperature Topr -40 ~ +85 ºC Storage Temperature Tstg -40 ~ +120 ºC - ± 15,000V HBM - Thermal resistance [5] 2-2 Absolute Maximum Ratings ESD Sensitivity [6] *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrating sphere. [3] CCT ±5% tester tolerance [4] A tolerance of ±0.06V on forward voltage measurements [5] Rθ is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC) Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. Ф * Caution 1. Please do not drive at rated current more than 5 sec. without proper heat sink Rev. 04 May 2010 5 www.seoulsemicon.com 1. Pure White 1.0 Standard eye response curve Relative Spectral Power Distribution 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 700 800 Wavelength (nm) 2. Warm White 1.0 0.8 Relative Spectral Power Distribution Z-Power LED X10490 Technical Data Sheet Color Spectrum 0.6 0.4 0.2 0.0 300 400 500 600 Wavelength (nm) Rev. 04 May 2010 6 www.seoulsemicon.com Relative Light Output vs. Junction Temperature at IF=150mA 120 Relative Light Output [%] Z-Power LED X10490 Technical Data Sheet Light Output Characteristics White 100 80 60 40 20 0 25 50 75 100 125 o Junction Temperature, TJ [ C] Rev. 04 May 2010 7 www.seoulsemicon.com 1. Forward Voltage vs. Forward Current 200 Average Forward Current [mA] White 150 100 50 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Forward Voltage [V] 2. Forward Current vs. Normalized Relative Luminous Flux White 1.4 Relative LuminousFlux(a.U) Z-Power LED X10490 Technical Data Sheet Forward Current Characteristics 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 50 100 150 200 Forward Current(mA) Rev. 04 May 2010 8 www.seoulsemicon.com 1. White (T JMAX = 125 ℃, @150mA) 200 150 Current [mA] Z-Power LED X10490 Technical Data Sheet Ambient Temperature vs Allowable Forward Current 100 o RjaT = 70 C/W o RjaT = 50 C/W o RjaT = 30 C/W 50 0 0 25 50 75 100 125 150 o Ambient Temperature [ C] Rev. 04 May 2010 9 www.seoulsemicon.com 1. Pure White 0 1.0 30 Relative luminous flux 0.8 0.6 60 0.4 0.2 90 0.0 -80 -60 -40 -20 0 Angle(deg.) 2. Warm White 0 1.0 30 0.8 Relative luminous flux Z-Power LED X10490 Technical Data Sheet Typical Dome Type Radiation pattern 0.6 60 0.4 0.2 0.0 -80 -60 -40 -20 0 90 Angle(deg.) Rev. 04 May 2010 10 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Recommended Solder Pad 1. Solder pad 3 solder point PCB Silk (t=15um) Copper <Footprint & Solder pad> <Rear view> 2. Solder paste pattern Paste thickness : 0.2mm Note : 1. All dimensions are in millimeters (tolerance : ± 0.2 ) 2. Scale none 3. This drawing without tolerances are for reference only Rev. 04 May 2010 11 www.seoulsemicon.com [°C] Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 260 240 220 200 180 Pre-heating Cooling -5 °C/sec Rising 5 °C/sec ~ Z-Power LED X10490 Technical Data Sheet 3. Reflow Soldering Conditions / Profile 150 0 Time [ Hr] 4. Hand Soldering conditions ℃ Lead : Not more than 3 seconds @MAX280 Slug : Use a thermal-adhesives * Caution 1. Reflow soldering should not be done more than one time. 2. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, suitable tools have to be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 6. Recommend to use a convection type reflow machine with 7 ~ 8 zones. Rev. 04 May 2010 12 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Emitter Type Reel Packaging 0 8 0 6 0 4 0 2 6 60 PS E I AJ R R M 1 6 D MARK Note : 1. The number of loaded products in the reel is 1000ea 2. All dimensions are in millimeters (tolerance : ± 0.2 ) 3. Scale none *The appearance and specifications of the product may be changed for improvement without notice. Rev. 04 May 2010 13 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Precaution for use • Storage Avoid the absorption of moisture, we recommended to store Z Power LEDs in a dry box (or desiccator) with a desiccant . Otherwise, store them in the following environment: Temperature : 5 ~30 Humidity : 50% max. • Precaution after opening packaging However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. Soldering should be done right after opening the package(within 24Hrs). b. Keeping of a fraction - Sealing - Temperature : 5 ~ 40 Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, components should be dried for 10-12hr at 60 5 • Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. • Avoid quick cooling • Components should not be mounted on warped direction of PCB. • Anti radioactive ray design is not considered for the products listed here in. • Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. • This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA(Isopropyl Alcohol) should be used. • When the LEDs are illuminating, operating current should be decided after considering the package maximum temperature. • LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. • The appearance and specifications of the product may be modified for improvement without notice. • Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. • Slug polarity is anode. ℃ ℃ ℃ ±℃ Rev. 04 May 2010 14 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Handling of Silicone resin LEDs Z-Power LED is encapsulated by silicone resin for the highest flux efficiency. Notes for handling of Silicone resin Z-Power LEDs • Avoid touching silicone resin parts especially by sharp tools such as pincette (Tweezers) • Avoid leaving fingerprints on silicone resin parts. • Dust sensitivity silicone resin need containers having cover for storage. • When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevent. • Please do not force over 3000 gf impact or pressure diagonally on the silicon lens. It will cause fatal damage of this product • Please do not recommend to cover the silicone resin of the LEDs with other resin (epoxy, urethane, etc) Rev. 04 May 2010 15 www.seoulsemicon.com