Si4355 E A S Y - T O - U S E , L O W - C U R R E N T O O K / ( G ) F S K S U B - G H Z R E C E IV E R Features Applications Remote keyless entry Home automation Industrial control Sensor networks Health monitors Description Silicon Laboratories’ Si4355 is an easy to use, low current, sub-GHz EZRadio® receiver. Covering all major bands, it combines plug-and-play simplicity with the flexibility needed to handle a wide variety of applications. The compact 3x3 mm package size combined with a low external BOM count makes the Si4355 both space efficient and cost effective. Excellent sensitivity of 116 dBm allows for a longer operating range, while the low current consumption of 10 mA active and 50 nA standby, provides for superior battery life. By fully integrating all components from the antenna to the GPIO or SPI interface to the MCU, the Si4355 makes realizing this performance in an application easy. Design simplicity is further exemplified in the Wireless Development Suite (WDS) user interface module. This configuration module provides simplified programming options for a broad range of applications in an easy to use format that results in both a faster and lower risk development. Like all Silicon Laboratories’ EZRadio devices, the Si4355 is fully compliant with all worldwide regulatory standards, such as FCC, ETSI, and ARIB. Rev 1.0 7/12 Copyright © 2012 by Silicon Laboratories XOUT Remote control Home security and alarm Telemetry Garage and gate openers 20 19 18 17 GND 1 SDN 2 15 SDI RXp 3 14 SDO RXn 4 13 SCLK NC 5 12 nIRQ GND 6 7 8 9 10 GPIO0 Pin Assignments XIN Low RX Current = 10 mA Low standby current = 50 nA GPIO2 VDD OOK Max data rate = 500 kbps Power supply = 1.8 to 3.6 V 64 byte FIFO Auto frequency control (AFC) Automatic gain control (AGC) Integrated battery voltage sensor Packet handling including preamble, sync word detection, and CRC Low BOM 20-Pin 3x3 mm QFN package GND (G)FSK GPIO3 Frequency range = 283–960 MHz Receive sensitivity = –116 dBm Modulation VDD 16 nSEL 11 GPIO1 Patents pending Si4355 Si4355 Functional Block Diagram GPIO3 GPIO2 XIN XOUT Synthesizer SDN 25-32MHz XO Rx Chain LNA PGA ADC Rx Modem RXn SPI Interface Controller RXp nSEL SDI SDO SCLK nIRQ Battery Voltage Sensor VDD 2 Aux ADC GPIO1 GPIO0 Rev 1.0 Si4355 TABLE O F C ONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 1.1. Definition of Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 2. Typical Applications Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.2. Receiver Chain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.3. Receiver Modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4. Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 3.5. Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 3.6. Battery Voltage and Auxiliary ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4. Configuration Options and User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.1. EZConfig GUI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.2. Configuration Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.3. Configuration Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5. Controller Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.1. Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.2. Operating Modes and Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.3. Application Programming Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.4. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.5. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6. Data Handling and Packet Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 6.1. RX FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 6.2. Packet Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 8. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 9. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 10. PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 11. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 11.1. Si4355 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 11.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Rev 1.0 3 Si4355 1. Electrical Specifications Table 1. Recommended Operating Conditions Parameter Symbol Ambient Temperature Supply Voltage I/O Drive Voltage Test Condition Min Typ Max Unit TA –40 25 85 C VDD 1.8 3.6 V VGPIO 1.8 3.6 V Table 2. DC Characteristics1 Parameter Supply Voltage Range Power Saving Modes TUNE Mode Current RX Mode Current Symbol Conditions VDD Min Typ Max Units 1.8 3.3 3.6 V IShutdown RC oscillator, main digital regulator, and low power digital regulator OFF — 30 — nA IStandby Register values maintained and RC oscillator/WUT OFF — 50 — nA IReady Crystal Oscillator and Main Digital Regulator ON, all other blocks OFF — 2 — mA ISPI Active SPI Active State ITune_RX RX Tune IRX 1.35 mA — 6.5 — mA — 10 — mA Notes: 1. All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the "Production Test Conditions" section of "1.1. Definition of Test Conditions" on page 9. 2. Guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" section in "1.1. Definition of Test Conditions" on page 9. 4 Rev 1.0 Si4355 Table 3. Synthesizer AC Electrical Characteristics1 Parameter Synthesizer Frequency Range Synthesizer Frequency Resolution2 Synthesizer Settling Time2 Symbol Conditions FSYN Min Typ Max Units 283 — 350 MHz 425 — 525 MHz 850 — 960 MHz FRES-960 850–960 MHz — 114.4 — Hz FRES-525 425–525 MHz — 57.2 — Hz FRES-350 283–350 MHz — 38.1 — Hz tLOCK Measured from exiting Ready mode with XOSC running to any frequency, including VCO Calibration — 130 — µs Notes: 1. All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the "Production Test Conditions" section in "1.1. Definition of Test Conditions" on page 9. 2. Guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" section in "1.1. Definition of Test Conditions" on page 9. Table 4. Receiver AC Electrical Characteristics1 Parameter RX Frequency Range RX Sensitivity RX Channel Bandwidth2 Symbol Conditions FRX Min Typ Max Units 283 — 350 MHz 425 — 525 MHz 850 — 960 MHz PRX-_2 (BER < 0.1%) (2.4 kbps, GFSK, BT = 0.5, f = 30 kHz)2 ,114 kHz Rx BW — –116 — dBm PRX-_40 (BER < 0.1%) (40 kbps, GFSK, BT = 0.5, f = 25 kHz)2, 114 kHz Rx BW — –108 — dBm PRX-_128 (BER < 0.1%) (128 kbps, GFSK, BT = 0.5, f = 70 kHz)2, 305 kHz Rx BW — –103 — dBm PRX-_OOK BER < 0.1%, 1 kbps, 185 kHz Rx BW, OOK, PN15 data — –113 — dBm BER < 0.1%, 40 kbps, 185 kHz Rx BW, OOK, PN15 data — –102 — dBm 40 — 850 kHz BW Notes: 1. All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the "Production Test Conditions" section in "1.1. Definition of Test Conditions" on page 9. 2. Guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" section in "1.1. Definition of Test Conditions" on page 9. Rev 1.0 5 Si4355 Table 4. Receiver AC Electrical Characteristics1 (Continued) Parameter Symbol Conditions Min Typ Max Units BER Variation vs Power Level2 PRX_RES Up to +5 dBm Input Level — 0 0.1 ppm RSSI Resolution RESRSSI — ±0.5 — dB — –56 — dB — –59 — dB — –58 — dB — –61 — dB — –79 — dB 1-Ch Offset Selectivity2 2-Ch Offset Selectivity Blocking 200 kHz–1 MHz Blocking 1 MHz Offset2 Blocking 8 MHz Offset2 C/I1-CH 2 C/I2-CH Desired Ref Signal 3 dB above sensitivity, BER < 0.1%. Interferer is CW and desired modulated with 1.2 kbps F = 5.2 kHz GFSK with BT = 0.5, Rx BW = 58 kHz, channel spacing = 100 kHz 200KBLOCK Desired Ref Signal 3 dB above sensitivity, BER < 0.1% Interferer is CW and 1MBLOCK desired modulated with 1.2 kbps 8MBLOCK F = 5.2 kHz GFSK with BT = 0.5, RX BW = 58 kHz Image Rejection2 Spurious Emissions2 ImREJ Rejection at the image frequency. IF = 468 kHz — –40 — dB POB_RX1 Measured at RX pins — — –54 dBm Notes: 1. All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the "Production Test Conditions" section in "1.1. Definition of Test Conditions" on page 9. 2. Guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" section in "1.1. Definition of Test Conditions" on page 9. Table 5. Auxiliary Block Specifications1 Parameter XTAL Range2 Symbol Conditions Min Typ Max Units 25 — 32 MHz — 250 — µs 30MRES — 70 — fF tPOR — — 5 ms XTALRANGE 30 MHz XTAL Start-Up Time 30 MHz XTAL Cap Resolution3 POR Reset Time t30M Using XTAL and board layout in reference design. Start-up time will vary with XTAL type and board layout Notes: 1. All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the "Production Test Conditions" section in "1.1. Definition of Test Conditions" on page 9. 2. XTAL Range tested in production using an external clock source (similar to using a TCXO). 3. Guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" section in "1.1. Definition of Test Conditions" on page 9. 6 Rev 1.0 Si4355 Table 6. Digital IO Specifications (GPIO_x, SCLK, SDO, SDI, nSEL, nIRQ)1 Parameter Symbol Conditions Min Typ Max Units Rise Time TRISE 0.1 x VDD to 0.9 x VDD, CL= 10 pF, DRV<1:0>=HH — 2.3 — ns Fall Time TFALL 0.9 x VDD to 0.1 x VDD, CL= 10 pF, DRV<1:0>=HH — 2 — ns Input Capacitance CIN — 2 — pF Logic High Level Input Voltage VIH VDD x 0.7 — — V Logic Low Level Input Voltage VIL — — VDD x 0.3 V Input Current IIN 0<VIN < VDD –10 — 10 µA Input Current If Pullup is Activated IINP VIL = 0 V 1 — 10 µA Drive Strength for Output Low Level2 IOLL DRV<1:0> = LL 2.1 mA IOLH DRV<1:0> = LH 1.5 mA IOHL DRV<1:0> = HL 1.0 mA IOHH DRV<1:0> = HH 0.4 mA IOLL DRV<1:0> = LL 4.5 mA IOLH DRV<1:0> = LH 3.3 mA IOHL DRV<1:0> = HL 2.1 mA IOHH DRV<1:0> = HH 0.7 mA IOLL DRV<1:0> = LL 1.9 mA IOLH DRV<1:0> = LH 1.7 mA IOHL DRV<1:0> = HL 1.3 mA IOHH DRV<1:0> = HH 0.6 mA Logic High Level Output Voltage VOH IOUT = 500 µA VDD x 0.8 — — V Logic Low Level Output Voltage VOL IOUT = 500 µA — — VDD x 0.2 V Drive Strength for Output High Level (GPIO1, GPIO2, GPIO3)2 Drive Strength for Output High Level (GPIO0)2 Notes: 1. All specifications guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" section in "1.1. Definition of Test Conditions" on page 9. 2. GPIO output current measured at 3.3 VDC VDD with VOH = 2.7 VDC and VOL = 0.66 VDC. Rev 1.0 7 Si4355 Table 7. Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Junction Temperature Symbol Test Condition Value Unit JA Still Air 30 C/W 125 C TJ Table 8. Absolute Maximum Ratings Parameter Value Unit –0.3, +3.6 V Voltage on Digital Control Inputs –0.3, VDD + 0.3 V Voltage on Analog Inputs –0.3, VDD + 0.3 V +10 dBm Operating Ambient Temperature Range TA –40 to +85 C Storage Temperature Range TSTG –55 to +125 C VDD to GND RX Input Power Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at or beyond these ratings in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Caution: ESD sensitive device. 8 Rev 1.0 Si4355 1.1. Definition of Test Conditions Production Test Conditions: TA = +25 °C VDD = +3.3 VDC Sensitivity measured at 434 MHz using a PN15 modulated input signal and with packet handler mode enabled. External reference signal (XIN) = 1.0 VPP at 30 MHz, centered around 0.8 VDC Production All test schematic (unless noted otherwise) RF input and output levels referred to the pins of the Si4355 (not the RF module) Qualification Test Conditions: TA = –40 to +85 °C (typical = 25 °C) VDD = +1.8 to +3.6 VDC (typical = 3.3 VDC) Using reference design or production test schematic All RF input and output levels referred to the pins of the Si4355 (not the RF module) Rev 1.0 9 Si4355 2. Typical Applications Circuit GP2 SDO GP3 SCLK GP4 nIRQ 12 11 GPIO1 10 GPIO0 GND NC 5 SDI VDD C3 C4 C5 100 p 100 n 1u Figure 1. Si4355 Applications Circuit 10 Rev 1.0 GP5 Microcontroller nSEL XOUT 17 18 XIN GPIO2 19 16 13 4 9 RXn 15 Si4355 3 GND RXp 8 L2 C1 GP1 14 VDD L1 SDN 2 7 SDN 1 VDD GND 6 C2 20 GPIO3 30 MHz Si4355 3. Functional Description GPIO3 GPIO2 XIN XOUT Synthesizer SDN 25-32MHz XO Rx Chain LNA PGA ADC Rx Modem RXn SPI Interface Controller RXp nSEL SDI SDO SCLK nIRQ Battery Voltage Sensor Aux ADC VDD GPIO1 GPIO0 Figure 2. Si4355 Functional Block Diagram 3.1. Overview The Si4355 is an easy-to-use, size efficient, low current wireless ISM receiver that covers the sub-GHz bands. The wide operating voltage range of 1.8–3.6 V and low current consumption make the Si4355 an ideal solution for battery powered applications. The Si4355 uses a single-conversion mixer to downconvert the FSK/GFSK or OOK modulated receive signal to a low IF frequency. Following a programmable gain amplifier (PGA) the signal is converted to the digital domain by a high performance ADC allowing filtering, demodulation, slicing, and packet handling to be performed in the built-in DSP, increasing the receiver’s performance and flexibility versus analog based architectures. The demodulated signal is output to the system MCU through a programmable GPIO or via the standard SPI bus by reading the 64-byte Rx FIFO. A high precision local oscillator (LO) is used and is generated by an integrated VCO and Fractional-N PLL synthesizer. The Si4355 operates in the frequency bands of 283–350, 425–525, and 850–960 MHz. Additional system features, such as 64 byte Rx FIFO, preamble detection, sync word detector and CRC, reduce overall current consumption, and allow for the use of lower-cost system MCUs. Power-on-reset (POR), and GPIOs further reduce overall system cost and size. The Si4355 is designed to work with an MCU, crystal, and a few passives to create a very compact and low-cost system. 3.2. Receiver Chain The internal low-noise amplifier (LNA) is designed to be a wide-band LNA that can be matched with three external discrete components to cover any common range of frequencies in the sub-GHz band. The LNA has extremely low noise to suppress the noise of the following stages and achieve optimal sensitivity; so, no external gain or front-end modules are necessary. The LNA has gain control, which is controlled by the internal automatic gain control (AGC) algorithm. The LNA is followed by an I-Q mixer, filter, programmable gain amplifier (PGA), and ADC. The I-Q mixers downconvert the signal to an intermediate frequency. The PGA then boosts the gain to be within dynamic range of the ADC. The ADC rejects out-of-band blockers and converts the signal to the digital domain where filtering, demodulation, and processing is performed. Peak detectors are integrated at the output of the LNA and PGA for use in the AGC algorithm. Rev 1.0 11 Si4355 3.3. Receiver Modem Using high-performance ADCs allows channel filtering, image rejection, and demodulation to be performed in the digital domain, which allows for flexibility in optimizing the device for particular applications. The digital modem performs the following functions: Channel selection filter Preamble detection Invalid preamble detection RX demodulation Automatic gain control (AGC) Automatic frequency compensation (AFC) Radio signal strength indicator (RSSI) Cyclic redundancy check (CRC) The digital channel filter and demodulator are optimized for ultra-low-power consumption and are highly configurable. Supported modulation types are GFSK, FSK, and OOK. The channel filter can be configured to support bandwidths ranging from 850 kHz down to 40 kHz. A large variety of data rates are supported ranging from 500 kbps up to 500 kbps. The configurable preamble detector is used with the synchronous demodulator to improve the reliability of the sync-word detection. Preamble detection can be skipped using only sync detection, which is a valuable feature of the asynchronous demodulator when very short preambles are used. The received signal strength indicator (RSSI) provides a measure of the signal strength received on the tuned channel. The resolution of the RSSI is 0.5 dB. This high-resolution RSSI enables accurate channel power measurements for clear channel assessment (CCA), carrier sense (CS), and listen before talk (LBT) functionality. A wireless communication channel can be corrupted by noise and interference, so it is important to know if the received data is free of errors. A cyclic redundancy check (CRC) is used to detect the presence of erroneous bits in each packet. A CRC is computed and appended at the end of each transmitted packet and verified by the Si4355 receiver to confirm that no errors have occurred. The packet handler and CRC can significantly reduce the load on the system microcontroller allowing for a simpler and cheaper microcontroller. The default bandwidth-time product (BT) is 0.5 for all programmed data rates. 3.3.1. Received Signal Strength Indicator The received signal strength indicator (RSSI) is an estimate of the signal strength in the channel to which the receiver is tuned. The RSSI measurement is done after the channel filter, so it is only a measurement of the desired or undesired in-band signal power. The Si4355 uses a fast response register to read RSSI and so can complete the read in 16 SPI clock cycles with no requirement to wait for CTS. The RSSI value is read using the RSSI_READ command. The RSSI value reported by this API command can be converted to dBm using the following equation: RSSI_value RSSIdBm = --------------------------------- – RSSI cal 2 RSSIcal in this formula is dependent on the matching network, modem settings, and external LNA gain (if present). It can be obtained through lab measurements using a signal generator connected to the antenna input to provide a known RSSI level. Without an external LNA, the RSSIcal will be approximately 130. 3.4. Synthesizer The Si4355 includes an integrated Sigma Delta () Fractional-N PLL synthesizer capable of operating over the bands from 283–350, 425–525, and 850–960 MHz. The synthesizer has many advantages; it provides flexibility in choosing data rate, deviation, channel frequency, and channel spacing. The frequency resolution is (2/3)Freq_xo/(219) for 283–350 MHz, Freq_xo/(219) for 425–525 MHz, and Freq_xo/(218) for 850–960 MHz. The nominal reference frequency to the PLL is 30 MHz, but any XTAL frequency from 25 to 32 MHz may be used. The modem configuration calculator in WDS will automatically account for the XTAL frequency being used. The PLL utilizes a differential LC VCO with integrated on-chip inductors. The output of the VCO is followed by a configurable divider, which will divide the signal down to the desired output frequency band. 12 Rev 1.0 Si4355 3.4.1. Synthesizer Frequency Control The frequency is set by changing the integer and fractional settings to the synthesizer. The WDS calculator will automatically provide these settings, but the synthesizer equation is shown below for convenience. Initial frequency settings are configured in the EZConfig setup and can also be modified using the API commands: FREQ_CONTROL_INTE, FREQ_CONTROL_FRAC2, FREQ_CONTROL_FRAC1, and FREQ_CONTROL_FRAC0. freq_xo fc_frac- 4 ------------------------------- Hz RF_channel = fc_inte + ----------------19 outdiv 2 Note: The fc_frac/219 value in the above formula must be a number between 1 and 2. The LSB of fc_frac must be "1". Table 9. Output Divider (Outdiv) Values Outdiv Lower (MHz) Upper (MHz) 12 284 350 8 425 525 4 850 960 3.4.1.1. EZ Frequency Programming EZ frequency programming allows for easily changing radio frequency using a single API command. The base frequency is first set using the EZConfig setup. This base frequency will correspond to channel 0. Next, a channel step size is also programmed within the EZConfig setup. The resulting frequency will be: RF Frequency = Base Frequency + Channel Step Size The second argument of the START_RX is CHANNEL, which sets the channel number for EZ frequency programming. For example, if the channel step size is set to 1 MHz, the base frequency is set to 900 MHz, and a CHANNEL number of 5 is programmed during the START_RX command, the resulting frequency will be 905 MHz. If no CHANNEL argument is written as part of the START_RX command, it will default to the previous value. The initial value of CHANNEL is 0 and so will be set to the base frequency if this argument is never used. 3.5. Crystal Oscillator The Si4355 includes an integrated crystal oscillator with a fast start-up time of less than 250 µs. The design is differential with the required crystal load capacitance integrated on-chip to minimize the number of external components. By default, all that is required off-chip is the crystal. The default crystal is 30 MHz, but the circuit is designed to handle any XTAL from 25 to 32 MHz, set in the EZConfig setup. The crystal load capacitance can be digitally programmed to accommodate crystals with various load capacitance requirements and to adjust the frequency of the crystal oscillator. The tuning of the crystal load capacitance is programmed through the GLOBAL_XO_TUNE API property. The total internal capacitance is 11 pF and is adjustable in 127 steps (70 fF/step). The crystal frequency adjustment can be used to compensate for crystal production tolerances. The frequency offset characteristics of the capacitor bank are demonstrated in Figure 3. Rev 1.0 13 Si4355 Figure 3. Capacitor Bank Frequency Offset Characteristics 3.6. Battery Voltage and Auxiliary ADC The Si4355 contains an integrated auxiliary 11-bit ADC used for the internal battery voltage detector or an external component via GPIO. The Effective Number of Bits (ENOB) is 9 bits. When measuring external components, the input voltage range is 1 V, and the conversion rate is between 300 Hz to 2.44 kHz. The ADC value is read by first sending the GET_ADC_READING command and enabling the desired inputs. When the conversion is finished and all the data is ready, CTS will go high, and the data can be read out. Refer to application note, “AN691: EZRadio API Guide”, for details on this command and the formulas needed to interpret the results. 14 Rev 1.0 Si4355 4. Configuration Options and User Interface 4.1. EZConfig GUI The EZConfig Setup GUI is part of the Wireless Development Suite (WDS) program. This setup interface provides an easy path for quickly selecting and loading the desired configuration for the device. The EZConfig Setup allows for three different methods for device setup. One option is the configuration wizard, which easily identifies the optimal setup based on a few questions about the application. Another option is the configuration table, which provides a list of preloaded, common configurations. Lastly, EZConfig allows for custom configuration to be loaded using the radio configuration application. After the desired configuration is selected, the EZConfig setup automatically creates the configuration array that will be passed to the chip for setup. The program then gives the option to load a sample project with the selected configuration onto the evaluation board, or launch IDE with the new configuration array preloaded into the user program. For more complete information on EZConfig usage, refer to the application note, “AN692: Si4x55 Programming Guide & Sample Codes”. Open EZConfig Setup in WDS Guided Input Method Manual Fast Run Configuration Wizard Select Configuration from Table Create Custom Configuration Select Freq, Power, and Packet Handler Features Lab Measurement Select Action Write New Code Run Sample Code Load Configuration on Device Add new configuration to sample code and load on board Open IDE with configuration array preloaded Figure 4. Device Configuration Steps Rev 1.0 15 Si4355 4.1.1. Configuration Wizard The configuration wizard is available to easily identify the optimal device setup based on a few questions about the desired application. Within this wizard, the user is able to define their system requirements and can see some potential trade-offs for various settings. The wizard then provides a recommended configuration that is optimized for the given application. This configuration can be further modified if needed to provide the desired setup. 4.1.2. Configuration Table The configuration table is a list of predefined configurations that have been optimized for performance and validated by Silicon Labs. These configurations are listed for many common application conditions and so most users will be able to find the configuration they need in this table. These configurations are set to provide optimized performance for a given application and can be implemented with low design risk. Once the list item is selected, the specific frequency, and packet handler features can also be applied. 4.1.3. Radio Configuration Application The Radio Configuration Application provides an intuitive interface for directly modifying the device configuration. Using this control panel, the device parameters such as modulation type, data rate, and frequency deviation, can be set. The EZConfig Setup then takes these parameters and automatically determines the appropriate device register settings. This method allows the user to have complete flexibility in determining the configuration of the device without the need to translate the system requirements into device specific properties. As with the other EZConfig methods, the resulting configuration array is automatically generated and available for use in the user's program. 4.2. Configuration Options 4.2.1. Frequency Band The Si4355 can operate in the 283–350 MHz, 425–525 MHz, or 850–960 MHz bands. One of these three bands will be selected during the configuration setup and then the specific receive frequency that will be used within this band can be selected. 4.2.2. Modulation Type The Si4355 can operate using On/Off Keying (OOK), Frequency Shift Keying (FSK), or Gaussian Frequency Shift Keying (GFSK). OOK modulation is the most basic modulation type available. It is the most power efficient method and does not require as high oscillator accuracy as FSK. FSK provides the best sensitivity and, therefore, range performance but generally requires more precision from the oscillator used. GFSK is a version of FSK where the signal is passed through a Gaussian filter, limiting its spectral width. As a result, the out of band components of the signal are reduced. The Si4355 also has an option for Manchester coding. This method provides a state transition at each bit and so allows for more reliable clock recovery. Clock Data 1 0 1 0 0 Manchester Figure 5. Manchester Code Example 16 Rev 1.0 1 1 1 Si4355 4.2.3. Frequency Deviation If FSK or GFSK modulation is selected, then a frequency deviation will also need to be selected. The frequency deviation is the maximum instantaneous difference between the FM modulated frequency and the nominal carrier frequency. The Si4455 can operate across a wide range of data rates and frequency deviations. If a frequency deviation needs to be selected, the following guideline might be helpful to build a robust link. A proper frequency deviation is linked to the frequency error between transmitter and receiver. The frequency error can be calculated using the crystal tolerance parameters and the RF operating frequency: (ppm_tx+ppm_rx)*Frf/1E-6. For frequency errors below 50 kHz, the deviation can be about the same as the frequency error. For frequency errors exceeding 50 kHz the frequency deviation can be set to about 0.75 times the frequency error. It is advised to position the modulation index (=2*freq_dev/data_rate) into a range between 1 and 100 for Packet Handling mode and 2 to 100 for direct mode (non-standard preamble). For example, when in Packet Handling mode and the frequency error is smaller than data_rate/2, the frequency deviation is set to about data_rate/2. When the frequency error exceeds 100xdata_rate/2, the frequency deviation is preferred to be set to 100xdata_rate/2. 4.2.4. Data Rate The Si4355 can be set to communicate at between 1 to 500 kbps in (G)FSK mode and between 0.5 to 120 kbps in OOK mode. Higher data rates allow for faster data transfer while lower data rates result in improved sensitivity and range performance. 4.2.5. Channel Bandwidth The channel bandwidth sets the bandwidth for the receiver. Since the receiver bandwidth is directly proportional to the noise allowed in the system, this will normally be set as low as possible. The specific channel bandwidth used will usually be determined based upon the precision of the oscillator and the frequency deviation of the transmitted signal. The EZConfig setup can provide the recommended channel bandwidth based upon these two parameters to help optimize the system. 4.2.6. Preamble Length A preamble is a defined simple bit sequence used to notify the receiver that a data transmission is imminent. The length of this preamble will normally be set as short as possible to minimize power while still insuring that it will be reliably detected given the receiver characteristics, such as duty cycling and packet error rate performance. The Si4355 allows the preamble length to be set between 3 to 255 bytes in length with a default length of 4 bytes. The preamble pattern for the Si4355 will always be 55h with a first bit of "0" if the packet handler capability is used. 4.2.7. Sync Word Length and Pattern The sync word follows the preamble in the packet structure and is used to identify the start of the payload data and to synchronize the receiver to the transmitted bit stream. The Si4355 allows for sync word lengths of 1 to 4 bytes and the specific pattern can be set within the EZConfig program. The default is a 2 byte length 2d d4 pattern. 4.2.8. Cyclic Redundancy Check (CRC) CRC is used to verify that no errors have occurred during transmission and the received packet has exactly the same data as it did when transmitted. If this function is enabled in the Si4355, the last byte of transmitted data must include the CRC generated by the transmitter. The Si4355 then performs a CRC calculation on the received packet and compares that to the transmitted CRC. If these two values are the same, the Si4355 will set an interrupt indicating a valid packet has been received and is waiting in the Rx FIFO. If these two CRC values differ, the Si4355 will flag an interrupt indicating that a packet error occurred. The Si4355 uses CRC(16)-IBM: x16+x15+x2+1 with a seed of 0xFFFF. Rev 1.0 17 Si4355 4.3. Configuration Commands The EZConfig Setup provides all of the code needed for basic radio configuration. Once the setup is completed in the GUI, the program outputs configuration array(s) that can be sent to the radio via the SPI interface. No additional setup coding is needed. The configuration command process is shown in Figure 6. The EZCONFIG_SETUP passes the configuration array to the device and the EZCONFIG_CHECK insures that all of the configuration data was written correctly. For more information on the setup commands, refer to application note, “AN691: EZRadio API Guide”. EZCONFIG_SETUP NOP EZCONFIG_SETUP EZCONFIG_CHECK Figure 6. Configuration Command Flowchart 18 Rev 1.0 Si4355 5. Controller Interface 5.1. Serial Peripheral Interface (SPI) The Si4355 communicates with the host MCU over a standard 4-wire serial peripheral interface (SPI): SCLK, SDI, SDO, and nSEL. The SPI interface is designed to operate at a maximum of 10 MHz. The SPI timing parameters are listed in Table 10. The host MCU writes data over the SDI pin and can read data from the device on the SDO output pin. Figure 7 shows an SPI write command. The nSEL pin should go low to initiate the SPI command. The first byte of SDI data will be one of the API commands followed by n bytes of parameter data, which will be variable depending on the specific command. The rising edges of SCLK should be aligned with the center of the SDI data. Table 10. Serial Interface Timing Parameters Symbol Parameter Clock high time Min (ns) tCL Clock low time 40 tDS Data setup time 20 tDH Data hold time 20 tDD Output data delay time Output enable time 20 tDE Output disable time 50 tSS Select setup time 20 tSH Select hold time 50 tSW Select high period 80 tCH tEN Diagram 40 SCLK tSS tCL tCH tDS tDH tDD tSH tDE SDN 20 SDO tEN tSW nSEL nSEL SDO SDI API Command ParamByte 0 ParamByte n SCLK Figure 7. SPI Write Command The Si4355 contains an internal MCU which controls all the internal functions of the radio. For SPI read commands, a typical communication flow of checking clear-to-send (CTS) is used to make sure the internal MCU has executed the command and prepared the data to be output over the SDO pin. Figure 8 demonstrates the general flow of an SPI read command. Once the CTS value reads FFh, the read data is ready to be clocked out to the host MCU. The typical time for a valid FFh CTS reading is 20 µs. Figure 9 demonstrates the remaining read cycle after CTS is set to FFh. The internal MCU will clock out the SDO data on the negative edge so the host MCU should process the SDO data on the rising edge of SCLK. Rev 1.0 19 Si4355 0xFF Send Command Read CTS CTS Value Retrieve Response 0x00 nSEL SDO SDI CTS ReadCmdBuff SCLK Figure 8. SPI Read Command—Check CTS Value nSEL SDO Response Byte 0 Response Byte n SDI SCLK Figure 9. SPI Read Command—Clock Out Read Data 20 Rev 1.0 Si4355 5.2. Operating Modes and Timing The primary states of the Si4355 are shown in Figure 10. The shutdown state completely shuts down the radio, minimizing current consumption and is controlled using the SDN (pin 2). All other states are controlled using the API commands START_RX and CHANGE_STATE. Table 11 shows each of the operating modes with the time required to reach either RX state as well as the current consumption of each state. The times in Table 11 are measured from the rising edge of nSEL until the chip is in the desired state. This information is included for reference only since an automatic sequencer moves the chip from one state to another and so it is not necessary to manually step through each state. Most applications will utilize the standby mode since this provides the fastest transition response time, maintains all register values, and results in nearly the same current consumption as shutdown. Standby Shutdown SPI Active Config Ready Rx Tune Rx Figure 10. State Machine Diagram Table 11. Operating State Response Time and Current Consumption State / Mode Response Time to Rx Current in State / Mode Shutdown 30 ms 30 nA Standby 460 μs 50 nA SPI Active 330 μs 1.35 mA Ready 130 μs 1.8 mA Rx Tune 75 μs 6.5 mA Rx 150 μs 10 mA Rev 1.0 21 Si4355 5.2.1. Shutdown State The shutdown state is the lowest current consumption state of the device and is entered by driving SDN (Pin 2) high. In this state, all register contents are lost and there is no SPI access. To exit this mode, drive SDN low. The device will then initiate a power on reset (POR) along with internal calibrations. Once this POR period is complete, the POWER_UP command is required to initialize the radio and the configuration can then be loaded into the device. The SDN pin must be held high for at least 10 µs before driving it low again to insure the POR can be executed correctly. The shutdown state can be used to fully reset the part. 5.2.2. Standby State The standby state has similar current consumption to the shutdown state but retains all register values, allowing for a much faster response time. Because of these benefits, most applications will want to use standby mode rather than shutdown. The standby state is entered by using the CHANGE_STATE API command. While in this state, the SPI is accessible but any SPI event will automatically transition the chip to the SPI active state. After the SPI event, the host will need to re-command the device to standby mode. 5.2.3. SPI Active State The SPI active state enables the device to process any SPI events, such as API commands. In this state, the SPI and boot up oscillator are enabled. The SPI active state is entered by using the CHANGE_STATE command or automatically through an SPI event while in standby mode. If the SPI active state was entered automatically from standby mode, a CHANGE_STATE command will be needed to return the device to standby mode. 5.2.4. Ready State Ready state is designed to give a fast transition time to RX state with minimized current consumption. In this mode the crystal oscillator remains enabled to minimize the transition time. Ready state can be entered using the CHANGE_STATE command. 5.2.5. Power On Reset A Power On Reset (POR) sequence is used to boot the device up from a fully off or shutdown state. To execute this process, VDD must ramp within 1ms and must remain applied to the device for at least 10ms. If VDD is removed, then it must stay below 0.15V for at least 10ms before being applied again. Please see Figure x and Table x for details. Figure 11. POR Timing Diagram 22 Rev 1.0 Si4355 Table 12. POR Timing Variable Description Min Typ Max Units tPORH High time for VDD to fully settle POR circuit. 10 ms tPORL Low time for VDD to enable POR. 10 ms VRRH Voltage for successful POR. 90%*Vdd V VRRL Starting Voltage for successful POR. tSR 0 Slew rate of VDD for successful POR. 150 mV 1 ms 5.2.6. RX State The RX state is used whenever the device is required to receive data. It is entered using either the START_RX or CHANGE_STATE commands. With the START_RX command, the next state can be defined to insure optimal timing. When either command is sent to enter RX state, an internal sequencer automatically takes care of all actions required to move between states with no additional user commands needed. The sequencer controlled events can include enable the digital and analog LDOs, start up the crystal oscillator, enable PLL, calibrate VCO, enable receiver circuits, and enable receive mode. The device will also automatically set up all receiver features such as packet handling based upon the initial configuration of the device. Rev 1.0 23 Si4355 5.3. Application Programming Interface An Application Programming Interface (API) is embedded inside the device and is used for communications with the host MCU. API commands are used to configure the device, control the chip during operation, and retrieve its status. Available commands are shown in Table 13. The complete list of commands and their descriptions are provided in application note, “AN691: EZRadio API Guide”. Table 13. API Commands # Description 0x00 NOP No operation command 0x01 PART_INFO Reports basic information about the device 0x02 POWER_UP Boot options and crystal frequency offset 0x10 FUNC_INFO Returns the function revision information of the device 0x11 24 Name SET_PROPERTY Sets the value of a property 0x12 GET_PROPERTY Retrieves the value of a property 0x13 GPIO_PIN_CFG Configures the GPIO pins 0x14 GET_ADC_READING Performs and retrieves ADC conversion results 0x15 FIFO_INFO Provides access to the RX FIFO counts and reset 0x19 EZCONFIG_CHECK Validates the EZConfig array was written correctly 0x20 GET_INT_STATUS Returns the interrupt status byte 0x32 START_RX Switches to RX state 0x33 REQUEST_DEVICE_STATE Request current device state 0x34 CHANGE_STATE Changes to a specified device state / mode 0x44 READ_CMD_BUFF Used to read CTS and the command response 0x50 CHIP_STATUS_INT_PEND_READ CHIP_STATUS_INT_PEND fast response register 0x51 MODEM_INT_PEND_READ MODEM_INT_PEND fast response register 0x53 PH_INT_PEND_READ PH_INT_PEND fast response register 0x57 RSSI_READ RSSI fast response register 0x66 EZCONFIG_SETUP Configures device using EZConfig array 0x77 READ_RX_FIFO Reads the RX FIFO Rev 1.0 Si4355 5.4. Interrupts The Si4355 is capable of generating an interrupt signal when certain events occur. The chip notifies the microcontroller that an interrupt event has occurred by setting the nIRQ output pin LOW = 0. This interrupt signal will be generated when any one (or more) of the interrupt events occur. The nIRQ pin will remain low until the microcontroller reads the Interrupt Status Registers. The nIRQ output signal will then be reset until the next change in status is detected. The interrupt sources are grouped into three categories: packet handler, chip status, and modem. The individual interrupts in these groups can be enabled/disabled in the interrupt property registers, 0x0101, 0x0102, and 0x0103. An interrupt must be enabled for it to trigger an event on the nIRQ pin. The interrupt group must be enabled as well as the individual interrupts in API property 0x0100. Once an interrupt event occurs and the nIRQ pin is low the interrupts are read and cleared using the GET_INT_STATUS command. By default all interrupts will be cleared once read. The instantaneous status of a specific function may be read if the specific interrupt is enabled or disabled. The status results are provided after the interrupts and can be read with the same commands as the interrupts. The status bits will give the current state of the function whether the interrupt is enabled or not. 5.5. GPIO Four General Purpose IO (GPIO) pins are available for use in the application. The GPIOs are configured using the GPIO_PIN_CFG command. GPIO pins 0 and 1 should be used for active signals such as data or clock. GPIO pins 2 and 3 have more susceptibility to generating spurious components in the synthesizer than pins 0 and 1. The drive strength of the GPIOs can be adjusted with the GEN_CONFIG parameter in the GPIO_PIN_CFG command. By default, the drive strength is set to the minimum. The default configuration and the state of the GPIO during shutdown are shown in Table 14. For a complete list of the GPIO options, please refer to the API guide application note, “AN691: EZRadio API Guide”. Table 14. GPIOs Pin SDN State POR Default GPIO0 0 POR GPIO1 0 CTS GPIO2 0 POR GPIO3 0 POR nIRQ Resistive VDD pull-up nIRQ SDO Resistive VDD pull-up SDO SDI High Z SDI Rev 1.0 25 Si4355 6. Data Handling and Packet Handler 6.1. RX FIFO A 64-byte RX FIFO is integrated into the chip. Reading from command register 77h reads data from this RX FIFO. 6.2. Packet Handler The Si4355 includes integrated packet handler features such as preamble and sync word detection as well as CRC calculation. This allows the chip to qualify and synchronize with legitimate transmissions independent of the microcontroller. These features can be enabled using the EZConfig setup. In this setup, the preamble and sync word length can be modified and the sync word pattern can be selected. The general packet structure is shown in Figure 12. There is also the option within the EZConfig setup to select a variable packet length. With this setting, the receiver is not required to know the packet length ahead of time. The transmitter sends the length of the packet immediately after the sync word. The packet structure for variable length packets is shown in Figure 13. Preamble Sync Word Data CRC 0 – 255 Bytes 1 – 4 Bytes 1 – 64 Bytes 2 Bytes Figure 12. Packet Structure for Fixed Packet Length Preamble Sync Word Length Data CRC 0 – 255 Bytes 1 – 4 Bytes 1 Byte 1 – 64 Bytes 2 Bytes Figure 13. Packet Structure for Variable Packet Length 26 Rev 1.0 Si4355 GPIO3 GPIO2 XIN XOUT 7. Pin Descriptions 20 19 18 17 15 SDI RXp 3 14 SDO RXn 4 13 SCLK NC 5 12 nIRQ GND 6 7 8 9 10 GPIO0 2 GND SDN VDD 1 VDD GND 16 nSEL 11 GPIO1 Pin Pin Name I/O Description 1 GND GND 2 SDN I Shutdown (0 – VDD V) – SDN = 1, part will be in shutdown mode and contents of all registers are lost. SDN = 0, all other modes. 3 RXp I Differential RF receiver input pin 4 RXn I Differential RF receiver input pin 5 NC — 6 GND GND Ground 7 VDD VDD Supply voltage 8 VDD VDD Supply voltage 9 GND GND Ground 10 GPIO0 I/O General Purpose Digital I/O 11 GPIO1 I/O General Purpose Digital I/O 12 nIRQ O 13 SCLK I 14 SDO O Interrupt Status Output – nIRQ = 0, interrupt event has occurred. Read interrupt status for event details. Serial Clock Input (0 – VDD V)—Provides serial data clock for 4-line serial data bus. Serial Data Output (0 – VDD V)— Provides serial data readback function of internal control registers. 15 SDI I Serial Data Input (0 – VDD V)—Serial data stream input for 4-line serial data bus Ground No Connect Rev 1.0 27 Si4355 Pin Pin Name I/O 16 nSEL I Description Serial Interface Select Input (0 – VDD V) – Provides select/enable function for 4-line serial data bus 17 XOUT O Crystal Oscillator Output 18 XIN I Crystal Oscillator Input—No DC bias required, but if used, should be set to 7 V. 19 GPIO2 I/O General Purpose Digital I/O 20 GPIO3 I/O General Purpose Digital I/O 28 Rev 1.0 Si4355 8. Ordering Information Part Number* Description Package Type Operating Temperature Si4355-B1A-FM EZRadio Receiver 3x3 QFN-20 Pb-free –40 to 85 °C *Note: Add an “R” at the end of the device part number to denote tape and reel option. Rev 1.0 29 Si4355 9. Package Outline Figure 14. 20-pin QFN Package 30 Rev 1.0 Si4355 Table 15. Package Diagram Dimensions Dimension Min Nom Max A 0.80 0.85 0.90 A1 0.00 0.02 0.05 A3 0.20 REF b 0.18 0.25 0.30 c 0.25 0.30 0.35 D D2 3.00 BSC. 1.55 1.70 e 0.50 BSC. E 3.00 BSC. E2 1.55 f L 1.70 1.85 1.85 2.40 BSC. 0.30 0.40 aaa 0.15 bbb 0.10 ccc 0.10 ddd 0.05 eee 0.08 fff 0.10 0.50 Note: All dimensions shown are in millimeters (mm) unless otherwise noted. Rev 1.0 31 Si4355 10. PCB Land Pattern Figure 15. 20-pin QFN PCB Land Pattern Table 16. PCB Land Pattern Dimensions Dimension Min Max C1 3.00 C2 3.00 E 0.50 REF X1 0.25 0.35 X2 1.65 1.75 Y1 0.85 0.95 Y2 1.65 1.75 Y3 0.37 0.47 f c 2.40 REF 0.25 0.35 Note: : All dimensions shown are in millimeters (mm) unless otherwise noted. 32 Rev 1.0 Si4355 11. Top Marking 11.1. Si4355 Top Marking Figure 16. Si4355 Top Marking 11.2. Top Marking Explanation Mark Method: Laser Line 1 Marking: Part Number 4355A Firmware Revision Line 2 Marking: Die Revision Internal tracking number TTTT = Trace Code Line 3 Marking: Circle = 0.5 mm Diameter (Bottom-Left Justified) Y = Year WW = Workweek Assigned by the Assembly House. Corresponds to the last significant digit of the year and work week of the mold date. Rev 1.0 33 Si4355 CONTACT INFORMATION Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 Tel: 1+(512) 416-8500 Fax: 1+(512) 416-9669 Toll Free: 1+(877) 444-3032 Please visit the Silicon Labs Technical Support web page: https://www.silabs.com/support/pages/contacttechnicalsupport.aspx and register to submit a technical support request. The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages. Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc. Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders. 34 Rev 1.0