TQM716015 Data Sheet Multi-mode (WCDMA B5 / CDMA BC0 / HSPA+ / LTE) 3x3mm PA Module Features Functional Block Diagram VCC1 VCC2 RF IN RF OUT Vmode1 CPLR IN Vmode0 GND 2-Bit Bias Control VEN CPLR OUT Product Description The TQM716015 is fully matched Power Amplifier Module designed for use in CDMA (BC0), WCDMA (Bands 5&6) and LTE handsets. Its compact 3x3mm package including a coupler and built-in voltage regulator makes it ideal for today’s extremely small data enabled phones. Its RF performance meets the stringent linearity requirements for multi-mode operation. The TQM716015 is designed on TriQuint’s GaAs BiHEMT technology with CuFlip® assembly offering state of the art reliability, temperature stability and ruggedness. The 3-Gain state PA die operates in LPM, MPM and HPM to maximize talk time over the entire range of operating conditions. To simplify the cost/time of calibration while in production the TQM716015 can be used in 1-bit operation; either LPM/HPM with only 3.5mA of IcQ up to +13dBm in LPM, or MPM/HPM with 11mA of IcQ up to +17dBm in MPM. Electrical Specifications Parameter Typ Units Frequency 836 MHz WCDMA mode maximum Pout1 28.3 dBm LPM Quiescent Current 3.5 mA ACLR5 -41 dBc ACLR10 -56 dBc Power Supply Current @ 28.3dBm 510 mA Rx Band Noise -132 dBm/Hz Note 1: Test Conditions WCDMA REL99 Test Mode: VCC=3.4VDC, VEN=HIGH, Tc=25°C GaAs BiHEMT / CuFlip® PA Technology Typical Quiescent Current values: LPM: 3.5 mA MPM: 11 mA HPM: 80 mA Excellent Linearity in all modes Excellent Phase Discontinuity Integrated high performance coupler Built-in voltage regulator functionality eliminating any external switch circuitry Small 10-pin, 3x3mm module Lead-free 260°C / RoHS / Halogen-free Full ESD protection Applications WCDMA B5 Applications CDMA2000 Cellular (BC0) Applications HSDPA/HSUPA/HSPA+ Applications LTE-Compatible Applications Package Style 1 10 2 9 3 8 4 7 5 6 10-Pin Laminate Module Top View (through package) 1 Data Sheet For additional information and latest specifications, see our website: www.triquint.com Revision N, August 08, 2012