TQM776011 Datasheet Multi-mode (WCDMA B1 / CDMA BC6 / HSPA+ / LTE) 3x3mm PA Module Features Functional Block Diagram VCC1 VCC2 RF IN RF OUT Vmode1 CPLR IN Vmode0 GND 2-Bit Bias Control VEN CPLR OUT Product Description The TQM776011 is fully matched Power Amplifier Module designed for use in WCDMA UMTS Band 1, CDMA BC6 (IMT) & LTE handsets. Its compact 3x3mm package including a coupler and built-in voltage regulator makes it ideal for today’s extremely small data enabled phones. Its RF performance meets the stringent linearity requirements for multi-mode operation. The TQM776011 is designed on TriQuint’s GaAs BiHEMT technology with CuFlip ® assembly offering state of the art reliability, temperature stability and ruggedness. The 3-Gain state PA die operates in LPM, MPM and HPM to maximize talk time over the entire range of operating conditions. To simplify the cost/time of calibration while in production the TQM776011 can be used in 1-bit operation; either LPM/HPM with only 4mA of IcQ up to +13dBm in LPM, or MPM/HPM with 9mA of IcQ up to +17dBm in MPM. Electrical Specifications Parameter Typ Units Frequency 1950 MHz WCDMA mode maximum Pout1 28.25 dBm 4 mA ACLR5 -41 dBc ACLR10 -57 dBc Power Supply Current @ 28.25dBm 490 mA Rx Band Noise -140 dBm/Hz LPM Quiescent Current Note 1: Test Conditions WCDMA Rel99 Test Mode: VCC=3.4VDC, VEN=HIGH, Tc=25°C GaAs BiHEMT / CuFlip® PA Technology Typical Quiescent Current values: LPM: 4 mA MPM: 9 mA HPM: 90 mA Excellent Linearity in all modes Excellent Phase Discontinuity Integrated high performance coupler Built-in voltage regulator functionality eliminating any external switch circuitry Small 10-pin, 3x3mm module Lead-free 260°C / RoHS / Halogen-free Full ESD protection Applications WCDMA B1 Applications CDMA2000 IMT (BC6) Applications HSDPA/HSUPA/HSPA+ Applications LTE-Compatible Applications Package Style 1 10 2 9 3 8 4 7 5 6 10-Pin Laminate Module Top View (through package) 1 Datasheet For additional information and latest specifications, see our website: www.triquint.com Revision Q, August 08, 2012