WINBOND W83L197R-16

W83L197R-16
2-CHIP 100MHZ CLOCK FOR BX NOTEBOOK
1.0 GENERAL DESCRIPTION
The W83L197R-16 is a Clock Synthesizer which provides all clocks required for high-speed RISC or
CISC microprocessor. Four different frequency of CPU, and PCI clocks are externally selectable with
smooth transitions. The 0.5% or 0.75% center type spread spectrum can be selected to reduce EMI.
The W83L197R-16 accepts a 14.318 MHz reference crystal as its input and runs on a 3.3V supply.
High drive PCI CLOCK outputs typically provide greater than 1 V /ns slew rate into 30 pF loads. CPU
CLOCK outputs typically provide better than 1 V /ns slew rate into 20 pF loads as maintaining 50¡Ó
5% duty cycle. The fixed frequency outputs as REF, 48 MHz provide better than 0.5V /ns slew rate.
2.0 PRODUCT FEATURES
•
Supports Pentium II CPUs
•
4 sets of CPU frequencies selection
•
2 CPU clocks (one free running CPU clock)
•
6 PCI synchronous clocks(one free running PCI clock)
•
Optional single or mixed supply:
(Vdd3 = VddC= 3.3V±5%) or (VddC = 2.5V±5%)
•
Skew form CPU to PCI clock 1.5 to 4.0 ns, CPU leads.
•
CPU clock jitter less than 200ps
•
PCI_F,PCI1:6 clock skew less than 500ps
•
¡Ó0.5% or ¡Ó0.75% center type spread spectrum function to reduce EMI
•
Programmable registers to enable/stop each output and select modes
(mode as Tri-state or Normal )
• 48 MHz for USB
• 28-pin SOP package (209mil)
-1-
Publication Release Date: Mar. 1999
Revision 0.10
W83L197R-16
PRELIMINARY
3.0 BLOCK DIAGRAM
X1
X2
Vdd3
XTAL
OSC
REF2X
CPU_STOP#
SEL100/66#
VddC
PLL1
STOP
Spread
Spectrum
CPUCLK0
CPUCLK1
¡Ò2/3/4
Vdd3
PCI
clock
Divder
PCI_STOP#
PCICLK_F
PCICLK(1:5)
STOP
5
Power
down
control
PWR_DWN#
Vdd3
Vdd3
48MHz
PLL2
4.0 PIN CONFIGURATION
Xin
Xout
Vss
PCICLK_F
PCICLK1
Vdd3
PCICLK2
PCICLK3
Vdd3
PCICLK4
PCICLK5
Vss
Vdd3
Vss
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
-2-
Vss
Vdd3
REF2X/FS0*
VddC
CPUCLK0
CPUCLK1
Vss
Vdd3
Vss
PCI_STOP#
CPU_STOP#
PWR_DWN#
48MHz/SPREAD*
SEL100/66#
Publication Release Date: Mar. 1999
Revision 0.10
W83L197R-16
PRELIMINARY
5.0 PIN DESCRIPTION
IN - Input
OUT - Output
I/O - Bi-directional Pin
# - Low active
* - Internal 250kΩ pull-up
5.1 Crystal I/O
SYMBOL
PIN
I/O
Xin
1
IN
Xout
2
OUT
FUNCTION
Crystal input with internal loading capacitors and
feedback resistors.
Crystal output at 14.318MHz nominally.
5.2 CPU, PCI Clock Outputs
SYMBOL
CPUCLK0
PIN
I/O
24,23
OUT
Low skew (< 250ps) clock outputs for host
frequencies such as CPU, Chipset and Cache.
VddC is the supply voltage for these outputs.
5,7,8,10,11
OUT
Low skew (< 250ps) PCI clock outputs.
CPUCLK1
PCICLK [ 1:5 ]
FUNCTION
PCICLK_F
4
PCI_STOP#
19
I/O
PCI_STOP# input used in power management mode
for synchronously stopping the all CPU clocks.
CPU_STOP#
18
I/O
this pin is CPU_STOP # and used in power
management mode for synchronously stopping the
all PCI clocks.
5.3 Fixed Frequency Outputs
SYMBOL
PIN
I/O
SEL100/66#
REF2X / FS0*
15
26
IN
I/O
48MHz/SPREAD*
16
I/O
-3-
FUNCTION
CPU clock frequency select pin.
Internal 250kΩ pull-up.
Latched input for FS0* to chose frequencies at initial
power up.
Reference clock during normal operation.
Internal 250kΩ pull-up.
48MHz output for USB during normal operation.
Latched input for SPREAD* to select the spread
spectrum spend at initial power up.
Publication Release Date: Mar. 1999
Revision 0.10
W83L197R-16
PRELIMINARY
5.4 Power Pins
SYMBOL
PIN
FUNCTION
VddC
25
Vdd3
6,9,13,21,27
Vss
Power supply for core logic and PLL circuitry. Connect
to 3.3V supply.
Power supply for others Connect to 3.3V supply.
3, 12,14,20,22,28
Circuit Ground.
6.0 FREQUENCY SELECTION
FS0*
SEL100/66#
CPUCLK0, CPUCLK1
PCI
1
1
100MHz
33.3MHz
1
0
66.8MHz
33.4MHz
0
1
112MHz
37.3MHz
0
0
103MHz
34.33MHz
7.0 FUNTION DESCRIPTION
7.1 SPREAD SPECTRUM FUNCTION SELECTION TABLE
SPREAD*
Spread Spectrum
Type
1
¡Ó0.5%
Center
0
¡Ó0.75%
Center
7.2 POWER MANAGEMENT FUNCTIONS
The W83L197R-16 may be disabled in the low state according to the following table in order to
reduce power consumption. All clocks are stopped in the low state, but maintain a valid high period
on transitions from running to stop. The CPU and PCI clocks transform between running and stop by
waiting for one positive edge on PCICLK_F followed by negative edge on the clock of interest, after
which high levels of the output are either enabled or disabled.
CPU_STOP#
PCI_STOP#
CPUCLK1
PCICLK1:5
PCICLK_F
XTAL & VCOs
0
0
LOW
LOW
RUNNING
RUNNING
0
1
LOW
RUNNING
RUNNING
RUNNING
1
0
RUNNING
LOW
RUNNING
RUNNING
1
1
RUNNING
RUNNING
RUNNING
RUNNING
-4-
Publication Release Date: Mar. 1999
Revision 0.10
W83L197R-16
PRELIMINARY
8.0 SPECIFICATIONS
8.1 ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Maximum conditions for extended periods may affect reliability. Unused
inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).
Symbol
Parameter
Rating
Vdd , VIN
Voltage on any pin with respect to GND
- 0.5 V to + 7.0 V
TSTG
Storage Temperature
- 65°C to + 150°C
TB
Ambient Temperature
- 55°C to + 125°C
TA
Operating Temperature
0°C to + 70°C
8.2 AC CHARACTERISTICS
Vdd3 = VddCore = 3.3V±5%, VddC = 2.5V±5% , TA = 0°C to +70°C
Parameter
Symbol
Min
Typ
Max
Units
45
50
55
%
Measured at 1.5V
4
ns
15 pF Load Measured at 1.5V
tSKEW
250
ps
15 pF Load Measured at 1.5V
Cycle to Cycle Jitter
tCCJ
200
ps
CPU
tJA
500
ps
BWJ
500
KHz
0.4
1.6
ns
15 pF Load on CPU and PCI
outputs
Output Duty Cycle
CPU to PCI Offset
Skew
PCI)
(CPU-CPU),
tOFF
(PCI-
1
Test Conditions
Absolute Jitter
Jitter Spectrum 20 dB
Bandwidth from Center
Output Rise (0.4V ~ 2.0V)
tTLH
& Fall (2.0V ~0.4V) Time
tTHL
Overshoot/Undershoot
Vover
0.7
1.5
V
22 Ω at source of 8 inch PCB
run to 15 pF load
VRBE
0.7
2.1
V
Ring Back must not enter this
range.
Beyond Power Rails
Ring Back Exclusion
-5-
Publication Release Date: Mar. 1999
Revision 0.10
W83L197R-16
PRELIMINARY
8.3 DC CHARACTERISTICS
Vdd3 = VddCore = 3.3V±5%, VddC = 2.5V±5% , TA = 0°C to +70°C
Parameter
Symbol
Min
Typ
Max
Units
0.8
Vdc
Test Conditions
Input Low Voltage
VIL
Input High Voltage
VIH
Input Low Current
IIL
-25
µA
Input High Current
IIH
10
µA
Output Low Voltage
VOL
50
mVdc
CPU_F, CPU1
Vdc
CPU_F, CPU1
2.0
Vdc
IOL = 1 mA
Output High Voltage
VOH
3.1
IOL
27
57
97
mA
CPU_F,CPI1
20.5
53
139
mA
PCI_F,PCI1:6
40
85
140
mA
IOAPIC
50
74
152
mA
REF2X
25
37
76
mA
48,24MHz
25
55
97
mA
CPU_F,CPI1
31
55
189
mA
PCI_F,PCI1:6
40
87
155
mA
IOAPIC
54
88
188
mA
REF2X
27
44
94
mA
48,24MHz
IOH = -1mA
Output Low Current
Output High Current
IOH
-6-
Publication Release Date: Mar. 1999
Revision 0.10
W83L197R-16
PRELIMINARY
8.4 BUFFER CHARACTERISTICS
8.4.1 TYPE 1 BUFFER FOR CPUCLK
Parameter
Symbol
Min
Pull-Up Current Min
IOH(min)
-27
Pull-Up Current Max
IOH(max)
Pull-Down Current Min
IOL(min)
Pull-Down Current Max
IOL(max)
Rise/Fall Time Min
Between 0.4 V and 2.0 V
TRF(min)
Rise/Fall Time Max
Between 0.4 V and 2.0 V
TRF(max)
Typ
Max
-27
27
0.4
1.6
Units
Test Conditions
mA
Vout = 1.0 V
mA
Vout = 2.0V
mA
Vout = 1.2 V
mA
Vout = 0.3 V
ns
10 pF Load
ns
20 pF Load
8.4.2 TYPE 3 BUFFER FOR REF2X, 48MHZ
Parameter
Symbol
Min
Pull-Up Current Min
IOH(min)
-29
Pull-Up Current Max
IOH(max)
Pull-Down Current Min
IOL(min)
Pull-Down Current Max
IOL(max)
Rise/Fall Time Min
Between 0.8 V and 2.0 V
TRF(min)
Rise/Fall Time Max
TRF(max)
Typ
Max
Units
Test Conditions
mA
Vout = 1.0 V
mA
Vout = 3.135V
mA
Vout = 1.95 V
mA
Vout = 0.4 V
ns
10 pF Load
4.0
ns
20 pF Load
Max
Units
-23
29
1.0
Between 0.8 V and 2.0 V
8.4.3 TYPE 5 BUFFER FOR PCICLK(1:5,F)
Parameter
Symbol
Min
Pull-Up Current Min
IOH(min)
-33
Pull-Up Current Max
IOH(max)
Pull-Down Current Min
IOL(min)
Pull-Down Current Max
IOL(max)
Rise/Fall Time Min
Between 0.8 V and 2.0 V
TRF(min)
Rise/Fall Time Max
TRF(max)
Typ
-33
30
38
0.5
2.0
Test Conditions
mA
Vout = 1.0 V
mA
Vout = 3.135 V
mA
Vout = 1.95 V
mA
Vout = 0.4 V
ns
15 pF Load
ns
30 pF Load
Between 0.8 V and 2.0 V
-7-
Publication Release Date: Mar. 1999
Revision 0.10
W83L197R-16
PRELIMINARY
9.0 OPERATION OF DUAL FUCTION PINS
Pin16 and pin26 are dual function pins and are used for selecting different functions in this device
(see Pin description). During power up, these pins are in input mode (see Fig1), therefore, and are
considered input select pins. When Vdd reaches 2.5V, the logic level that is present on these pins
are latched into their appropriate internal registers. Once the correct information are properly latched,
these pins will change into output pins and will be pulled low by default. At the end of the power up
timer (within 3 ms) outputs starts to toggle at the specified frequency.
2.5V
#16 48/SPREAD*
#26 REF2X/FS0*
Vdd
Output
pull-low
Output
tri-state
Within 3ms
Input
All other clocks
Output
Output
pull-low
Output
tri-state
Each of these pins are a large pull-up resistor ( 250 kΩ @3.3V ) inside. The default state will be logic
1, but the internal pull-up resistor may be too large when long traces or heavy load appear on these
dual function pins. Under these conditions, an external 10 kΩ resistor is recommended to be
connected to Vdd if logic 1 is expected. The same 10 kΩ connection to ground if a logic 0 is desired.
The 10 kΩ resistor should be place before the serious terminating resistor. Note that these logic will
only be latched at initial power on.
If optional EMI reducing capacitor are needed, they should be placed as close to the series
terminating resistor as possible and after the series terminating resistor. These capacitor has typical
values ranging from 4.7pF to 22pF.
-8-
Publication Release Date: Mar. 1999
Revision 0.10
W83L197R-16
PRELIMINARY
Vdd
10kΩ
Series
Terminating
Resistor
Device
Pin
Clock
Trace
EMI
Reducing
Cap
10kΩ
Optional
Ground
Ground
Programming Header
Vdd Pad
Ground Pad
Series
Terminating
Resistor
10kΩ
Device
Pin
Clock
Trace
EMI
Reducing
Cap
Optional
Ground
-9-
Publication Release Date: Mar. 1999
Revision 0.10
W83L197R-16
PRELIMINARY
10.0 ORDERING INFORMATION
Part Number
Package Type
Production Flow
W83L197R-16
28 PIN SOP (209mil)
Commercial, 0°C to +70°C
11.0 HOW TO READ THE TOP MARKING
W83L197R-16
28051234
814OBB
1st line: Winbond logo and the type number: W83L197R-16
2nd line: Tracking code 2 8051234
2: wafers manufactured in Winbond FAB 2
8051234: wafer production series lot number
3rd line: Tracking code 814 G B B
814: packages made in '98, week 14
G: assembly house ID; A means ASE, S means SPIL, G means GR
BB: IC revision
All the trade marks of products and companies mentioned in this data sheet belong to
their respective owners.
- 10 -
Publication Release Date: Mar. 1999
Revision 0.10
W83L197R-16
PRELIMINARY
12.0 PACKAGE DRAWING AND DIMENSIONS
28-SOP
D
2
15
DIMENSION IN MM
SYMBOL
DTEAIL A
HE E
1
14
A
A1
A2
b
c
D
E
HE
e
L
L1
Y
θ
MIN.
NOM
MAX.
DIMENSION IN INCH
MIN.
NOM
2.00
0.05
1.65 1.75
0.22
0.09
9.90 10.20
5.00 5.30
7.40 7.80
0.65
0.55 0.75
1.25
0
1.85
0.38
0.25
10.50
5.60
8.20
MAX.
0.079
0.002
0.065
0.009
0.004
0.389
0.197
0.291
0.069 0.073
0.015
0.010
0.401 0.413
0.209 0.220
0.307 0.323
0.0256
0.95
0.10
8
0.021 0.030 0.037
0.050
0.004
0
8
A2 A
SEATING PLANE
θ
DETAIL A
Y
e
b
SEATING PLANE
L
L1
A1
Headquarters
Winbond Electronics (H.K.) Ltd.
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: 886-35-770066
FAX: 886-35-789467
www: http://www.winbond.com.tw/
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: 852-27516023-7
FAX: 852-27552064
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(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
TLX: 16485 WINTPE
Please note that all data and specifications are subject to change without notice. All the
trade marks of products and companies mentioned in this data sheet belong to their
respective owners.
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal
injury. Winbond customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Winbond for any damages resulting
from such improper use or sale.
- 11 -
Publication Release Date: Mar. 1999
Revision 0.10