AK584096AS / AK584096AG 4,194,304 x 8 Bit CMOS Dynamic Random Access Memory ACCUTEK DESCRIPTION MICROCIRCUIT CORPORATION Front View The Accutek AK584096 high density memory module is CMOS DRAM organized in 4 Meg x 8 bit words. The assembly consists of eight standard 4 Meg x 1 DRAMs in plastic SOJ packages mounted on the front side of a printed circuit board. The module can be configured as a leadless 30 pad SIM or a leaded 30 pin SIP. The module is only 0.800 inch high (same height as a standard 1 Meg module) making it ideally suited for applications with low height restrictions. 30-Pin SIM 30-Pin SIP The operation of the AK584096 is identical to eight 4 Meg x 1 DRAMs. The data input is tied to the data output and brought out separately for each device, with common RAS, CAS and WE control. This common I/O feature dictates the use of early-write cycles to prevent contention of D and Q. Since the Write-Enable (WE) signal must always go low before CAS in a write cycle, Read-Write and Read-Modify-Write operation is not possible. FEATURES 30 1 1 · Operating free air temperature 00C to 700C · 4,194,304 x 8 bit organization · Upward compatible with AK5816384 · Optional 30 Pad leadless SIM (Single In-Line Module) or 30 Pin leaded SIP (Single In-Line Package) · Downward compatible with AK58256 and AK581024 · JEDEC standard pinout · Each device has common D and Q lines with common RAS, CAS and WE control · CAS-before-RAS refresh · Power 4.40 Watt Max Active (80 nSEC) 3.75 Watt Max Active (100 nSEC) 44 mW Max Standby PIN NOMENCLATURE PIN ASSIGNMENT FUNCTIONAL DIAGRAM PIN # SYMBOL PIN # SYMBOL 1 Vcc 16 DQ5 Address Inputs 2 CAS 17 A8 Column Address Strobe 3 DQ1 18 A9 4 A0 19 A10 DQ6 DQ1 - DQ8 Data In / Data Out A0 - A10 CAS RAS Row Address Strobe 5 A1 20 WE Write Enable 6 DQ2 21 WE Vcc 5v Supply 7 A2 22 Vss Vss Ground 8 A3 23 DQ7 NC No Connect MODULE OPTIONS Leadless SIM: AK584096AS Leaded SIP: AK584096AG 9 Vss 24 NC 10 DQ3 25 DQ8 11 A4 26 NC 12 A5 27 RAS 13 DQ4 28 NC 14 A6 29 NC 15 A7 30 Vcc MECHANICAL DIMENSIONS ORDERING INFORMATION PART NUMBER CODING INTERPRETATION Position 1 2 3 6 Inches 7 8 0.425 0.375 .100 .060 0.325 0.275 1 1 3.525 3.475 3.100 3.090 30 0.200 MAX 0.053 0.047 Product AK = Accutek Memory Type 4 = Dynamic RAM 5 = CMOS Dynamic RAM 6 = Static RAM Organization/Word Width 1 = by 1 16 = by 16 4 = by 4 32 = by 32 8 = by 8 36 = by 36 9 = by 9 Size/Bits Depth 64 = 64K 4096 = 4 MEG 256 = 256K 8192 = 8 MEG 1024 = 1 MEG 16384 = 16 MEG Package Type G = Single In-Line Package (SIP) S = Single In-Line Module (SIM) D = Dual In-Line Package (DIP) W = .050 inch Pitch Edge Connect Z = Zig-Zag In-Line Package (ZIP) Special Designation P = Page Mode N = Nibble Mode K = Static Column Mode W = Write Per Bit Mode V = Video Ram Separator - = Commercial 00C to +700C M = Military Equivalent Screened (-550C to +1250C) I = Industrial Temperature Tested (-450C to +850C) X = Burned In Speed (first two significant digits) DRAMS SRAMS 50 = 50 nS 8 = 8 nS 60 = 60 nS 10 = 10 nS 70 = 70 nS 12 = 12 nS 80 = 80 nS 15 = 15 nS 0.815 0.785 8 5 0.024 0.016 7 4 0.100 TYP 6 3 0.100 TYP 5 2 0.815 0.785 4 1 0.100 TYP The numbers and coding on this page do not include all variations available but are show as examples of the most widely used variations. Contact Accutek if other information is required. EXAMPLES: AK584096ASP-80 4 Meg x 8, 80 nSEC DRAM 30 pin SIM Configuration, Page Mode AK584096AGN-70 4 Meg x 8, 70 nSEC Dram 30 pin SIP Configuration, Nibble Mode ACCUTEK MICROCIRCUIT CORPORATION 5 NEW PASTURE ROAD NEWBURYPORT, MA 01950-4040 PHONE: 978-465-6200 FAX: 978-462-3396 Email: [email protected] Internet: www.accutekmicro.com Accutek reserves the right to make changes in specifications at any time and without notice. Accutek does not assume any responsibility for the use of any circuitry described; no circuit patent licenses are implied. Preliminary data sheets contain minimum and maximum limits based upon design objectives, which are subject to change upon full characterization over the specific operating conditions.