A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches Features and Benefits Description ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ The A1220, A1221, A1222, and A1223 Hall-effect sensor ICs are extremely temperature-stable and stress-resistant devices especially suited for operation over extended temperature ranges to 150°C. Superior high-temperature performance is made possible through dynamic offset cancellation, which reduces the residual offset voltage normally caused by device overmolding, temperature dependencies, and thermal stress. Each device includes on a single silicon chip a voltage regulator, Hallvoltage generator, small-signal amplifier, chopper stabilization, Schmitt trigger, and a short-circuit protected open-drain output to sink up to 25 mA. A south pole of sufficient strength turns the output on. A north pole of sufficient strength is necessary to turn the output off. Symmetrical latch switchpoints Resistant to physical stress Superior temperature stability Output short-circuit protection Operation from unregulated supply down to 3 V Reverse battery protection Solid-state reliability Small package sizes Packages: An onboard regulator permits operation with supply voltages of 3 to 24 V. The advantage of operating down to 3 V is that the device can be used in 3-V applications or with additional external resistance in series with the supply pin for greater protection against high voltage transient events. 3-pin SOT23W (suffix LH) Two package styles provide magnetically optimized packages for most applications. Package type LH is a modified 3-pin SOT23W surface mount package while UA is a three-pin ultramini SIP for through hole mounting. Both packages are lead (Pb) free, with 100% matte tin plated leadframes. (A1220, A1221 (A1223) and A1222) 3-pin SIP (suffix UA) Not to scale Functional Block Diagram VCC Amp Sample and Hold Dynamic Offset Cancellation Regulator Low-Pass Filter To All Subcircuits VOUT Control Current Limit GND A1220-DS, Rev. 14 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches Selection Guide Part Number A1220ELHLX-T Packing1 13-in. reel, 10000 pieces/reel Mounting Ambient, TA BRP (Min) BOP (Max) –40 40 –90 90 –150 150 –180 180 3-pin SOT23W surface mount A1220ELHLT-T2 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1220EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole A1220LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1220LLHLT-T2 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1220LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole A1221ELHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1221ELHLT-T2 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1221EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole A1221LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1221LLHLT-T2 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1221LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole A1222ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1222ELHLX-T2 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1222EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole A1222LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1222LLHLX-T2 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1222LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole A1223ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1223ELHLX-T2 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1223EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole A1223LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1223LLHLX-T2 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1223LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole –40ºC to 85ºC –40ºC to 150ºC –40ºC to 85ºC –40ºC to 150ºC –40ºC to 85ºC –40ºC to 150ºC –40ºC to 85ºC –40ºC to 150ºC 1Contact Allegro for additional packing options. 2Available through authorized Allegro distributors only. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 2 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches Absolute Maximum Ratings Characteristic Symbol Notes Rating Units Forward Supply Voltage VCC 26.5 V Reverse Supply Voltage VRCC –30 V Output Off Voltage VOUT 26 V Continuous Output Current IOUT 25 mA Reverse Output Current IROUT –50 mA Range E –40 to 85 ºC Range L Operating Ambient Temperature TA –40 to 150 ºC Maximum Junction Temperature TJ(max) 165 ºC Tstg –65 to 170 ºC Storage Temperature GND Pin-out Diagrams 3 1 2 3 GND VOUT 2 VCC 1 VOUT Package UA VCC Package LH Terminal List Name VCC VOUT GND Description Connects power supply to chip Output from circuit Ground Number Package LH Package UA 1 1 2 3 3 2 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 3 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches ELECTRICAL CHARACTERISTICS Valid valid over full operating voltage and ambient temperature ranges; unless otherwise noted Characteristics Symbol Test Conditions Min. Typ.1 Max. Unit2 – 24 V Electrical Characteristics Forward Supply Voltage Output Leakage Current Output Saturation Voltage VCC Operating, TJ < 165°C 3 IOUTOFF VOUT = 24 V, B < BRP – – 10 μA VOUT(SAT) IOUT = 20 mA, B > BOP – 185 500 mV Output Current Limit IOM B > BOP 30 – 60 mA Power-On Time3 tPO VCC > 3.0 V, B < BRP(min) – 10 G, B > BOP(max) + 10 G – – 25 μs Chopping Frequency fC – 800 – kHz Output Rise Time3,4 tr RL = 820 Ω, CL = 20 pF – 0.2 2 μs tf Output Fall Time3,4 Supply Current Reverse Supply Current RL = 820 Ω, CL = 20 pF – 0.1 2 μs ICC(ON) B > BOP, VCC = 12 V – – 4 mA ICC(OFF) B < BRP, VCC = 12 V – – 4 mA VRCC = –30 V – – –5 mA IRCC Supply Zener Clamp Voltage VZ ICC = 5 mA; TA = 25°C 28 – – V Zener Impedance IZ ICC = 5 mA; TA = 25°C – 50 – Ω A1220 5 22 40 G A1221 15 50 90 G A1222 70 110 150 G A1223 100 150 180 G A1220 –40 –23 –5 G Magnetic Characteristics Operate Point Release Point Hysteresis BOP BRP BHYS A1221 –90 –50 –15 G A1222 –150 –110 –70 G A1223 –180 –150 –100 G A1220 10 45 80 G A1221 30 100 180 G 140 220 300 G 200 300 360 G A1222 (BOP – BRP) A1223 1Typical data are are at TA = 25°C and VCC = 12 V, and are for initial design estimations only. G (gauss) = 0.1 mT (millitesla). 3Guaranteed by device design and characterization. 4C = oscilloscope probe capacitance. L 21 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 4 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information Characteristic Symbol Test Conditions RθJA Maximum Allowable VCC (V) Package Thermal Resistance Value Units Package LH, 1-layer PCB with copper limited to solder pads 228 ºC/W Package LH, 2-layer PCB with 0.463 in.2 of copper area each side connected by thermal vias 110 ºC/W Package UA, 1-layer PCB with copper limited to solder pads 165 ºC/W Power Derating Curve TJ(max) = 165ºC; ICC = ICC(max) 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 VCC(max) Package LH, 2-layer PCB (RQJA = 110 ºC/W) Package UA, 1-layer PCB (RQJA = 165 ºC/W) Package LH, 1-layer PCB (RQJA = 228 ºC/W) VCC(min) 20 40 60 80 100 120 140 160 180 Power Dissipation, PD (mW) Power Dissipation versus Ambient Temperature 1900 1800 1700 1600 1500 1400 1300 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 Pa (R cka ge QJ A = L 11 H, 2 0 º -la Pac C/ ye W (R kage ) r PC UA QJA = B , 165 1-la ºC/ yer W) PC B Pac k (R age LH , QJA = 228 1-laye ºC/W r PC B ) 20 40 60 80 100 120 Temperature (°C) 140 160 180 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 5 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches Characteristic Performance A1220, A1221, A1222, and A1223 Electrical Characteristics Average Supply Current (On) versus Supply Voltage 6.0 5.5 5.0 3.0V 3.8V 4.2V 12V 24V 4.5 Icc(AV)(mA) ICC(AV) (mA) Average Supply Current (On) versus Temperature 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 4.0 150°C 25°C -40°C 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -60 -40 -20 0 20 40 60 80 2 100 120 140 160 6 10 14 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 22 26 Average Supply Current (Off) versus Supply Voltage 6.0 5.5 5.0 4.5 3.0V 3.8V 4.2V 12V 24V Icc(AV)(mA) ICC(AV) (mA) Average Supply Current (Off) versus Temperature 4.0 150°C 25°C -40°C 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -60 -40 -20 0 20 40 60 80 2 100 120 140 160 6 10 14 18 22 26 VCC (V) TA (°C) Saturation Voltage versus Temperature Saturation Voltage versus Supply Voltage 300 300 250 250 2.6V 3.0V 3.8V 4.2V 12V 24V 200 150 100 50 VOUT(SAT) (mV) VOUT(SAT) (mV) 18 VCC (V) TA (°C) 200 150°C 25°C -40°C 150 100 50 0 0 -60 -40 -20 0 20 40 60 TA (°C) 80 100 120 140 160 0 2 4 6 8 10 12 14 16 18 20 22 24 26 VCC (V) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 6 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches A1220 Magnetic Characteristics Operate Point versus Supply Voltage Operate Point versus Temperature 40 40 35 35 30 BOP (G) 25 20 15 30 (°C) -40 25 150 25 BOP (G) (V) 3.0 3.8 4.2 12 24 20 15 10 10 5 5 0 0 -60 -40 -20 0 20 40 60 80 2 100 120 140 160 6 10 0 0 -5 -5 22 26 -10 -10 -20 -25 -15 BRP (G) (V) 3.0 3.8 4.2 12 24 -15 BRP (G) 18 Release Point versus Supply Voltage Release Point versus Temperature (°C) -40 25 150 -20 -25 -30 -30 -35 -35 -40 -40 -60 -40 -20 0 20 40 60 TA (°C) 80 100 120 140 160 2 Switchpoint Hysteresis versus Temperature 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 (V) 3.0 3.8 4.2 12 24 -60 -40 -20 0 20 40 60 TA (°C) 80 100 120 140 160 6 10 14 VCC (V) 18 22 26 Switchpoint Hysteresis versus Supply Voltage BHYS (G) BHYS (G) 14 VCC (V) TA (°C) 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 (°C) -40 25 150 2 6 10 14 18 22 26 VCC (V) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 7 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches A1221 Magnetic Characteristics Operate Point versus Supply Voltage Operate Point versus Temperature 90 90 80 80 70 70 60 (V) 2.6 12 24 50 40 30 BOP (G) BOP (G) 60 (°C) -40 25 150 50 40 30 20 20 10 10 0 0 -60 -40 -20 0 20 40 60 80 2 100 120 140 160 6 10 0 0 -10 -10 -20 -20 (V) 2.6 12 24 -40 22 26 -50 -30 BRP (G) -30 BRP (G) 18 Release Point versus Supply Voltage Release Point versus Temperature -50 -60 -70 -70 -80 -80 -90 (°C) -40 25 150 -40 -60 -90 -60 -40 -20 0 20 40 60 TA (°C) 80 100 120 140 160 2 Switchpoint Hysteresis versus Temperature 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 -60 (V) 2.6 12 24 -40 -20 0 20 40 60 TA (°C) 80 100 120 140 160 6 10 14 VCC (V) 18 22 26 Switchpoint Hysteresis versus Supply Voltage BHYS (G) BHYS (G) 14 VCC (V) TA (°C) 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 (°C) -40 25 150 2 6 10 14 18 22 26 VCC (V) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 8 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches A1222 Magnetic Characteristics Operate Point versus Supply Voltage Operate Point versus Temperature 150 180 140 170 160 130 150 (V) 2.6 24 110 140 BOP (G) BOP (G) 120 100 (°C) -40 25 150 130 120 110 100 90 90 80 70 -60 80 70 -40 -20 0 20 40 60 80 2 100 120 140 160 6 10 18 22 26 Release Point versus Supply Voltage Release Point versus Temperature -70 -70 -80 -80 -90 -90 -100 -100 (V) 2.6 24 -110 BRP (G) BRP (G) 14 VCC (V) TA (°C) -110 (°C) -40 25 150 -120 -130 -120 -140 -130 -150 -160 -140 -170 -180 -150 -60 -40 -20 0 20 40 60 TA (°C) 80 100 120 140 160 2 300 280 280 260 260 240 (V) 2.6 24 220 200 14 VCC (V) 18 22 26 240 (°C) -40 25 150 220 200 180 180 160 160 140 -60 10 Switchpoint Hysteresis versus Supply Voltage 300 BHYS (G) BHYS (G) Switchpoint Hysteresis versus Temperature 6 140 -40 -20 0 20 40 60 TA (°C) 80 100 120 140 160 2 6 10 14 18 22 26 VCC (V) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 9 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches Functional Description Operation The output of these devices switches low (turns on) when a magnetic field perpendicular to the Hall element exceeds the operate point threshold, BOP (see panel A of figure 1). After turn-on, the output voltage is VOUT(SAT) . The output transistor is capable of sinking current up to the short circuit current limit, IOM, which is a minimum of 30 mA. When the magnetic field is reduced below the release point, BRP , the device output goes high (turns off). The difference in the magnetic operate and release points is the hysteresis, BHYS , of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical vibration and electrical noise. Removal of the magnetic field will leave the device output latched on if the last crossed switchpoint is BOP, or latched off if the last crossed switch point is BRP. Powering-on the device in the hysteresis range (less than BOP and higher than BRP) will give an indeterminate output state. The correct state is attained after the first excursion beyond BOP or BRP . Extensive applications information for Hall effect devices is available in: • Hall-Effect IC Applications Guide, Application Note 27701 • Guidelines for Designing Subassemblies Using Hall-Effect Devices, Application Note 27703.1 • Soldering Methods for Allegro’s Products – SMT and ThroughHole, Application Note 26009 All are provided in Allegro Electronic Data Book, AMS-702, and the Allegro Web site, www.allegromicro.com. VS V+ VOUT Switch to Low Switch to High VCC VCC CBYP 0.1 μF 0 BOP B– BRP VOUT(SAT) 0 Applications It is strongly recommended that an external bypass capacitor be connected (in close proximity to the Hall element) between the supply and ground of the device to reduce both external noise and noise generated by the chopper stabilization technique. As is shown in panel B of figure 1, a 0.1 μF capacitor is typical. A122x VOUT RL Output GND B+ BHYS (A) (B) Figure 1. Switching behavior of latches. In panel A, on the horizontal axis, the B+ direction indicates increasing south polarity magnetic field strength, and the B– direction indicates decreasing south polarity field strength (including the case of increasing north polarity). This behavior can be exhibited when using a circuit such as that shown in panel B. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 10 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches Chopper Stabilization Technique When using Hall effect technology, a limiting factor for switchpoint accuracy is the small signal voltage developed across the Hall element. This voltage is disproportionally small relative to the offset that can be produced at the output of the Hall element. This makes it difficult to process the signal while maintaining an accurate, reliable output over the specified operating temperature and voltage ranges. Chopper stabilization is a unique approach used to minimize Hall offset on the chip. The patented Allegro technique, namely Dynamic Quadrature Offset Cancellation, removes key sources of the output drift induced by thermal and mechanical stresses. This offset reduction technique is based on a signal modulationdemodulation process. The undesired offset signal is separated from the magnetic field-induced signal in the frequency domain, through modulation. The subsequent demodulation acts as a modulation process for the offset, causing the magnetic field induced signal to recover its original spectrum at baseband, while the dc offset becomes a high-frequency signal. The magnetic sourced signal then can pass through a low-pass filter, while the modulated DC offset is suppressed. This configuration is illustrated in figure 2. The chopper stabilization technique uses a 400 kHz high frequency clock. For demodulation process, a sample and hold technique is used, where the sampling is performed at twice the chopper frequency (800 kHz). This high-frequency operation allows a greater sampling rate, which results in higher accuracy and faster signal-processing capability. This approach desensitizes the chip to the effects of thermal and mechanical stresses, and produces devices that have extremely stable quiescent Hall output voltages and precise recoverability after temperature cycling. This technique is made possible through the use of a BiCMOS process, which allows the use of low-offset, low-noise amplifiers in combination with high-density logic integration and sample-and-hold circuits. The repeatability of magnetic field-induced switching is affected slightly by a chopper technique. However, the Allegro high frequency chopping approach minimizes the affect of jitter and makes it imperceptible in most applications. Applications that are more likely to be sensitive to such degradation are those requiring precise sensing of alternating magnetic fields; for example, speed sensing of ring-magnet targets. For such applications, Allegro recommends its digital device families with lower sensitivity to jitter. For more information on those devices, contact your Allegro sales representative. Regulator Hall Element Amp Sample and Hold Clock/Logic Low-Pass Filter Figure 2. Model of chopper stabilization technique Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 11 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches Power Derating The device must be operated below the maximum junction temperature of the device, TJ(max). Under certain combinations of peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors affecting operating TJ. (Thermal data is also available on the Allegro MicroSystems website.) The Package Thermal Resistance, RJA, is a figure of merit summarizing the ability of the application and the device to dissipate heat from the junction (die), through all paths to the ambient air. Its primary component is the Effective Thermal Conductivity, K, of the printed circuit board, including adjacent devices and traces. Radiation from the die through the device case, RJC, is relatively small component of RJA. Ambient air temperature, TA, and air motion are significant external factors, damped by overmolding. The effect of varying power levels (Power Dissipation, PD), can be estimated. The following formulas represent the fundamental relationships used to estimate TJ, at PD. PD = VIN × IIN T = PD × RJA TJ = TA + ΔT (1) (2) (3) For example, given common conditions such as: TA= 25°C, VCC = 12 V, ICC = 1.6 mA, and RJA = 165 °C/W, then: A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max), at a selected RJA and TA. Example: Reliability for VCC at TA = 150°C, package LH, using a minimum-K PCB. Observe the worst-case ratings for the device, specifically: RJA = 228°C/W, TJ(max) = 165°C, VCC(max) = 24 V, and ICC(max) = 4 mA. Calculate the maximum allowable power level, PD(max). First, invert equation 3: Tmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C This provides the allowable increase to TJ resulting from internal power dissipation. Then, invert equation 2: PD(max) = Tmax ÷ RJA = 15°C ÷ 228 °C/W = 66 mW Finally, invert equation 1 with respect to voltage: VCC(est) = PD(max) ÷ ICC(max) = 66 mW ÷ 4 mA = 16.4 V The result indicates that, at TA, the application and device can dissipate adequate amounts of heat at voltages ≤VCC(est). Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reliable operation between VCC(est) and VCC(max) requires enhanced RJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and VCC(max) is reliable under these conditions. PD = VCC × ICC = 12 V × 1.6 mA = 19 mW T = PD × RJA = 19 mW × 165 °C/W = 3°C TJ = TA + T = 25°C + 3°C = 28°C Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 12 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches Package LH, 3-Pin (SOT-23W) +0.12 2.98 –0.08 1.49 D 4°±4° 3 A +0.020 0.180–0.053 0.96 D +0.10 2.90 –0.20 +0.19 1.91 –0.06 2.40 0.70 D 0.25 MIN 1.00 2 1 0.55 REF 0.25 BSC 0.95 Seating Plane Gauge Plane 8X 10° REF B PCB Layout Reference View Branded Face 1.00 ±0.13 C Standard Branding Reference View +0.10 0.05 –0.05 0.95 BSC 0.40 ±0.10 For Reference Only; not for tooling use (reference dwg. 802840) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Active Area Depth, 0.28 mm REF B Reference land pattern layout All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances C Branding scale and appearance at supplier discretion D Hall element, not to scale NNT A1220, A1221, A1222, and A1223 1 N = Last two digits of device part number T = Temperature code (letter) NNN A1220 and A1221 only 1 N = Last three digits of device part number Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 13 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches Package UA, 3-Pin SIP (A1220, A1221, and A1222) +0.08 4.09 –0.05 45° B C E 2.04 1.52 ±0.05 1.44 E Mold Ejector Pin Indent +0.08 3.02 –0.05 E Branded Face 45° 1 2.16 MAX D Standard Branding Reference View = Supplier emblem N = Last two digits of device part number T = Temperature code 0.79 REF A 0.51 REF NNT 1 2 3 +0.03 0.41 –0.06 15.75 ±0.51 For Reference Only; not for tooling use (reference DWG-9049) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Dambar removal protrusion (6X) B Gate burr area C Active Area Depth, 0.50 mm REF +0.05 0.43 –0.07 D Branding scale and appearance at supplier discretion E Hall element, not to scale 1.27 NOM Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 14 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches Package UA, 3-Pin SIP (A1223) +0.08 4.09 –0.05 45° B E C 2.04 1.52 ±0.05 1.44 E +0.08 3.02 –0.05 10° Mold Ejector Pin Indent E Branded Face 45° 0.79 REF A 1.02 MAX NNN 1 1 2 D Standard Branding Reference View 3 = Supplier emblem N = Last three digits of device part number +0.03 0.41 –0.06 14.99 ±0.25 For Reference Only; not for tooling use (reference DWG-9065) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown +0.05 0.43 –0.07 A Dambar removal protrusion (6X) B Gate and tie bar burr area C Active Area Depth, 0.50 mm REF D Branding scale and appearance at supplier discretion E Hall element (not to scale) 1.27 NOM Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 15 A1220, A1221, A1222, and A1223 Chopper Stabilized Precision Hall Effect Latches Revision History Revision Current Revision Date Rev. 14 July 12, 2012 Description of Revision Update UA package drawing Copyright ©2009-2012, Allegro MicroSystems, Inc. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 16