AP03N90P-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ 100% Avalanche Test
D
▼ Simple Drive Requirement
BVDSS
900V
RDS(ON)
5.2Ω
ID
▼ Fast Switching Characteristic
▼ RoHS Compliant & Halogen-Free
3A
G
S
Description
AP03N90 series are specially designed as main switching devices for
universal 90~265VAC off-line AC/DC converter applications.
The TO-220 package is widely preferred for commercial-industrial
applications. The device is suited for switch mode power supplies, DCAC converters and high current high speed switching circuits.
G
TO-220(P)
D
S
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
900
V
VGS
Gate-Source Voltage
+30
V
ID@TC=25℃
Continuous Drain Current, V GS @ 10V
3
A
ID@TC=100℃
Continuous Drain Current, V GS @ 10V
1.89
A
10
A
83.3
W
4.5
mJ
1
IDM
Pulsed Drain Current
PD@TC=25℃
Total Power Dissipation
3
EAS
Single Pulse Avalanche Energy
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Value
Units
Rthj-c
Maximum Thermal Resistance, Junction-case
1.5
℃/W
Rthj-a
Maximum Thermal Resistance, Junction-ambient
62
℃/W
Data & specifications subject to change without notice
1
201101171
AP03N90P-HF
o
Electrical Characteristics@Tj=25 C(unless otherwise specified)
Symbol
BVDSS
Parameter
Test Conditions
Drain-Source Breakdown Voltage
2
Min.
Typ.
Max. Units
VGS=0V, ID=250uA
900
-
-
V
VGS=10V, ID=1.2A
-
-
5.2
Ω
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
2
-
4
V
gfs
Forward Transconductance
VDS=10V, ID=1A
-
2
-
S
IDSS
Drain-Source Leakage Current
VDS=720V, VGS=0V
-
-
25
uA
IGSS
Gate-Source Leakage
VGS=+30V, VDS=0V
-
-
+100
nA
ID=1A
-
18
29
nC
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=480V
-
3.5
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
7
-
nC
2
td(on)
Turn-on Delay Time
VDD=300V
-
20
-
ns
tr
Rise Time
ID=1A
-
14
-
ns
td(off)
Turn-off Delay Time
RG=50Ω
-
105
-
ns
tf
Fall Time
VGS=10V
-
24
-
ns
Ciss
Input Capacitance
VGS=0V
-
800
1280
pF
Coss
Output Capacitance
VDS=25V
-
55
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
4
-
pF
Rg
Gate Resistance
f=1.0MHz
-
4
6
Ω
Min.
Typ.
IS=1.2A, VGS=0V
-
-
1.5
V
Source-Drain Diode
Symbol
VSD
Parameter
Forward On Voltage
2
2
Test Conditions
Max. Units
trr
Reverse Recovery Time
IS=1A, VGS=0V
-
320
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
1.3
-
μC
Notes:
1.Pulse width limited by max. junction temperature.
2.Pulse test
o
3.Starting Tj=25 C , VDD=50V , L=1mH , RG=25Ω
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP03N90P-HF
4
2
o
10V
8.0V
7.0V
6.0V
V G =5.0V
3
o
10V
7.0V
5.0V
V G =4.5V
T C =150 C
2
ID , Drain Current (A)
ID , Drain Current (A)
T C =25 C
2
1
1
1
0
0
0
0
8
16
24
32
0
8
V DS , Drain-to-Source Voltage (V)
16
24
32
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
3
1.2
1.1
Normalized RDS(ON)
Normalized BVDSS (V)
I D =1.2A
V G =10V
1
2
1
0.9
0.8
0
-50
0
50
100
150
-50
o
0
50
100
150
T j , Junction Temperature ( o C )
T j , Junction Temperature ( C)
Fig 3. Normalized BVDSS v.s. Junction
Fig 4. Normalized On-Resistance
Temperature
v.s. Junction Temperature
1.6
4
Normalized VGS(th) (V)
1.4
3
T j = 25 o C
IS (A)
o
T j = 150 C
2
1.2
1
0.8
1
0.6
0
0.4
0
0.2
0.4
0.6
0.8
1
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.2
-50
0
50
100
150
o
T j , Junction Temperature ( C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP03N90P-HF
12
f=1.0MHz
1200
1000
V DS =480V
8
C iss
800
C (pF)
VGS , Gate to Source Voltage (V)
I D =1A
10
6
600
4
400
2
200
0
C oss
C rss
0
0
4
8
12
16
20
24
1
5
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
13
17
21
25
29
Fig 8. Typical Capacitance Characteristics
1
Normalized Thermal Response (Rthjc)
100
10
Operation in this area
limited by RDS(ON)
ID (A)
9
V DS , Drain-to-Source Voltage (V)
100us
1
1ms
10ms
100ms
DC
0.1
o
T c =25 C
Single Pulse
Duty factor=0.5
0.2
0.1
0.1
0.05
PDM
t
0.02
T
0.01
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
0.01
1
10
100
1000
10000
0.00001
0.0001
0.001
0.01
0.1
1
10
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
10V
QGS
QGD
10%
VGS
td(on) tr
td(off) t
f
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
4