AP9410GH-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Low On-resistance
D
▼ Simple Drive Requirement
▼ Fast Switching Characteristic
30V
RDS(ON)
6mΩ
ID
G
▼ RoHS Compliant & Halogen-Free
BVDSS
75A
S
Description
Advanced Power MOSFETs from APEC provide the designer with the
best combination of fast switching, ruggedized device design, low on□
resistance and cost-effectiveness.
G
D
S
TO-252(H)
The TO-252 package is widely preferred for commercial-industrial
surface mount applications and suited for low voltage applications such
as C/DC converters.
Absolute Maximum Ratings
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID@TC=25℃
Continuous Drain Current, V GS @ 4.5V
ID@TC=100℃
Continuous Drain Current, V GS @ 4.5V
4
1
IDM
Pulsed Drain Current
PD@TC=25℃
Total Power Dissipation
3
Rating
Units
30
V
+12
V
75
A
61
A
300
A
89.2
W
2
W
PD@TA=25℃
Total Power Dissipation
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Rthj-c
Rthj-a
Parameter
Maximum Thermal Resistance, Junction-case
Maximum Thermal Resistance, Junction-ambient (PCB mount)
Data & specifications subject to change without notice
3
Value
Units
1.4
℃/W
62.5
℃/W
1
201202153
AP9410GH-HF
o
Electrical Characteristics@Tj=25 C(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
VGS=0V, ID=250uA
30
-
-
V
VGS=4.5V, ID=20A
-
-
6
mΩ
VGS=2.5V, ID=10A
-
-
8
mΩ
0.5
-
1.5
V
-
70
-
S
BVDSS
Drain-Source Breakdown Voltage
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
VDS=4V, ID=20A
2
Max. Units
gfs
Forward Transconductance
IDSS
Drain-Source Leakage Current
VDS=30V, VGS=0V
-
-
10
uA
IGSS
Gate-Source Leakage
VGS=+12V, VDS=0V
-
-
+100
nA
ID=20A
-
57
90
nC
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=24V
-
8
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=4.5V
-
24
-
nC
2
td(on)
Turn-on Delay Time
VDS=15V
-
12
-
ns
tr
Rise Time
ID=20A
-
52
-
ns
td(off)
Turn-off Delay Time
RG=1.8Ω
-
57
-
ns
tf
Fall Time
VGS=10V
-
10
-
ns
Ciss
Input Capacitance
VGS=0V
-
5400 8640
pF
Coss
Output Capacitance
VDS=25V
-
620
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
365
-
pF
Min.
Typ.
IS=20A, VGS=0V
-
-
1.2
V
Source-Drain Diode
Symbol
VSD
Parameter
Forward On Voltage
2
2
Test Conditions
Max. Units
trr
Reverse Recovery Time
IS=20A, VGS=0V,
-
39
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
42
-
nC
Notes:
1.Pulse width limited by max. junction temperature
2.Pulse test
3.Surface mounted on 1 in 2 copper pad of FR4 board
4.Package limitation current is 75A .
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP9410GH-HF
240
120
5.0V
4.5V
3.5V
ID , Drain Current (A)
200
o
T C =150 C
160
V G = 2.5V
120
80
40
V G =2.5V
80
60
40
20
0
0
0.0
2.0
4.0
6.0
8.0
10.0
0.0
1.0
2.0
V DS , Drain-to-Source Voltage (V)
3.0
4.0
5.0
6.0
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
2.0
11
I D =10A
I D =20A
V G =4.5V
T C =25 o C
9
Normalized RDS(ON)
RDS(ON) (mΩ)
5.0V
4.5V
3.5V
100
ID , Drain Current (A)
T C =25 o C
7
1.6
1.2
0.8
5
0.4
3
0
2
4
6
8
-50
10
100
150
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
1.6
30
1.2
Normalized VGS(th) (V)
40
IS(A)
50
T j , Junction Temperature ( C)
Fig 3. On-Resistance v.s. Gate Voltage
T j =150 o C
0
o
V GS , Gate-to-Source Voltage (V)
T j =25 o C
20
10
0.8
0.4
0
0.0
0
0.2
0.4
0.6
0.8
1
1.2
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.4
-50
0
50
100
150
T j , Junction Temperature ( o C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP9410GH-HF
f=1.0MHz
8000
I D =20A
V DS =15V
V DS =18V
V DS =24V
6
6000
C iss
C (pF)
VGS , Gate to Source Voltage (V)
8
4
4000
2
2000
C oss
C rss
0
0
0
20
40
60
80
100
1
5
9
13
17
21
25
29
Q G , Total Gate Charge (nC)
V DS ,Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
Operation in this
area limited by
RDS(ON)
100us
ID (A)
100
1ms
10
10ms
100ms
DC
T C =25 o C
Single Pulse
Normalized Thermal Response (Rthjc)
1000
Duty factor = 0.5
0.2
0.1
0.1
0.05
PDM
t
0.02
T
0.01
Duty Factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
1
0.1
1
10
100
0.00001
0.0001
0.001
0.01
0.1
1
10
V DS ,Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
4.5V
QGS
QGD
10%
VGS
td(on) tr
td(off) tf
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
4