Preliminary Datasheet Low-Power Off-line PSR LED Controller AP1686 General Description Features The AP1686 is a high performance AC/DC power supply controller for LED lighting application. The device uses Pulse Frequency Modulation (PFM) method to build discontinuous conduction mode (DCM) flyback power supplies. • • • • • • • The AP1686 provides accurate constant voltage, constant current (CV/CC) regulation without requiring an opto-coupler and the secondary control circuitry. It also eliminates the need of loop compensation circuitry while maintaining good stability. The AP1686 can achieve excellent regulation and high average efficiency, yet meets no-load consumption less than 30mW. Primary Side Control for Tight Constant Current and Constant Voltage 30mW No-load Input Power Bipolar Junction Transistor (BJT) Driving Open Circuit Protection Over Voltage Protection Short Circuit Protection SOT-23-6 Package Applications • LED Driver It also has an adjustable built-in line compensation function to achieve tight CC. The AP1686 is available in SOT-23-6 package. SOT-23-6 Figure 1. Package Type of AP1686 Nov. 2012 Rev. 1.1 BCD Semiconductor Manufacturing Limited 1 Preliminary Datasheet Low-Power Off-line PSR LED Controller AP1686 Pin Configuration K6 Package (SOT-23-6) Pin 1 Mark 1 6 2 5 3 4 Figure 2. Pin Configuration of AP1686 (Top View) Pin Description Pin Number Pin Name 1 OUT 2, 5 GND 3 VCC 4 CS 6 FB Nov. 2012 Function The OUT pin is used to turn on and turn off the power switch. When turning on the power switch, the OUT pin will output 30mA source current to support the base current of the power BJT. When turning off the power switch, the resistance between the OUT and GND will become to 5Ω The GND pin is the ground of the IC. When the power BJT is turned off, a fast reverse sinking current to the gate of BJT will flow out from this pin. Attention should be paid to in the PCB layout The VCC pin supplies the power for the IC. In order to get the correct operation of the IC, a capacitor with low ESR should be placed as close as possible to the VCC pin The CS is the current sense pin of the IC. The IC will turn off the power BJT according to the voltage on the CS pin. When the power BJT is on, a current is output from the CS pin which is proportional to the line voltage to realize the function of line compensation The CV and CC regulation are realized based on the voltage sampling of this pin Rev. 1.1 BCD Semiconductor Manufacturing Limited 2 Preliminary Datasheet Low-Power Off-line PSR LED Controller AP1686 Functional Block Diagram VCC 3 UVLO FB OVP & OCKP 6 PRO Regulator & Bias UVLO 0.1V COMP Tonsec Detector PFM TONS Pro VFB Constant Voltage Control EA PFM R Q CV_ctrl Driver 1 OUT CC_ctrl S Line Compensation VREF1 Shutdown Peak Current Control & LEB Pre_Shutdown VREF2 CS 4 TONS Constant Current Control R Q CC_ctrl 2,5 GND S Figure 3. Functional Block Diagram of AP1686 Nov. 2012 Rev. 1.1 BCD Semiconductor Manufacturing Limited 3 Preliminary Datasheet Low-Power Off-line PSR LED Controller AP1686 Ordering Information AP1686 - Circuit Type G1: Green Package K6: SOT-23-6 TR: Tape & Reel Package Temperature Range SOT-23-6 -40 to 85°C Part Number AP1686K6TR-G1 Marking ID GBQ Packing Type Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. Absolute Maximum Ratings (Note 1) Parameter Supply Voltage CS to GND Voltage FB Input Voltage Source Current at OUT Pin Operating Junction Temperature Storage Temperature Lead Temperature (Soldering, 10 sec) Thermal Resistance (Junction to Ambient) ESD (Human Body Model) Symbol Value Unit VCC ISOURCE TJ TSTG -0.3 to 30 -0.3 to 7 -40 to 7.5 Internally Limited 150 -65 to 150 V V V A ºC ºC TLEAD 300 ºC θJA 200 ºC/W 2000 V VFB Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Nov. 2012 Rev. 1.1 BCD Semiconductor Manufacturing Limited 4 Preliminary Datasheet Low-Power Off-line PSR LED Controller AP1686 Electrical Characteristics VCC =15V, TA=25°C, unless otherwise specified. Parameter Symbol Conditions UVLO SECTION Startup Threshold VTH (ST) Minimal Operating Voltage VOPR(MIN) STANDBY CURRENT SECTION Startup Current IST Operating Current ICC(OPR) DRIVE OUTPUT SECTION Sink ISINK Output Current Source ISOURCE CURRENT SENSE SECTION Current Sense Threshold VCS Voltage ΔVcs, eq Equivalent Current Sense Vcs, eq Voltage Accuracy (Note 2) Leading Edge Blanking tLEB FEEDBACK INPUT SECTION Input Resistance of FB Pin RFB Feedback Threshold VFB LINE COMPENSATION SECTION Line Compensation gm Transconductance (Note 2) PROTECTION SECTION Over Voltage Protection VFB(OVP) Maximum On Time of tonp Primary Side (MAX) VCC=VTH (ST)-1V, Before startup Static current Apply 1V @OUT pin The minimum power switch turn on time VFB=4V Min Typ Max Unit 13 3 15.5 3.5 18 4.5 V V 0 0.2 0.6 μA 250 400 600 200 24 300 30 500 45 mA mA 440 500 550 mV 4 % 300 475 720 ns 1 3.7 1.6 3.974 2 4.21 MΩ V 1.14 1.43 1.72 μS 6.5 7.5 8.5 V 11 18 50 μs Note 2: The output current is given by I OUT = Vcs , eq × Np Rcs Ns Nov. 2012 Rev. 1.1 BCD Semiconductor Manufacturing Limited 5 Preliminary Datasheet Low-Power Off-line PSR LED Controller AP1686 Typical Performance Characteristics 40 800 35 Source Current (mA) Operating Current (μA) 700 600 500 400 300 30 25 200 100 10 15 20 25 20 10 30 15 Figure 4. Operating Current vs. Supply Voltage 25 30 Figure 5. Source Current vs. Supply Voltage 500 5.0 4.5 Operating Current (μA) Minimal Operating Voltage (V) 20 Supply Voltage (V) Supply Voltage (V) 4.0 3.5 3.0 450 400 350 2.5 2.0 -40 -20 0 20 40 60 80 100 120 300 -40 140 0 20 40 60 80 100 120 140 o Ambient Temperature ( C) o Ambient Temperature ( C) Figure 7. Operating Current vs. Ambient Temperature Figure 6. Minimal Operating Voltage vs. Ambient Temperature Nov. 2012 -20 Rev. 1.1 BCD Semiconductor Manufacturing Limited 6 Preliminary Datasheet Low-Power Off-line PSR LED Controller AP1686 3.0 18 2.5 17 Start-up Voltage (V) Start-up Current (μA) Typical Performance Characteristics (Continued) 2.0 1.5 1.0 16 15 14 0.5 0.0 -40 -20 0 20 40 60 80 100 120 13 -40 140 -20 0 o 20 40 60 80 100 120 140 o Ambient Temperature ( C) Ambient Temperature ( C) Figure 8. Start-up Current vs. Ambient Temperature Figure 9. Start-up Voltage vs. Ambient Temperature 50 2.00 1.75 Source Current (mA) FB Input Resistance (MΩ) 45 1.50 40 35 30 25 20 1.25 15 1.00 -40 -20 0 20 40 60 80 100 120 10 -40 140 o 0 20 40 60 80 100 120 140 o Ambient Temperature ( C) Ambient Temperature ( C) Figure 11. Source Current vs. Ambient Temperature Figure 10. FB Input Resistance vs. Ambient Temperature Nov. 2012 -20 Rev. 1.1 BCD Semiconductor Manufacturing Limited 7 Preliminary Datasheet Low-Power Off-line PSR LED Controller AP1686 Typical Performance Characteristics (Continued) 40 Primary Side Maximum On Time (μs) Current Sense Voltage (mV) 600 550 500 450 400 350 30 20 10 0 -40 300 -40 -20 0 20 40 60 80 100 120 -20 0 20 40 60 80 100 120 140 140 o Ambient Temperature ( C) o Ambient Temperature ( C) Figure 13. Primary Side Maximum On Time vs. Ambient Temperature Figure 12. Current Sense Voltage vs. Ambient Temperature 800 750 700 LEB (ns) 650 600 550 500 450 400 350 300 -40 -20 0 20 40 60 80 100 120 140 o Ambient Temperature ( C) Figure 14. LEB vs. Ambient Temperature Nov. 2012 Rev. 1.1 BCD Semiconductor Manufacturing Limited 8 Preliminary Datasheet Low-Power Off-line PSR LED Controller AP1686 Typical Application D2 T1 + C1 R1 + C2 VO+ + D1 Np Ns C4 R10 VO- R2 3 VCC 4 CS 1 OUT Q1 Na R6 AP1686 6 FB GND R7 2,5 RLINE Rs Figure 15. Typical LED Driver Application Nov. 2012 Rev. 1.1 BCD Semiconductor Manufacturing Limited 9 Preliminary Datasheet Low-Power Off-line PSR LED Controller AP1686 Mechanical Dimensions SOT-23-6 Unit: mm(inch) 0° 2.820(0.111) 8° 3.020(0.119) 0.300(0.012) 0.400(0.016) 5 4 2 3 0.300(0.012) 0.600(0.024) 1.500(0.059) 1.700(0.067) 2.650(0.104) 2.950(0.116) 6 0.200(0.008) Pin 1 Mark 1 0.700(0.028)REF 0.950(0.037)TYP 0.000(0.000) 0.150(0.006) 1.800(0.071) 2.000(0.079) 0.100(0.004) 0.200(0.008) 0.900(0.035) 1.450(0.057) MAX 1.300(0.051) Nov. 2012 Rev. 1.1 BCD Semiconductor Manufacturing Limited 10 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com IMPORTANT NOTICE IMPORTANT NOTICE BCD Semiconductor BCD Semiconductor Manufacturing Manufacturing Limited Limited reserves reserves the the right right to to make make changes changes without without further further notice notice to to any any products products or or specifispecifications herein. cations herein. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not assume assume any any responsibility responsibility for for use use of of any any its its products products for for any any particular purpose, particular purpose, nor nor does does BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited assume assume any any liability liability arising arising out out of of the the application application or or use use of any of any its its products products or or circuits. circuits. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not convey convey any any license license under under its its patent patent rights rights or or other rights other rights nor nor the the rights rights of of others. others. MAIN SITE SITE MAIN - Headquarters BCD Semiconductor Manufacturing Limited BCD Semiconductor Manufacturing Limited - Wafer Fab No. 1600, Zi Xing Road, Shanghai ZiZhu Science-basedLimited Industrial Park, 200241, China Shanghai SIM-BCD Semiconductor Manufacturing Tel: Fax: +86-21-24162277 800,+86-21-24162266, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 REGIONAL SALES OFFICE Shenzhen OfficeSALES OFFICE REGIONAL - Wafer FabSemiconductor Manufacturing Limited BCD Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. - IC Design Group 800 Yi Shan Road, Shanghai 200233, China Corporation Advanced Analog Circuits (Shanghai) Tel: +86-21-6485 1491,YiFax: 0008200233, China 8F, Zone B, 900, Shan+86-21-5450 Road, Shanghai Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 Taiwan Office Shanghai Semiconductor Manufacturing Co., Ltd., Shenzhen Office BCD Taiwan Semiconductor Shenzhen SIM-BCD Office Office (Taiwan) Company Limited Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan Shenzhen, 4F, 298-1, Guang Road,(Taiwan) Nei-Hu District, Taipei, Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.District, Shenzhen Office BCDRui Semiconductor Company Limited China Taiwan Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Tel: +86-755-8826 Tel: +886-2-2656 2808 Room E, 5F, Noble 7951 Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Taiwan Fax: +86-755-88267951 7865 Fax: +886-2-2656 28062808 Tel: +86-755-8826 Tel: +886-2-2656 Fax: +86-755-8826 7865 Fax: +886-2-2656 2806 USA Office BCD Office Semiconductor Corp. USA 30920Semiconductor Huntwood Ave.Corporation Hayward, BCD CA 94544, USA Ave. Hayward, 30920 Huntwood Tel :94544, +1-510-324-2988 CA U.S.A Fax:: +1-510-324-2988 +1-510-324-2788 Tel Fax: +1-510-324-2788