AP.10H.01 Specification Part No. AP.10H.01 Product Name 10mm SMT 25dB Active GPS Patch Antenna With Front End Saw Filter Feature Unique SMT GPS active patch Wide Input Voltage 1.8V to 3.3V Ultra low power consumption RoHS compliant SPE-11-8-101/C/SS | page 1 of 11 1. Introduction The AP.10H.01 two stage 25dB active GPS patch antenna is the smallest SMT GPS high performance embedded antenna currently available in the world. Using extremely sensitive high dielectric constant powder formulation and tight process control the 10mm x 10mm x 4mm patch antenna is accurately tuned to have its frequency band right at 1575.42MHz for GPS systems. A patented SMT structure gives high reliability in integration. With an ultra low power consumption two stage LNA with Saw Filter , this small active patch has the performance of an ordinary active patch, but at only a quarter of the size. This product is suited to small form factor mobile devices such as GPS Smartphones, Personal Location, Medical devices, Telematic devices and Automotive navigation and tracking. Custom gain, connector and cable versions are available. The AP.10H consists of 2 functional blocks – the LNA and also the patch antenna. ANTENNA SAW Filter LNA*2 SPE-11-8-101/C/SS | page 2 of 11 2. Specification 2.1 Patch Antenna Parameter Specification Frequency 1575.42 ± 1.023MHz Gain Typ -10dBic @ Zenith Impedance 50Ω Polarization RHCP Axial Ratio Max 4.0dB @ Zenith Dimension 10mm x 10mm x 4mm (add 7.3mm depth for vertical PCB) 2.2 LNA Parameter Specification Frequency Outer Band Attenuation 1575.42 ± 1.023MHz F0=1575.42MHz F0±30MHz 5dB min. F0±50MHz 20dB min. F0±100MHz Output Impedance 50Ω Output VSWR 2.0 Max Min. 8dBm Typ. 11dBm Pout at 1dB Gain Compression point 25dB min. LNA Gain, Power Consumption and Noise Figure Voltage LNA Gain (Typ) Power Consumption(mA) Typ Noise Figure Typ Min. 1.8V 20dB 5mA 2.7dB Typ. 3.0V 25dB 10mA 2.5dB Max. 3.3V 25dB 23mA 1.8dB Input Voltage Min. 1.8V Typ. 3.0V Max. 3.3V 2.3 Connection Connection SMT via solder pads SPE-11-8-101/C/SS | page 3 of 11 3. LNA Gain and Out Band Rejection @3.0V 1 Active Ch/Trace 2 Response 3 Stimulus 4 Mkr/Analysis 5 Instr State Tr1 S21 60.00 Log Mag 10.00dB/ Ref -40.00dB (F2) >1 1.5754200 GHz 27.754 dB 50.00 40.00 1 30.00 20.00 3 10.00 0.000 2 -10.00 5 -20.00 1 7 -30.00 6 4 -40.00 1 Center 1.57542 GHz Cg1 Cg1 Cg1 Cg1 Cg1 Cg1 Cg1 Tr1 Tr1 Tr1 Tr1 Tr1 Tr1 Tr1 S21 S21 S21 S21 S21 S21 S21 >1 2 3 4 5 6 7 IFBW 70 kHz 1.5754200 1.6054200 1.5454200 1.6254200 1.5254200 1.6754200 1.4754200 GHz GHz GHz GHz GHz GHz GHz 27.754 - 2.2291 20.458 - 32.691 - 10.283 - 23.132 - 21.485 Span 400 MHz 19/20 Cor dB dB dB dB dB dB dB SPE-11-8-101/C/SS | page 4 of 11 4. LNA Noise Figure @3.0V Mkr1 1.5754 GHz 2.558 dB 27.557 dB 9.000 NFIG Scale/ 1.000 dB 1 -1.000 40.00 1 GAIN Scale/ 5.000 dB -10.00 Center 1.57542 GHz BW 4 MHz Tcold 296.50 K Avgs Off Points 11 Att 0/ - - dB Span 3.00 MHz Loss Off Corr 5. Total Specification (through Antenna, LNA) Parameter Specification Frequency 1575.42 ± 1.023MHz Gain @ 3.0V 15 ± 4dBic @ 90° Output Impedance 50Ω Polarization RHCP Output VSWR Max 2.0 Operation Temperature -40°C to + 85°C Storage Temperature -40°C to + 85°C Relative Humidity 40% to 95% Input Voltage Min. 1.8V, Typ. 3.0V, Max. 5.5V ESD Capability Direct Discharge: 4KV Min. SPE-11-8-101/C/SS | page 5 of 11 6. Radiation Patterns 6.1 XZ Plane 0 -8 -10 -15 -20 -25 -30 -35 90 270 -40 180 Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi) 1 AP.10H.01 XZ 1620.00 -9.20 / 42.00 -11.99 / 147.00 Avg. Gain(dBi) Source Polar. -10.24 RHCP Date 2010/4/29 SPE-11-8-101/C/SS | page 6 of 11 6.2 YZ Plane 0 -8 -10 -15 -20 -25 -30 -35 90 270 -40 180 Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi) 1 AP.10H.01 YZ 1620.00 -9.73 / 324.00 -19.18 / 222.00 Avg. Gain(dBi) Source Polar. -12.80 RHCP Date 2010/4/29 SPE-11-8-101/C/SS | page 7 of 11 6.3 XY Plane 0 -8 -10 -15 -20 -25 -30 -35 90 270 -40 180 Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi) Avg. Gain(dBi) Source Polar. Date 1 AP.10H.01 XZ 1620.00 -9.20 / 42.00 -11.99 / 147.00 -10.24 RHCP 2010/4/29 2 AP.10H.01 YZ 1620.00 -9.73 / 324.00 -19.18 / 222.00 -12.80 RHCP 2010/4/29 SPE-11-8-101/C/SS | page 8 of 11 ALL Initial Design Kiwi 2011/9/29 B F5 Add logo+P/N on the patch Kiwi 2011/11/9 C G3 Amend drawing content Sandy 2011/11/16 AP.10G.01 A 7. Technical Drawing A B w ALL Kiwi Initial Design 2011/11/9 AP.10H.01 Top View Side View iew PCB Footprint Bottom View sembly Back Side PCB Footprint Application Assembly Front Ground PCB Thickness 0.8mm Material NameP/N 10mmx4.2mm) AP.10G Ceramic 1 Patch (10mm x 10mm x 4.2mm) e Back Side Name Note: QTY P/NFinish Material Finish QTY 1.Soldered Area Clear 1 AP.10H Ceramic Clear 1 2.Solder Mask Area(Green) 2 Shielding Case Tin (SPTE) Tin Plated Tin1(SPTE)3.Clearance Tin PlatedArea1 3 PCB FR4 0.6t Green Name P/N 1 Patch (10mmx10mmx4.2mm) 2 Shielding Case 3 PCB AP.10H 4.Shielding Case Area FR41 0.6t Green 1 to be solder (Pad) Ground5.Area PCB Thickness 0.8mm NOTE: 1. Soldered area 2. Solder Mask Area (Green) 3. Clearance Area 4. Shielding Case Area 5. Area to be solder (Pad) Note: 1.Soldered Area Ceramic Clear 1 2.Solder Mask Area(Green) TW Design Centre This drawing and its inherent design concepts are property of3.Clearance Taoglas. Not to Area Tin Plated Tin (SPTE) 1 be copied or given to third parties without the written consent of Taoglas. 4.Shielding Case Area FR4 0.6t Green 1 5.Area to be solder (Pad) Material Finish QTY SPE-11-8-101/C/SS | TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to page 9 of 11 View A ALL Initial Design Kiwi B F5 Add logo+P/N on the patch Kiwi C G3 Amend drawing content Sandy A ALL 2011/9/29 Kiwi Initial Design 2011/11/9 2011/11/16 AP.10G.01 AP.10H.01 Top View m View 7.1 PCB Footprint B Side View w PCB Footprint n Assembly Back Side Bottom View iew Ground PCB Thickness 0.8mm Name P/N mmx10mmx4.2mm) AP.10H Material Case Finish Note: 1.Soldered Area 2.Solder Mask Area(Green) 3.Clearance Area 4.Shielding Case Area 5.Area to be solder (Pad) QTY Ceramic Clear 1 Tin (SPTE) Tin Plated 1 FR4 0.6t Green 1 PCB Footprint Application Assembly PCB Footprint Front Back Side TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to be copied or given to third parties without the written consent of Taoglas. sembly Back Side Ground PCB Thickness 0.8mm Name Patch (10mmx10mmx4.2mm) 2 Shielding Case PCB Ground PCB3 Thickness 0.8mm Material NameP/N 10mmx4.2mm) AP.10G Ceramic 1 Patch (10mm x 10mm x 4.2mm) e 1 Name 2 Shielding Case Tin (SPTE) 3 PCB FR4 0.6t P/N AP.10H Material Finish QTY Ceramic Clear 1 Tin (SPTE) Tin Plated 1 Green 1 FR4 0.6t Note: QTY P/NFinish Material Finish QTY 1.Soldered Area Clear 1 AP.10H Ceramic Clear 1 2.Solder Mask Area(Green) Tin Plated Tin1(SPTE)3.Clearance Tin PlatedArea1 4.Shielding Case Area FR41 0.6t Green 1 Green 5.Area to be solder (Pad) Note: 1.Soldered Area 2.Solder Mask Area(Gr 3.Clearance Area 4.Shielding Case Area 5.Area to be solder (Pa NOTE: 1. Soldered area TW D 2. Solder Mask Area (Green) This drawing and its inherent design concepts are property o be copied or given to third parties without the written conse 3. Clearance Area 4. Shielding Case Area 5. Area to be solder (Pad) TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to be copied or given to third parties without the written consent of Taoglas. SPE-11-8-101/C/SS | page 10 of 11 8.0 Packaging Packaged on Tape and Reel – 250 pieces per reel Each Reel is packaged – Inner Carton Outer Carton contains 5 Reels – 1250 pieces per Carton 8. Packaging Packaged on Tape and Reel 250 pieces per reel Each Reel is packaged Inner Carton Outer Carton contains 5 Reels 1250 pieces per Carton Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and SPE-11-8-101/C/SS product descriptions at any time without notice. Taoglas reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright © 2012, Taoglas Ltd. 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